Table of Contents
Summary of Contents for BILIAN ELECTRONIC LB-LINK BL-M8723DS1
- Page 1 BL-M8723DS1 IEEE 802.11b/g/n 150Mbps 1T1R SDIO WiFi and BT combo Module SHENZHEN BILIAN ELECTRONIC CO., LTD Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China Web: www.b-link.net.cn...
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Page 2: Revision History
Module Name: BL-M8723DS1 Module Type: 802.11b/g/n 150Mbps 1T1R SDIO WiFi and BT combo Module Revision: V1.0 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision Summary Release Date Official release 2020-07-03 http://www.b-link.net.cn... - Page 3 1. Introduction BL-M8723DS1 is a highly integrated WiFi+BT combo module, it contains a WLAN and a BT MAC, a 1T1R capable base band. It supports IEEE 802.11b/g/n standard and provides the highest PHY rate up to 150Mbps, and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.2. This module can offering feature-rich wireless connectivity and reliable throughput from an extended distance.
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Page 4: Pin Assignments
1.3 General Specifications Module Name BL-M8723DS1 WiFi and BT combo Module Chipset RTL8723DS-CG WiFi Standards IEEE802.11b/g/n/, 1T1R, 2.4GHz, 150Mbps (Max) BT Standards BT 4.2/4.2LE/2.1EDR/2.1BR Host Interface SDIO 2.0 for WIFI; UART for BT Antenna Connect to the external antennas through half hole pad Dimension SMD 44Pins, 12*12*1.6mm (L*W*H) Power Supply... - Page 5 BT_WAKE HOST wake-up Bluetooth device VDIO BT_WAKE_HOST Bluetooth device to wake-up HOST VDIO VDD33 3.3V Main power supply WL_DSI# WLAN radio off (active low) VDD33 WL_WAKE_HOST WLAN to wake-up HOST VDIO SD_D2 SDIO data line SD_D3 SDIO data line SD_CMD SDIO command line SD_CLK SDIO clock line...
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Page 6: Electrical And Thermal Specifications
Ground connections UART_OUT HOST Data output UART_IN HOST Data input UART_CTS HOST_CTS P: Power, I: Input, O: Output, I/O: In/Output, RF: Analog RF Port 3. Electrical and Thermal Specifications 3.1 Recommended Operating Conditions Parameters Units Ambient Operating Temperature ℃ External Antenna VSWR Supply Voltage VDD33/VDIO 3.2 Current Consumption... - Page 7 2.4G RX (RF-Test) 6Mbps 2.4G TX (RF-Test) 54Mbps 2.4G RX (RF-Test) 54Mbps 2.4G TX (RF-Test) MCS0(HT20) 2.4G RX (RF-Test) MCS0(HT20) 2.4G TX (RF-Test) MCS7(HT20) 2.4G RX (RF-Test) MCS7(HT20) 2.4G TX (RF-Test) MCS7(HT40) 2.4G RX (RF-Test) MCS7(HT40) BT BR_1M DH5 TX(RF-Test) BT EDR_3M DH5 TX(RF-Test) BT LE_1M TX(RF-Test) BT BR_1M DH5 RX Active(RF-Test)
- Page 8 4.2 SDIO Timing 5. WiFi RF Specifications 5.1 2.4G WiFi RF Specification Conditions : VDD33=3.3V ; Ta:25℃ Features Description WLAN Standard IEEE 802.11b/g/n CSMA/CA Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band) Channels Ch1~Ch13 (For 20MHz Channels) 802.11b (DSSS): DBPSK, DQPSK, CCK; Modulation 802.11g (OFDM): BPSK, QPSK, 16QAM, 64QAM;...
- Page 9 802.11b: 1, 2, 5.5, 11Mbps; 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps; Date Rate 802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps; 802.11n (HT40): MCS0~MCS7(1T1R_SISO) 13.5~150Mbps; Frequency Tolerance ≦ ±15ppm 5.2 Bluetooth RF Specifications Conditions : VDD33=3.3V ; Ta:25℃ Features Description Bluetooth v2.1+EDR/3.0+HS (Bluetooth Classic _ BT BR/EDR), Bluetooth Specification Bluetooth 4.2 (Bluetooth Low Energy _ BT_LE) FHSS Frequency Range...
- Page 10 Bluetooth Classic: Class1; Power Classes Bluetooth Low Energy: Class1.5; BR_1Mbps: GFSK; EDR_2Mbps: π/4-DQPSK; Date Rate & Modulation EDR_3Mbps: 8DPSK; LE_1Mbps: GFSK; Bluetooth Transmitter Specifications Items TX Power BR_1M TX Power EDR_2/3M TX Power LE_125K~1M TX Power 1DH1 TX Power 2DH3 TX Power 3DH5 TX Power BR_1M Modulation Characteristics Δf1avg...
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Page 11: Mechanical Specifications
Δf2max] (LE_1M) Δf1avg / Δf2max(LE_1M) 1.06 1.08 Bluetooth Receiver Specifications Sensitivity Maximum Input Level Items Input Level(Typ) Input Level(Typ) BR_1M -92dBm ≦0.1% -20dBm ≦0.1% EDR_2M -90dBm ≦0.01% -20dBm ≦0.1% EDR_3M -86dBm ≦0.01% -20dBm ≦0.1% LE_1M -92dBm ≦30.8% -20dBm ≦0.1% 1DH1 -92dBm ≦30.8% -20dBm... - Page 12 Module Bow and Twist：≤0.1mm 6.2 Mechanical Dimensions http://www.b-link.net.cn...
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Page 13: Application Information
7. Application Information 7.1 Typical Application Circuit http://www.b-link.net.cn... - Page 14 7.2 Recommend PCB Layout Footprint Design size mm Top View http://www.b-link.net.cn...
- Page 15 7.3 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃. 8. Key Components Of Module Parts Specification Manufacturer Note Chipset RTL8723DS-CG Realtek Shen Zhen Tie Fa Technology limited Guangdong KINGSHINE ELECTRONICS BL-M8723DS1 CO., LTD Quzhou Sunlord Electronics Co., Ltd...
- Page 16 9. Package and Storage Information 9.1 Package Dimensions Package specification: 1. 2,000 modules per roll and 10,000 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 25.3mm (with a width of 21.3mm carrying belt). 4.
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Page 17: Storage Conditions
9.2 Storage Conditions Absolute Maximum Ratings: Storage temperature: -45℃ to +85℃ Storage humidity: 10% to 95% RH（Non-Condensing） Recommended Storage Conditions: Storage temperature: 5℃ to +40℃ Storage humidity: 20% to 90% RH Please use this Module within 12month after vacuum-packaged. The Module shall be stored without opening the packing. After the packing opened, the Module shall be used within 72hours. - Page 18 FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’...
- Page 19 Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.
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