HP t505 Flexible Thin Client Product End-Of-Life Disassembly Instructions page 2

Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Phillips Slotted Screwdriver
Phillips Cross Screwdriver
Diagonal cutting plier (for Adaptor and fan wiring only)
Saw (for Adaptor only)
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
[System]
1. Remove stand
2. Remove top cover
3. Remove plastic bezels
4. Remove system board
5. Remove components of mother board
[Keyboard]
1. Remove cover
2. Remove bezel on cover
3. Remove LED board
4. Remove rubber sheet
5. Remove flexible PWB
6. Remove plastic standard of LED board
7. Remove metal sheet
8. Remove cable
[Mouse]
1. Remove cover
2. Remove PWB
3. Remove cable
4. Remove wheel
[Adaptor]
1. Remove enclosure
2. Remove external cable
3. Remove metal shielding
4. Remove internal wires
5. Remove heatsinks
6. Remove capacitor (>2.5 cm in height, requiring selective treatment)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations)
EL-MF877-00
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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Tool Size (if
applicable)
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