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Summary of Contents for tpt HB10
- Page 1 Wire Bonder HB10 / HB16 Operation Manual Version 4 www.tpt.de TPT Wirebonder www.tpt.de Page 1 of 53 September 2016...
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Page 2: Table Of Contents
Wedge Tool ....................48 Packing Instructions ................... 49 Heater Stage ....................50 Laser Spotlight (Option H50) ..............51 Manual Wire Spool 1/2" and 2"..............52 47.1. USB Stick....................52 SPECIFICATION ..................53 TPT Wirebonder www.tpt.de Page 2 of 53 September 2016... -
Page 3: Quickstart
(200µ over surface) then you can target exactly. Release button to bond. TPT Wirebonder www.tpt.de Page 3 of 53 September 2016... -
Page 4: Unpacking And Packing Instructions
Remove cable tie from clamp Remove protection foam Allen keys, microscope holder screws and transducer screws are stored in tool box Now you are ready for installation see manual page 8. TPT Wirebonder www.tpt.de Page 4 of 53 September 2016... -
Page 5: Safety Instruction
The System produces a High Voltage spark. The potential shock hazard is not usually considered life threatening. However, TPT recommends that those persons with abnormal heart conditions or artificial heart stimulation devices (e.g. pacemakers) should not be permitted to operate or service this Bonder 12. -
Page 6: Introduction
HB08/14 is a manual/ semiautomatic thermosonic wire ball bonder. This bonder was designed to make 0.7 to 2 mil gold wire electrical interconnections on a wide range of microelectronic packages. HB10/16 is a manual/ semiautomatic thermosonic wire bonder for Wedge bonding, Ball bonding and Ball Bumping. -
Page 7: Overview
3. Foot switch Stitch bonding 4. USB Connector 5. On / Off Switch 6. Power Connector AC 100V - 230V T 6,30 A Fuse 7. Serial number and Bonder type Detailed view on Bondhead TPT Wirebonder www.tpt.de Page 7 of 53 September 2016... -
Page 8: Basic Ultrasonic Bonding & Bond Modes
7. Basic Ultrasonic Bonding & Bond Modes All TPT Bonders utilize the basic ultrasonic bonding method. Bonding two types of metals using the ultrasonic method results from three variables: force, ultrasonic power and time. If the HB16 is used for gold wire bonding, heat is used as a fourth variable. -
Page 9: Bonding Tools
Wedge Tool, considering the Wire Diameter, Wire type and Bond size the wire diameter is a key factor to determine the optimized hole diameter Capillary Wedge Tool TPT Wirebonder www.tpt.de Page 9 of 53 September 2016... -
Page 10: Tool Installation
Ultrasonic vibrations may not be forwarded properly from the transducer into the tool, causing heavy bonding mistakes. Also make sure to only use original components of TPT. When installing a Wedge Tool the positioning of the tool is an important factor. -
Page 11: Loading Wire To Motorized Wire Spool
"How to thread wire in wedge tool" https://youtu.be/-Ez8a4g_K-E H71 motorized Wire Spool maximum Wire diameter is 50µ / Ribbon until 100 x 20µ H72 manual wire Spool maximum Wire diameter is 100µ / Ribbon until 250 x 25µ TPT Wirebonder www.tpt.de Page 11 of 53 September 2016... -
Page 12: Control Puck
To abort bonding on search height you can do also, Hold one feed Button (2/3) on search height and lift Bond button (1). Control Puck "X-Y" Axis Control - 6 :1 ratio manipulator TPT Wirebonder www.tpt.de Page 12 of 53... -
Page 13: Menu Bond Touch Panel Display
Full Automatic, Semi Automatic, Step, Manual (see next Page) Clamp switch for Wire clamp open/closed Advanced Setting parameter for Setup, Tail, Loop and other Setting All changed program values are automatic saved in displayed program number TPT Wirebonder www.tpt.de Page 13 of 53 September 2016... -
Page 14: Bonding Mode
Dynamic bond length adjustment: if Bonder is in Loop height position , Bond length (Y-Way) can be changed with button down/up Stitch function: Stitch button has same function like foot switch TPT Wirebonder www.tpt.de Page 14 of 53 September 2016... -
Page 15: Menu Setup Wedge Bonder Touch Panel Display
(usually is “0”) Tail Back after bonding, on work height, clamp feed new tail (usually is “200”) Tail Feed All changed program values are automatic saved in displayed program number TPT Wirebonder www.tpt.de Page 15 of 53 September 2016... -
Page 16: Menu Setup Ball Bonder Touch Panel Display
OFF = EFO start only by pushing Start button Up CO after second bond bondhead move this parameter upwards, then clamp is closing and cut the wire. All changed program values are automatic saved in displayed program number TPT Wirebonder www.tpt.de Page 16 of 53 September 2016... -
Page 17: Menu Misc Touch Panel Display
Motor speed from 20-100% SearchSp. to change search speed from 10 to 50% Stitch Button to change stitch Mode from 1-2-2 to 1-2-1 All changed program values are automatic saved in displayed program number TPT Wirebonder www.tpt.de Page 17 of 53 September 2016... -
Page 18: Menu Loop Parameter Touch Panel Display
↓ Z down, → Y forward, ← Y backward CO/CC Movement with closed or open clamp 0000 travel distance in Micron All changed program values are automatic saved in displayed program number TPT Wirebonder www.tpt.de Page 18 of 53 September 2016... -
Page 19: Loop Profile Samples
In addition to the Basic Loop, the capillary moves backwards before it reaches its desired height. The loop gets a more stable shape, provided by the new set of angles of the wire. With this shape it is possible to realize longer loops without losing its stability. TPT Wirebonder www.tpt.de Page 19 of 53... - Page 20 (Way 9) on a very low Z-Level (determined by Way 8). By keeping all values unchanged and increasing the pulling variable, the loop becomes longer and more flat. If you desire a longer loop with the same characteristics, please make sure to adjust the other values. TPT Wirebonder www.tpt.de Page 20 of 53...
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Page 21: Menu Keyboard Touch Panel Display
At any number field touch twice, Keyboard pad appears Bond arm HB12/14/16 Bonder 19mm Wedge Bond tool 16 mm deep access 165 mm deep reach transducer 90° Bond Tool 16 mm Figure 12 TPT Wirebonder www.tpt.de Page 21 of 53 September 2016... -
Page 22: Pitch And Pad Size
Minimal Pitch Ball 17µm 1732-10-35-437 CZ3 45µm Ø 50µm Ball 25µm 1732-15-35-437 CZ3 80µm Ø 90µm 4445-1307-3/4-CG-F- Wedge 17µm 20µm x 18µm 64µm DSR(003x008)-W=0025-TIC 4445-1507-3/4-CG-F- Wedge 25µm 30µm x 25µm 64µm DSR(003x008)-W=0025-TIC TPT Wirebonder www.tpt.de Page 22 of 53 September 2016... -
Page 23: Efo System (Only Ball Bonding Hb08/10/14/16)
2. Negative EFO use for 25µ wire 100% power 3. Jumper for High and Low Voltage 4. Wait set a delay for EFO spark 5. Time set the msec for EFO Power TPT Wirebonder www.tpt.de Page 23 of 53 September 2016... -
Page 24: Work Stage Connector And Height Adjustment
1. Plug in the work stage cable into the matching connector. TPT optional work stage H26 is a heated work stage with provisions for both vacuum clamping and mechanical clamping. Mechanical clamping provisions allow clamping of work pieces with dimensions of up to 40mm. -
Page 25: Adjust Search Height, Loop Height And Work Height
Place the point or arm of the gram gauge at the end of the transducer. Slowly raise the gauge until the transducer lifts to find out the actual applied force. TPT Wirebonder www.tpt.de... -
Page 26: Find Bonding Parameters
If possible use “Table Tear” mode to cut the ribbon, this prevent lift off of second bond and tear the wire to the tool. “Table Tear” for wedge bonding is only available in HB16 Bonder TPT Wirebonder www.tpt.de Page 26 of 53... -
Page 27: Bonding Parameter
Bonding Parameter Wedge-Wedge Gold Wire 17µm Tail Length 170 25µm Tail Length 200 33µm Tail Length 230 50µm Tail Length 260 Aluminum Wire 25µm Tail Length 200 33µm Tail Length 230 TPT Wirebonder www.tpt.de Page 27 of 53 September 2016... - Page 28 Bonding Parameter Ball-Wedge Gold Wire 17µm Table Tear 400 25µm Table Tear 500 33µm Table Tear 550 50µm Table Tear 600 Ribbon Wire 13x76µm Table Tear Mode 20x200µm Table Tear Mode TPT Wirebonder www.tpt.de Page 28 of 53 September 2016...
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Page 29: Option H80 "Pick And Place
Loosen set screw remove cam to clean It is possible to clean the aluminum pot with acetone and other solvents. It is also possible to remove the pot complete for cleaning. TPT Wirebonder www.tpt.de Page 29 of 53 September 2016... - Page 30 7. Make Height setup from chip to surface. Important: add chip height to surface height. 8. Pick and Place is with "semiautomatic" and "manual" mode possible Important: "Full Automatic" mode is not working TPT Wirebonder www.tpt.de Page 30 of 53 September 2016...
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Page 31: Option H53 "Pull Tester
Installation Holder for Pull Tester Remove screw at glass tube Install holder with long screw Secure glass tube with M4 nut attach Pulltester arm to holder and tighten M2 screw Test Position Rest Position TPT Wirebonder www.tpt.de Page 31 of 53 September 2016... - Page 32 4. Machine settings Set Bondtype to "Pull Tester" Mode 3. Operation of Pull Tester with manual-Z (HB10/HB16) or Z lever (HB05) 1. The pull-hook is moved with H51 manual-Z (HB10/HB16 only) or the Z lever (HB05). 2. Move it below your wire bond 3.
- Page 33 4. Operation of Pull Tester with H52 Dynamic Search (HB10/HB16) 5. Operation of Pull Tester with H52 Dynamic Search The pull-hook is moved to Pull Position by press Bond Button. with H52 Dynamic Search adjust position with up and down.
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Page 34: Option 85-1 "Digital Camera
Connect a mouse to USB. Move with mouse to lower screen border to open function menu. If you switch on cross hair you can adjust settings at the left screen border. TPT Wirebonder www.tpt.de Page 34 of 53 September 2016... -
Page 35: Optional Software "Add Bond" For Automatic Security Bond
The direction specifies in which direction the way will move. In front of the first bond or behind the first bond. Distance: The distance is the way between the first bond of the 1.bond program and the first bond of the 2. Bond program TPT Wirebonder www.tpt.de Page 35 of 53... - Page 36 So there is a difference between stitch bond position and ball band position This difference depends on wire size and capillary shape. With Standard TPT 25µm capillary the difference between stitch and ball is 50µm The 1. Bond Program has a Y-way of 500µm We want bond in the front of the ball bond on the stitch, so the arrow shows to right side.
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Page 37: Bump Bonding
If you need flat Bumps you have to use a coin tool after making the Bumps. Coin tool is complete flat, with no hole. It depends at your application if you need a tail above the Bumps. TPT Wirebonder www.tpt.de Page 37 of 53... -
Page 38: Bumps Without Tail
Loop Program can be varied. Up to: 140 Up / 120 Forward Second Bond parameters are critical for Bump height. You have to try different Loop parameters and bond parameters to get a good and constant result. TPT Wirebonder www.tpt.de Page 38 of 53... -
Page 39: Ribbon Bonding
13µ x 76µ Gold Ribbon Bond1 Bond2 Time Force 20µ x 200µ Gold Ribbon Bond1 Bond2 1500 1700 Time Force 25µ x 250µ Gold Ribbon Bond1 Bond2 1800 1900 Time Force TPT Wirebonder www.tpt.de Page 39 of 53 September 2016... -
Page 40: Bonding Sequence
3. Operator releases Control Puck 4. clamp opens and tool rise to loop 5. Operator positions 2 target 2. Operator holds down Control Start button height under spotlight 1. Start Position Puck Start button Bond tool descends to 1 . Bond and/or Y-Table moves to Operator positions target under Bond Head travels down to... - Page 41 1. Start Position 2. Operator holds down Control 3. Operator releases Control Puck 4. after Bond tool rise to loop height Operator positions target under Puck Start button , Clamp opens Start button spotlight. Clamp is closed Bond Head travels down to Bond tool descends to 1 .
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Page 42: Ultrasonic Generator
Slowly raise the gauge until the transducer lifts and a gauge reading is required force Basic Force adjustment is made in Bonder.ini file BasicForce: 160 to 300 // Magnet basic force as DAC value TPT Wirebonder www.tpt.de Page 42 of 53 September 2016... -
Page 43: Tdsw Touch Down Switch Adjustment
A: If Foot switch is activate before first Bond, then automatically 3 Bonds are Bonded, before Terminating wire. B: When the Foot switch is actuated after first bond, the bonder will not terminate the bonding cycle after Foot switch is released. Footswitch Stitch bonding TPT Wirebonder www.tpt.de Page 43 of 53 September 2016... -
Page 44: Wire Clamp
To clean wire clamp increase gap to 2mm, use alcohol or acetone to soak a clean paper, put this paper in clamp gap, close clamp and pull the paper down, repeat that 5 times. TPT Wirebonder www.tpt.de Page 44 of 53... -
Page 45: Tool Heater Option H40
Mount the Tool Heater Holder like shown on the pictures. Remove screw and install tool heater. Make sure Heater Coil is not touching bond tool. Connect Tool Heater to connecter and program temperature in TFT Display TPT Wirebonder www.tpt.de Page 45 of 53 September 2016... -
Page 46: Troubleshooting
D-Sub Connect Bond head not connected 24V missing Motherboard Defect F: Set up error, using defaults Bond level to deep G. “Setup. Offset.WB” not found in File Wrong Software in use TPT Wirebonder www.tpt.de Page 46 of 53 September 2016... -
Page 47: Height Setup In Menu Bond And Setup
5. Loop Height will not change at Setup procedure 6. Work-Height is set automatic to 2000 after Bond level Set up procedure can be done every time All changed program values are automatic saved in displayed program number TPT Wirebonder www.tpt.de Page 47 of 53 September 2016... -
Page 48: Wedge Tool
Wedge Tool 90° Wedge Tool Wire Clamp Bond-Wire Wedge Tool Bond-Surface Figure 11 TPT Wirebonder www.tpt.de Page 48 of 53 September 2016... -
Page 49: Packing Instructions
Of the bonder so that they are secure from movement and so the to foam cover can be installed. Place the foam cover around and over Bonder . 7. Position and bolt the wooden cover on to the crate. TPT Wirebonder www.tpt.de Page 49 of 53 September 2016... -
Page 50: Heater Stage
250°C height adjustable from 65 to 80 mm dimension 125x125mm height 65-80mm H22-250 hot plate 100 x 150 mm temperature range until 250°C height adjustable from 65 to 80 mm TPT Wirebonder www.tpt.de Page 50 of 53 September 2016... -
Page 51: Laser Spotlight (Option H50)
The Laser has the focus point on 100mm. Move from the laser surface with the laser up, around 100mm you should see a tiny dot. Picture 1 Picture 2 Picture 3 Picture 4 Picture 5 TPT Wirebonder www.tpt.de Page 51 of 53 September 2016... -
Page 52: Manual Wire Spool 1/2" And 2
1. USB Stick must insert before Power ON Bonder 2. Only Remove USB Stick after Power OFF Bonder 3. Use only USB Stick with max. 1 GB 4. USB Stick must be 1.1 compatible TPT Wirebonder www.tpt.de Page 52 of 53 September 2016... -
Page 53: Specification
SPECIFICATION The TPT Bonder is a bench top size wire bonder, easy to operate and ideal for laboratories, pilot and pre-production runs and small scale production lines. One Deep-access 90° Bond head for wire and ribbon bonding. No hardware change necessary. Easy operation with 6,5” TFT Touch Panel Operator System.
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