Texas Instruments SimpleLink SWRS225D Manual
Texas Instruments SimpleLink SWRS225D Manual

Texas Instruments SimpleLink SWRS225D Manual

Wi-fi dual-band network processor module
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SimpleLink™ Wi-Fi CC3135MOD Dual-Band Network Processor Module

1 Features

Fully integrated and green/RoHS module includes
all required clocks, serial peripheral interface (SPI)
flash, and passives
®
Integrated Wi-Fi
and internet protocols
802.11a/b/g/n: 2.4 GHz and 5 GHz
FCC, IC/ISED, ETSI/CE, and MIC certified
FIPS 140-2 Level 1 validated IC inside
Rich set of IoT security features helps developers
protect data
Low-power modes for battery powered application
Coexistence with 2.4 GHz radios
Industrial temperature: –40°C to +85°C
Wi-Fi network processor
– Wi-Fi core:
802.11 a/b/g/n 2.4 GHz and 5 GHz
Modes:
– Access Point (AP)
– Station (STA)
®
– Wi-Fi Direct
GHz)
Security:
– WEP
– WPA
/ WPA2
– WPA2 Enterprise
– WPA3
Personal
– WPA3
Enterprise
– Internet and application protocols:
HTTPs server, mDNS, DNS-SD, DHCP
IPv4 and IPv6 TCP/IP stack
16 BSD sockets (fully secured TLS v1.2 and
SSL 3.0)
– Built-in power management subsystem:
Configurable low-power profiles (always on,
intermittently connected, tag)
Advanced low-power modes
Integrated DC/DC regulators
Application throughput
– UDP: 16 Mbps
– TCP: 13 Mbps
Multilayered Security
Features:
– Separate execution environments
– Networking security
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
subsystem:
(only supported on 2.4
PSK
SWRS225D – FEBRUARY 2019 – REVISED MAY 2021
– Device identity and key
– Hardware accelerator cryptographic engines
(AES, DES, SHA/MD5, CRC)
– File system security (encryption, authentication,
access control)
– Initial secure programming
– Software tamper detection
– Secure boot
– Certificate signing request (CSR)
– Unique per device key pair
Recovery mechanism – ability to recover to factory
defaults
Power-Management Subsystem:
– Integrated DC/DC converters support a wide
range of supply voltage:
Single wide-voltage supply, VBAT: 2.3 V to
3.6 V
– Advanced low-power modes:
Shutdown: 1 µA, hibernate: 5.5 µA
Low-power deep sleep (LPDS): 115 µA
Idle connected (MCU in LPDS): 710 µA
RX traffic (MCU active): 53 mA
TX traffic (MCU active): 223 mA
Wi-Fi TX power
– 2.4 GHz: 16 dBm at 1 DSSS
– 5 GHz: 15.1 dBm at 6 OFDM
Wi-Fi RX sensitivity
– 2.4 GHz: –94.5 dBm at 1 DSSS
– 5 GHz: –89 dBm at 6 OFDM
Additional integrated components on module
– 40.0 MHz crystal with internal oscillator
– 32.768 kHz crystal (RTC)
– 32 Mbit SPI Serial Flash
– RF filters, diplexer, and passive components
QFM package
– 1.27-mm pitch, 63-pin, 20.5-mm × 17.5-mm
QFM package for easy assembly and low-cost
PCB design
Module supports
SimpleLink Developers
Ecosystem
CC3135MOD

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Summary of Contents for Texas Instruments SimpleLink SWRS225D

  • Page 1: Features

    CC3135MOD SWRS225D – FEBRUARY 2019 – REVISED MAY 2021 SimpleLink™ Wi-Fi CC3135MOD Dual-Band Network Processor Module – Device identity and key 1 Features – Hardware accelerator cryptographic engines • Fully integrated and green/RoHS module includes (AES, DES, SHA/MD5, CRC) all required clocks, serial peripheral interface (SPI) –...
  • Page 2: Applications

    Sub-1 GHz, and host MCUs. For more information, visit www.ti.com/SimpleLink. Table 3-1. Module Information PART NUMBER PACKAGE BODY SIZE CC3135MODRNMMOBR QFM (63) 20.5 mm × 17.5 mm For more information, see Section Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 3: Functional Block Diagrams

    32.768 kHz UART WRF_BGN 5 GHz nReset SPDT Aband WRF_A 2.3 V to 3.6 V VBAT 32-Mbit SFlash External SPI Programming Figure 4-1. CC3135MOD Module Functional Block Diagram Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 4 SimpleLink Driver APIs Host Interface Network Apps WLAN Security and Management TCP/IP Stack WLAN MAC and PHY Copyright © 2017, Texas Instruments Incorporated Figure 4-3. CC3135 Embedded Software Overview Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 5: Table Of Contents

    8.15 Timing and Switching Characteristics..... 13 Mechanical, Packaging, and Orderable 8.16 External Interfaces..........Information..............9 Detailed Description............33 13.1 Mechanical, Land, and Solder Paste Drawings..9.1 Overview..............13.2 Package Option Addendum........Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 6: Revision History

    Added "WPA3 personal" to list of Wi-Fi security features in Table 9-1 ............• Added footnote to Section 9.2.2 ........................• Added "WPA3 personal and enterprise" to Table 9-1 ..................Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 7: Device Comparison

    Secure key storage Enhanced Application Level Software tamper detection Software tamper detection Security Cloning protection Cloning protection Initial secure programming Initial secure programming FIPS 140-2 Level 1 Certification Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 8: Related Products

    Offers several Internet-on-a chip solutions, which address the need of battery Family operated, security enabled products. Texas Instruments offers a single chip wireless microcontroller and a wireless network processor which can be paired with any MCU, to allow developers to design new Wi-Fi products, or upgrade existing products with Wi-Fi capabilities.
  • Page 9: Terminal Configuration And Functions

    HOST_INTR DIO13 DIO14 HOST_SPI_nCS HOST_SPI_DOUT HOST_SPI_DIN HOST_SPI_CLK nHIB DIO10 Figure 7-1 shows the approximate location of pins on the module. Figure 7-1. CC3135MOD Pin Diagram Bottom View Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 10: Pin Attributes

    Hi-Z Digital input or output FLASH _SPI_MISO Hi-Z External Serial Flash Programming: SPI data out External Serial Flash Programming: SPI chip FLASH _SPI_CS Hi-Z select (active low) Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 11 – – No Connect A 100 kΩ pull down resistor is internally tied to SOP0 Hi-Z – this SOP pin. SOP[2:0] used for factory restore. Section 9.5. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 12 Test signal; connect to an external test point. UART1_nCTS Hi-Z UART interface to host (clear to send) TEST_62 Hi-Z Test signal; connect to an external test point. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 13 Hi-Z Digital input or output DIO9 Hi-Z – Digital input or output I = input, O = output, RF = radio frequency, I/O = bidirectional Output Only Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 14: Signal Descriptions

    DIO30 DIO3 DIO4 DIO5 DIO8 DIO9 DIO10 DIO12 DIO13 DIO23 DIO24 DIO28 DIO29 Hostless Mode Hostless mode inputs and outputs DIO25 DIO30 DIO3 DIO4 DIO5 DIO8 DIO9 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 15 During hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode to disable TCXO. Because of the SOP functionality, the pin must be used as an output only. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback...
  • Page 16: Connections For Unused Pins

    VBAT_RESET to the main module power supply (VBAT1 and VBAT2). Due to the internal pull-up resistor, a leakage current of 3.3 V / 100 kΩ is expected. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 17: Specifications

    The minimum voltage specified includes the ripple on the supply voltage and all other transient dips. The brownout condition is 2.1 V, and care must be taken when operating at the minimum specified voltage. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback...
  • Page 18: Current Consumption Summary: 2.4 Ghz Rf Band

    There are two additional calibration modes that may be used to reduced or completely eliminate the calibration event. For further ® details, see CC31XX, CC32XX SimpleLink™ Wi-Fi and IoT Network Processor Programmer's Guide. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 19: Tx Power Control For 2.4 Ghz Band

    Back-off rates are grouped into 11b rates, high modulation rates (MCS7, 54 OFDM and 48 OFDM), and lower modulation rates (all other rates). Please note that there will be a delta between the CC3235MODx module and CC3235x IC's TX power levels. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links:...
  • Page 20 SWRS225D – FEBRUARY 2019 – REVISED MAY 2021 Figure 8-2. TX Power and IBAT vs TX Power Level Settings (6 OFDM) Figure 8-3. TX Power and IBAT vs TX Power Level Settings (54 OFDM) Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 21: Tx Power Control For 5 Ghz Band

    The range of losses if from 0 dBm to 7.75 dBm in 0.125 dBm increments. The antenna gain has a range of -2 dBi to 5.75 dBi in 0.125 dBi increments. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback...
  • Page 22: Brownout And Blackout Conditions

    Hibernate module, which remains on. The current in this state can reach approximately 400 µA. The blackout condition is equivalent to a hardware reset event in which all states within the device are lost. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 23: Electrical Characteristics For Dio Pins

    WLAN radio and reduces any potential degradation of RF sensitivity and performance. The default drive strength setting is 6 mA. The nRESET pin must be held below 0.6 V for the device to register a reset. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links:...
  • Page 24: Wlan Receiver Characteristics

    9 OFDM 18 OFDM Sensitivity (10% PER for 11g/11n rates) 36 OFDM -78.5 54 OFDM MCS7 (GF) Maximum input level 802.11a Sensitivity for mixed mode is 1-dB worse. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 25: Wlan Transmitter Characteristics

    FCC band covers U-NII-1, U-NII-2A, U-NII-2C, and U-NII-3 20-MHz BW modulations. Europe bands 1, 2 and 3, 20-MHz BW modulations are supported. For Japan, W52, W53 and W56, 20-MHz BW modulations are supported. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links:...
  • Page 26: Ble And Wlan Coexistence Requirements

    JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70°C is assumed. m/s = meters per second. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 27: Timing And Switching Characteristics

    A high-to-low reset pulse (on pin 35) of at least 200-ms duration To ensure a proper reset sequence, the user must call the sl_stop function prior to toggling the reset. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links:...
  • Page 28 If temperature changes by more than 20°C, initialization time from HIB can increase by 200 ms due to radio calibration. Ensure that the nHIB pulse width is kept above the minimum requirement under all conditions (such as power up, MCU reset, and so on). Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 29: External Interfaces

    Active-low signal that commands the CC3135MOD module to enter hibernate mode (lowest power state) Figure 8-9 shows the host SPI timing diagram. MISO MOSI Figure 8-9. Host SPI Timing Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 30 SimpleLink device. nRTS nRTS nCTS nCTS HOST MCU CC3135MOD UART UART HOST_INTR(IRQ) HOST_INTR(IRQ) Figure 8-10. Typical 5-Wire UART Topology Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 31 • Maximum baud rate • RX character interrupt latency and low-level driver jitter buffer • Time consumed by the user's application Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 32 Flash interface (pins 13, 14, 15, and 17). Note that during normal operation, the external Flash interface should remain unconnected. For timing details, see the MX25R3235F data sheet. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 33: Detailed Description

    PHY headers, and provides the option to select the working channel, rate, and transmitted power. The receiver mode works together with the filtering options. Supported from Service Pack v4.5.0.11-3.1.0.5-3.1.0.25. Limited to STA mode only. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links:...
  • Page 34 Cross layer ARP, ICMPv4, IGMP, ICMPv6, MLD, NDP UDP, TCP Transport SSLv3.0/TLSv1.0/TLSv1.1/TLSv1.2 Ping HTTP/HTTPS web server Network applications and mDNS utilities DNS-SD DHCP server Host interface UART/SPI Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 35 Enterprise standards – EAP Fast – EAP PEAPv0 MSCHAPv2 – EAP PEAPv0 TLS – EAP PEAPv1 TLS EAP LS – EAP TTLS TLS – EAP TTLS MSCHAPv2 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 36 A cryptographic function within a chip security system is necessary to maintain the confidentiality and integrity of the information that is being processed. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 37: Power-Management Subsystem

    Shutdown mode is the lowest power-mode system-wise. All device logics are off, including the realtime clock (RTC). The typical battery drain in this mode is 1 µA. The wake-up time in this mode is longer than hibernate at approximately 1.1 seconds. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links:...
  • Page 38: Restoring Factory Default Configuration

    Set counter allows setting a specific value to a counter • Timer control • Set GPIO allows GPIO output from the device using the internal networking core • Enter Hibernate state Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 39: Device Certification And Qualification

    This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: • This device may not cause harmful interference. • This device must accept any interference received, including interference that may cause undesired operation of the device. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 40 The host system does not contain a wireless wide area network (WWAN) device. This device operates in the W52 and W53 bands and is for indoor use only (except communication to high power radio). Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 41: Module Markings

    FCC ID: single modular FCC grant ID 451I-CC3135MOD IC: single modular IC grant ID MIC compliance mark MIC ID: modular MIC grant ID R 201-190034 CE compliance mark Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 42: End Product Labeling

    RF module in the user’s manual of the end product which integrates this module. The end user manual must include all required regulatory information/warning as shown in this manual. For more information, refer to the CC3135MOD OEM Integrator's Guide. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 43: Applications, Implementation, And Layout

    Coex switch is required and only a single GPIO from the BLE device to the CC3135 device is required. Dual-band Antenna BLE Ant. RF_ABG WLAN CC3135MOD CCxxxx CC_COEX_BLE_IN Coex IO Figure 10-1. Dual-Antenna Coexistence Mode Block Diagram Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 44 When selecting Autoselect via the API, a reset is required in order for the CC3135MOD device to determine the best antenna for use. Refer to the Uniflash with Image Creator User Guidefor more information. The recommended Antenna switch is the Richwave RTC6608OSP. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 45 This is the reference schematic and not an actual board design. For a full operational reference design, see the CC3135MOD Hardware Design Files. Figure 10-3. CC3135MOD Module Reference Schematic Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 46 RES, 10 k, 5%, 0.063 W, AEC-Q200 Grade 0, 0402 CC3135MOD Texas Instruments CC3135MODRNMMOBR SimpleLink™ Certified Wi-Fi® Dual-Band Network Processor Internet-of-Things Module Solution for MCU Applications, MOB0063A Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 47: Pcb Layout Guidelines

    RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the PCB product in consideration of the product enclosure material and proximity. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback...
  • Page 48 A poor layout can cause low-output power, EVM degradation, sensitivity degradation, and mask violations. Figure 10-4 shows the RF placement and routing of the CC3135MOD module. Figure 10-4. RF Section Layout Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 49 For optimal RF performance, ensure the copper cut out on the top layer under the RF-BG pin, (pin 31), is as shown in Figure 10-5. Figure 10-5. Top Layer Copper Pull Back on RF Pads Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 50 Table 10-3. Recommended Components CHOICE PART NUMBER MANUFACTURER NOTES Can be placed at the edge of the PCB using the M830520 Ethertronics least amount of PCB area. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 51 GND and via stitching. Figure 10-6. Coplanar Waveguide (Cross Section) Figure 10-7. CPW With GND and Via Stitching (Top View) Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links:...
  • Page 52 Er (FR-4 substrate) Table 10-5. Recommended PCB Values for 4-Layer Board (L1 to L2 = 16 mils) PARAMETER VALUE UNITS mils mils mils Er (FR-4 substrate) Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 53: Environmental Requirements And Smt Specifications

    Solder paste deposition using a stencil-printing process involves the transfer of the solder paste through pre- defined apertures with the application of pressure. Stencil parameters such as aperture area ratio and the Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback...
  • Page 54: Baking Conditions

    • Humidity indicator cards read > 30% • Temp < 30°C, humidity < 70% RH, over 96 hours Baking condition: 90°C, 12–24 hours Baking times: 1 time Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 55: Soldering And Reflow Condition

    This coating can lead to localized stress on the WCSP solder connections inside the module and impact the device reliability. Use caution during the module assembly process to the final PCB to avoid the presence of foreign material inside the module. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links:...
  • Page 56: Device And Documentation Support

    Wi-Fi to any microcontroller (MCU). This Internet-on-a chip solution contains all you need to easily create IoT solutions – Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 57 CC3135MOD www.ti.com SWRS225D – FEBRUARY 2019 – REVISED MAY 2021 security, quick connection, cloud support and more. For more information on CC31xx devices, visit http://www.ti.com/simplelinkwifi. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 58: Firmware Updates

    ® Wi-Fi Internet-on-a chip™ devices from Texas Instruments offers a wide range of built-in security Solution Built-In Security Features features to help developers address a variety of security needs, which is achieved without any processing burden on the main microcontroller (MCU).
  • Page 59: Trademarks

    All trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
  • Page 60: Export Control Notice

    Department of Commerce and other competent Government authorities to the extent required by those laws. 12.8 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 61: Mechanical, Packaging, And Orderable Information

    3. Solder paste must be the same as the pin for all peripheral pads. For ground pins, make the solder paste 20% smaller than the pad. 13.2 Package Option Addendum The CC3135MOD is only offered in a 750-unit reel. Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 62 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links:...
  • Page 63 CC3135MOD www.ti.com SWRS225D – FEBRUARY 2019 – REVISED MAY 2021 13.2.2 Tape and Reel Information Surface resistance Vendor No. Spec Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: CC3135MOD...
  • Page 64 CC3135MOD www.ti.com SWRS225D – FEBRUARY 2019 – REVISED MAY 2021 13.2.2.1 Tape Specifications Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: CC3135MOD...
  • Page 65 PACKAGE OUTLINE MOB0063A QFM - 2.4 mm max height SCALE 0.650 QUAD FLAT MODULE 17.75 17.25 PIN 1 INDEX AREA 20.75 20.25 2X (0.45) 2X (0.38) 2.40 2.03 0.88 0.72 2X 12.7 (0.3) TYP 20X 1.27 30X 1.27 (0.32) (0.3) PADS 1,16,28 &...
  • Page 66 ALL AROUND OPENING METAL UNDER SOLDER MASK SIGNAL PADS DETAIL 4221462/D 06/2019 NOTES: (continued) 3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). www.ti.com...
  • Page 67 EXAMPLE STENCIL DESIGN MOB0063A QFM - 2.4 mm max height QUAD FLAT MODULE 54X ( 0.81) (R0.05) SOLDER MASK EDGE, TYP SOLDER MASK EDGE SEE DETAILS (3) TYP 2X (19.1) (1.5) TYP (1.5) TYP (3) TYP (1.27) TYP 2X (16.1) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PADS PRINTED SOLDER COVERAGE BY AREA...
  • Page 68 TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2021, Texas Instruments Incorporated...
  • Page 69 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments CC3135MODRNMMOBR...

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