Summary of Contents for FE CC-M
- Page 1 Instruction Manual COMPACT CONTROLLER M (CC-M) TYPE: PDA3 Application Manual INP-TN512878-E...
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Page 2: Introduction
INTRODUCTION We thank you very much for purchasing Fuji Electric’s compact controller M (CC-M). • Carefully read the instruction manual and sufficiently be familiar with its contents before installing, operating and maintaining the compact controller M. Improper handling may cause accidents or injuries. -
Page 3: Safety Precautions
SAFETY PRECAUTIONS Before use, carefully read the safety precautions for correct operation. • The precautions concern important matters related to safety. Be sure to observe them. The safety matters are ranked to “DANGER”, “CAUTION”. Indications and meanings are as follows. If the handling is wrong, dangerous situations might occur, causing death or serious injury. - Page 4 • Over-temperature Protection Any control system should be designed with prior consideration that any part of the system has potential to fail. In case of temperature controlling, a continuance of heating on should be regarded as the most dangerous state. The followings are the most probable causes of inducing continuance of heating on: 1) The failure of the controller with heating output constantly on 2) The disengagement of the temperature sensor out from the system...
- Page 5 • Do not use any instrument which is found damaged or deformed when unpacked. Otherwise, fire, maloperation or fault may occur. • Make sure the product is as specified before use. Otherwise, the product may break or be troubled. • Do not drop, tip over nor give a shock to the product. Otherwise, the product may break or suffer from a fault.
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Page 6: Table Of Contents
INTRODUCTION·····················································································································i SAFETY PRECAUTIONS·······································································································ii CONTENTS····························································································································· v FOREWORD ·························································································································vii 1. GENERAL PRECAUTIONS ON COMPACT CONTROLLER (CC-M)·························· 1 Precautions for use of wafers ·································································································1 Correspondence of external signals and internal signals························································1 Contents of internal arithmetic operations ·············································································2 Modes and output signals of controller ··················································································3 Control output bumpless changeover ·····················································································4... - Page 7 How to use ramp output wafer····························································································· 14 4.3.1 Ramp output circuit (case of normal way of use)·················································· 14 4.3.2 Method to use ramp wafer as a change ratelimiter················································ 14 How to use dead time wafer ································································································ 15 4.4.1 Series connection of dead time wafers ·································································· 15 Method to convert analog signal to integration pulse··························································...
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Page 8: Foreword
(hereinafter abbreviated as "CC-M"), for materializing a sophisticated measurement control system using CC-M. It also describes general precautions and typical applications that constitute a system. Make best use of this Application Manual for materializing more sophisticated functions using CC-M. INP-TN512878-E... -
Page 10: General Precautions On Compact Controller (Cc-M)
1. General precautions on Compact Controller (CC-M) 1.1 Precautions for use of wafers (1) Nothing is executed if “0000” is entered in a wafer mounting position in the wafer wire connection chart. Enter a wafer number for execution of a wafer instruction. -
Page 11: Contents Of Internal Arithmetic Operations
1.3 Contents of internal arithmetic operations 50% + 50% = 100% (Addition) 50% + (-100%) = -50% – 50% - 30% = 20% (Subtraction) (- 200%) - (- 50%) = - 150% × × (Multiplication) × × × ÷ ÷ ÷... -
Page 12: Modes And Output Signals Of Controller
1.4 Modes and output signals of controller Figure 1-1 Important What requires balance operation for bumpless changeover out of these changeovers is : • Changeover from a mode other than EX-M mode to EX-M mode ( See section.1.5 ) INP-TN512878-E... -
Page 13: Control Output Bumpless Changeover
1.5 Control output bumpless changeover Bumpless circuit at the time of changeover of operation output to EX-M Method to gradually bring close by ramp output wafer Figure 1-2 When an EX-M (external output setup) command enters, the output (MV) varies by inclination CONT determined by the ramp wafer. -
Page 14: Balanceless, Bumpless Circuit At The Time Of Mode Change Of Controller Mode (Case Of From A-Mode To R-Mode)
2. Balanceless, bumpless circuit at the time of mode change of controller mode (case of from A-mode to R-mode) Bumpless changeover can always be performed for changeover from remote (R) to auto (A). Bumpless changeover from auto (A) to remote (R) can be performed by the following methods. Note: Remode (R) indicates cascade mode (C) in front button “C”... -
Page 15: Bumpless Changeover Circuit With Inverse Arithmetic Operation Function
2.2.2 Bumpless changeover circuit with inverse arithmetic operation function In case where an arithmetic operation circuit is located between primary PID and secondary PID , if its arithmetic operation is simple, Figure 2-2 bumpless changeover can be accomplished by feedback to the primary integration circuit by way of the inverse arithmetic operation circuit. -
Page 16: Bumpless Changeover Circuit Using Primary Integration Circuit
2.2.3 Bumpless changeover circuit using primary integration circuit Figure 2-3 (Integrate R·SV-PV value (Y4) of secondary input processing wafer (41) by way of primary PID wafer.) When the arithmetic operation between primary PID and secondary PID becomes complicated, many wafers are required for inverse arithmetic operation for tracking. In such a case, compensation can be made by using R ·... -
Page 17: Bumpless Changeover Circuit Using Pulse Width Integration Wafer (06)
2.2.4 Bumpless changeover circuit using pulse width integration wafer (06) Figure 2-4 When complicated arithmetic operation enters between primary PID and secondary PID, many wafers are required for inverse arithmetic operation as described in section 2.2.3. Furthermore, if the method using integration described in section 2.2.3 is used, the tracking time is determined by the integration time of primary PID, and there are cases where bumpless changeover cannot be accomplished within a short length of time. -
Page 18: How To Hold Output Value (Mv)
3. How to hold output value (MV) When it is wanted to hold the output value (MV), it can be accomplished by the following methods. 3.1 Method to input external signal (forced manual SMAN) Forcibly produce the M-mode by inputting a DI signal of “SMV” from outside. (The mode lamp on the front face changes to “M”, and the MV operation button becomes valid.) In this case, call the ALARM CONNECT screen out of the OUT CONNECT screen, and register DI terminal mode in “SMAN-REQ”. -
Page 19: Method For Materialization Of Various Functions Using
4. Method for materialization of various functions using wafers of various types 4.1 How to use changeover wafer (67) 4.1.1 Analog signal hold circuit It is possible to hold the analog signal by returning the output (Y1) of the changeover wafer (67) to the input (X1). -
Page 20: R · S Flip-Flop Circuit (Reset Priority)
4.1.3 R · S flip-flop circuit (RESET priority) Note: Flip-flop wafer (A5) is also available. Figure 4-3 When set signal (S) is changed from “0” to “1”, output Q changes from “0” to “1”. When reset signal (R) is changed from “0” to “1”, output Q changes from “1” to “0”. When two flip-flop wafers (67) are used, they can be used as R-S flip-flop. -
Page 21: Creation Of One-Shot Multiple Circuits (Method To Use Basic Period)
4.2 Creation of one-shot multiple circuits (method to use basic period) 4.2.1 Method to seize rise of input Figure 4-4 (Seize the rise of the input and turn ON a basic period (0.2 SEC) only.) 4.2.2 Method to seize fall of input Figure 4-5 (Seize the fall of the input and turn OFF a basic period (0.2 SEC) only.) These methods are to read input X1, X2, X3 by the first basic period (0.2 SEC) and to direct them to... -
Page 22: Method Using Timer And Logical Wafer
4.2.3 Method using timer and logical wafer Figure 4-7 It is possible to create one-shot multiple circuits by the combination of timer and E-OR (EXCLUSIVE-OR). The ON time can be set arbitrarily by the timer set time (T). Logic of E-OR INP-TN512878-E... -
Page 23: How To Use Ramp Output Wafer
4.3 How to use ramp output wafer 4.3.1 Ramp output circuit (case of normal way of use) The output changes by the inclination (T) set in the ramp wafer. Figure 4-8 4.3.2 Method to use ramp wafer as a change ratelimiter When the inclination of the ramp wafer is set by time T (curve a-c), the output of the ramp wafer is limited by the inclination of time T (curve a-b), even if the input enters by the inclination of time T (curve a-c). -
Page 24: How To Use Dead Time Wafer
4.4 How to use dead time wafer 4.4.1 Series connection of dead time wafers There are three dead time wafers. Two dead time wafers (dead time wafers 1 and 2) of up to 120 seconds (2 minutes) in one-second interval and one dead time wafer (dead time wafer 3) of up to 60 minutes in 30-second interval. -
Page 25: Method To Convert Analog Signal To Integration Pulse
4.5 Method to convert analog signal to integration pulse Method to output as pulses the value of flow rate 0 to 50 T/H (0 to 100%) under the weight of one pulse/1T. Figure 4-11 A value of flow rate 0 to 50t/H is integrated with analog integration wafer (8C), and when 1t(that is, 1t/50t = 2%) is reached, the pulse of 1 pulse weight time (40 seconds) is ON by the comparison wafer (08) in this example. -
Page 26: Method To Create Time Function Circuit Using Analog Integration Wafer And N Wafer
4.6 Method to create time function circuit using analog integration wafer and N wafer Figure 4-12 It is possible to create a time function generator by combining an analog integration wafer and a linearize wafer. In the example shown above, when a value of 10% is set in constant input (X ) of an analog integration wafer (8C), the analog integration wafer integrates analog value of 100% in 10 hours, and the input of the linearize wafer changes by 0 to 100% in 10 hours. -
Page 27: Method To Create 32-Segmented-Line Approximation Circuit
4.7 Method to create 32-segmented-line approximation circuit Figure 4-13 This is the method to create segmented lines 1 to 16 by LIN1, to create segmented lines 17 to 32 by LIN2 and to then create 32 segmented lines by two LIN wafers. The example shown above indicates a case where changeover to segmented lines on LIN2 side when the input becomes 50%. -
Page 28: Sequence Circuit Of Program Setting Wafer
4.8 Sequence circuit of program setting wafer When a program-setting wafer (26, 27) of a primary control block is used, it is necessary to create an appropriate sequence of input (pause, reset, preset). The example shown below indicates a sequence in which the program wafer is automatically reset and the program is started by a start signal when the power is ON. -
Page 29: Bulb Compensation Circuit
4.9 Bulb compensation circuit Figure 4-15 Set the LIN (linearize wafer) located before the secondary integration wafer (43) so that it is an inverse function of LIN for bulb compensation. Set the characteristics of the LIN so as to represent the valve opening change rate against the flow rate, instead of valve characteristics themselves. -
Page 30: Method For Materialization Of Various Advance Controls
5. Method for materialization of various advance controls A CC-M with built-in microprocessor is capable of easily materializing various advance controls by its abundant wafers. This section describes overview of advance controls, i.e., variable gain control, feed forward control and dead time control as well as wafer wire connection. -
Page 31: Method To Make Selection By Outputs Of Primary Integration Wafer And Secondary Integration Wafer
5.1.1 Method to make selection by outputs of primary integration wafer and secondary integration wafer Figure 5-2 2ND output wafer (44) is commonly used, changeover between primary PID and secondary PID is made by changeover signal, and either one controller is selected. Since feedback of the output signal is made to both of primary integration wafer (23) and secondary integration wafer (43) in this case, Balanceless and bumpless changeover can be achieved at any time by a changeover signal. -
Page 32: Method To Make Selection By Velocity Control Type Outputs Of Primary Pid
5.1.2 Method to make selection by velocity control type outputs of primary PID wafer and secondary PID wafer Figure 5-3 The wafer connection in this case is such that the integration wafer (43) and output wafer (44) of secondary PID are commonly used, and changeover is made by outputs of primary PID wafer (22) and secondary PID wafer (42). -
Page 33: Variable Gain Control
5.2 Variable gain control To change the gain of the controller in correspondence to the status change of the process is called variable gain. The arithmetic operation expression indicated below is basically used for gain arithmetic operation of PID. ∆ Integral Proportional Differential term... -
Page 34: Variable Gain By Lin Wafer
5.2.1 Variable gain by LIN wafer Figure 5-5 This is a case to change the gain of PID control by changing the PV value. The gain is changed by LIN wafer and multiplication wafer. To change the gain by deviation (DV), make connection as shown by broken lines. -
Page 35: Variable Gain By Primary Pid Block And Secondary Pid Block
5.2.2 Variable gain by primary PID block and secondary PID block Figure 5-7 This is the method to change the PID gain by a changeover signal, with PID constant set in both of primary PID wafer and secondary PID wafer (42), in case primary PID Control sequence is not used. 5.2.3 Deviation square type PID control Figure 5-8 Deviation square type PID is to execute control in proportion to the square of the deviation. -
Page 36: Feed Forward Control
5.3 Feed forward control To forecast the deviation, when disturbance occurs to the process, in advance and to take corrective action before the process changes is called feed forward control. Typical application of feed forward and wafer wire connection are described below. Figure 5-10 - Typical application of feed forward control to distillation furnace - In case cascade control of the outlet temperature of supply fluid is executed as shown above, major... -
Page 37: Static Feed Forward
5.3.1 Static feed forward Static feed forward makes addition to PID arithmetic operation with an appropriate gain multiplied to the disturbance element (AI1). It is necessary to execute inverse arithmetic operation of the arithmetic operation that comes after the integration wafer (43) against the feedback signal of the integration wafer (43) at this time. -
Page 38: Dead Time Control
Conventional PID control was not necessarily satisfactory against processes of large dead time. By the use of CC-M, it has become possible to execute sophisticated control such as Smith’s dead time compensation control, which could not be executed with conventional analog controllers. Sampling control, intermittent PID control, Smith’s compensation, etc. -
Page 39: Intermittent Pid Control (Sample Value Type Pid Control)
It is more effective than sampling control for a process of relatively large noise. With CC-M, this control can be materialized by the combination of a changeover wafer and a pulse generation wafer. -
Page 40: Smith's Dead Time Compensation Control
5.4.3 Smith’s dead time compensation control Method for Smith compensation: By adding internal compensation circuit G1 (1 - e ) to a system having dead time of GP • e in the process, deformation to such a form that the system viewed from the controller controls the system equivalently without dead time. - Page 41 Method for wafer connection in Smith’s dead time compensation control circuit Figure 5-16 The wafer connection chart indicated above shows a case where the process transfer function is known as being G (S) = and dead time (L) can be easily measured. 1 + TS INP-TN512878-E...
- Page 43 Head Office Gate City Ohsaki, East Tower, 11-2, Osaki 1-chome, Shinagawa-ku, Tokyo 141-0032, Japan http://www.fesys.co.jp/eng Instrumentation Div. International Sales Dept. No.1, Fuji-machi, Hino-city, Tokyo 191-8502, Japan Phone: 81-42-585-6201, 6202 Fax: 81-42-585-6187 http://www.fic-net.jp/eng...