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Tool Description
Phillips Screwdriver
Diagonal Pliers
Hexagonal Socket Screwdriver
Plat Screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Using a P2 Phillips Screwdriver, remove all 12 screws securing top cover to chassis. Remove Cover. (see 3.2.1)
2.
Using a P2 Phillips Screwdriver, remove 9 screws to chassis, remove Air baffle (3pcs). (see 3.2.2)
3.
Using Diagonal Plier to cut 1 cable tie on chassis and Disconnect Power supply and main board cable connections (3 cables
connections in all), remove Power supply and insulator (1pcs). (see 3.2.3)
4.
Using a P2 Phillips Screwdriver, remove 8 screws to chassis, remove PoE board and insulator (1pcs), remove SFP heat sink,
remove cable tie. (see 3.2.4)
5.
Disconnect Fan and main board 2 cables connection and Using a P2 Phillips Screwdriver, remove 4 screws to chassis, remove
Fan(2pcs) (see 3.2.5)
6.
Using a P2 Phillips Screwdriver, remove 7 screws to chassis, using a #5 Hexagonal socket Screwdriver, remove 7 standoffs to
chassis, remove main board (1pcs). (see 3.2.6)
7.
Using Diagonal Plier to cut 1 cable tie on rear plane, Using Flat Screwdriver push the hooks on the sides of AC-inlet Socket, and
Using a P2 Phillips Screwdriver, remove 1 screws to chassis and Disconnect ac-inlet cable (see 3.2.7)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
3.2.1
MF877-00
Template Revision A
HPE instructions for this template are available at
Tool Size (if
applicable)
P2
5"
#5
4mm
MF877-01
Page 2
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