Thales Cinterion MV31-W Hardware Interface Description
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Thales Cinterion MV31-W Hardware Interface Description

Thales Cinterion MV31-W Hardware Interface Description

5g m.2 data card
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Cinterion
MV31-W
Hardware Interface Description
Version:
01.009a
DocId:
MV31-W_HID_v01.009a
5G M.2 Data Card

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Summary of Contents for Thales Cinterion MV31-W

  • Page 1 ® Cinterion 5G M.2 Data Card MV31-W Hardware Interface Description Version: 01.009a DocId: MV31-W_HID_v01.009a...
  • Page 2 NOT COPY, MODIFY, DISCLOSE OR REPRODUCE THE DOCUMENT EXCEPT AS SPECIFICALLY AUTHORIZED BY THALES. Copyright © 2022, THALES DIS AIS Deutschland GmbH Trademark Notice Thales, the Thales logo, are trademarks and service marks of Thales and are registered in certain coun- tries. ® ®...

  • Page 3: Table Of Contents

    Cinterion ® MV31-W Hardware Interface Description Page 3 of 76 Contents Contents Document History ...................... 7 Introduction ....................... 11 Ordering Information ..................11 Related Documents ..................12 Terms and Abbreviations ................. 12 Product Concept ....................... 14 Key Features at a Glance ................15 System Overview .....................
  • Page 4 Cinterion ® MV31-W Hardware Interface Description Page 4 of 76 Contents Operation ........................44 Operating Modes ..................... 44 Operating Temperatures.................. 44 Thermal Design Guidelines................45 5.3.1 Thermal Solutions ................46 Power Supply Ratings..................49 Timing Sequence Requirement ............... 54 5.5.1 Power On Timing Requirement............
  • Page 5 Cinterion ® MV31-W Hardware Interface Description Page 5 of 76 Tables Tables Table 1: 5G Modem Card Variants ................11 Table 2: Pin assignments..................... 20 Table 3: Electrical description of connector interface pins ........... 23 Table 4: FULL_CARD_POWER_OFF# States ............27 Table 5: ANT_TUNER_CONFIG States ..............
  • Page 6 Cinterion ® MV31-W Hardware Interface Description Page 6 of 76 Figures Figures Figure 1: 5G M.2 Data Card MV31-W top view............. 14 Figure 2: 5G M.2 Data Card MV31-W bottom view............14 Figure 3: 5G M.2 Data Card MV31-W system overview ..........17 Figure 4: 5G M.2 Data Card MV31-W Dimensions ............

  • Page 7: Document History

    Cinterion ® MV31-W Hardware Interface Description Page 7 of 76 0 Document History Document History ® Preceding document: Cinterion MV31-W Hardware Interface Description, Version 01.009 ® New document: Cinterion MV31-W Hardware Interface Description, Version 01.009a Chapter What is new Revised Figure 7 showing H2.3-S5 dimensions.
  • Page 8 Cinterion ® MV31-W Hardware Interface Description Page 8 of 76 0 Document History ® Preceding document: Cinterion MV31-W Hardware Interface Description, Version 00.058a ® New document: Cinterion MV31-W Hardware Interface Description, Version 00.058b Chapter What is new 3.2.7.1 Revised description of PERST# signal 3.2.8 Added Figure 14...
  • Page 9 Cinterion ® MV31-W Hardware Interface Description Page 9 of 76 0 Document History ® Preceding document: Cinterion MV31-W Hardware Interface Description, Version 00.050 ® New document: Cinterion MV31-W Hardware Interface Description, Version 00.057 Chapter What is new 2.1, Changed maximum supply voltage to 4.8V. Revised Table 27 Summary of reliability test conditions.
  • Page 10 Cinterion ® MV31-W Hardware Interface Description Page 10 of 76 0 Document History ® Preceding document: Cinterion MV31-W Hardware Interface Description, Version 00.004 ® New document: Cinterion MV31-W Hardware Interface Description, Version 00.005 Chapter What is new Removed information about FR2 bands. ®...

  • Page 11: Introduction

    Module label number S30960-S6902-A100 1. Note: At the discretion of Thales, module label information can either be laser engraved on the module’s shielding or be printed on a label adhered to the module’s shielding. Where necessary a note is made to differentiate between the various product variants.

  • Page 12: Related Documents

    Cinterion ® MV31-W Hardware Interface Description Page 12 of 76 1.2 Related Documents Related Documents MV31-W Release Note MV31-W Band Combination Configuration User Guide PCI Express M.2 Specification, Revision 4.0, November 5, 2020, PCI-SIG ® PCI Express ® Card Electromechanical Specification, Revision 1.1, March 28, 2005 Universal Serial Bus Specification , Revision 2.0,April 27, 2000, USB.ORG Universal Serial Bus 3.2 Specification...
  • Page 13 Cinterion ® MV31-W Hardware Interface Description Page 13 of 76 1.3 Terms and Abbreviations Abbreviation Description Mobile Originated Mobile Terminated PBCCH Packet Switched Broadcast Control Channel Peripheral Component Interconnect (personal computer bus) Protocol Data Unit Personal Identification Number Point-to-point protocol R&TTE Radio and Telecommunication Terminal Equipment Radio Frequency...

  • Page 14: Product Concept

    Cinterion ® MV31-W Hardware Interface Description Page 14 of 76 2 Product Concept Product Concept Figure 1 shows the top view and Figure 2 the bottom view of 5G M.2 Data Card MV31-W. Pin 75 Antenna LTE & Sub 6G RX/GPS L1 Mechanical ground pad Antenna LTE &...

  • Page 15: Key Features At A Glance

    Cinterion ® MV31-W Hardware Interface Description Page 15 of 76 2.1 Key Features at a Glance Key Features at a Glance Feature Implementation General Data throughput DL 3.88Gbps (max. theoretical: 4.14 Gbps) at EN-DC: DC_3C-1A-7C-n78A with LTE 5CA 4x4 MIMO (20 Layers) + Sub6G 4x4 MIMO UL 632 Mbps (max theoretical: 660 Mbps) at (EN-DC: DC_7C-n78A with LTE UL CA + Sub6G SISO)
  • Page 16 Cinterion ® MV31-W Hardware Interface Description Page 16 of 76 2.1 Key Features at a Glance Feature Implementation GNSS Dual-Frequency GNSS: GPS: L1; L5 GLONASS: G1 Beidou: B1 Galileo E1; E5a Dual SIM with eSIM on board, Dual SIM Single Active (DSSA) Power supply 3.3V (typical, min.

  • Page 17: System Overview

    Cinterion ® MV31-W Hardware Interface Description Page 17 of 76 2.2 System Overview System Overview MV31 PC / ANT0 Power supply ANT1 eSIM (optional ) ANT2 PCIe Application Connector Wireless connector socket ANT3 Modem (75 pin) (75 pin) UIM card holder (optional) SIM card...

  • Page 18: Mechanical Dimensions

    Cinterion ® MV31-W Hardware Interface Description Page 18 of 76 2.3 Mechanical Dimensions Mechanical Dimensions The mechanical dimensions for PCI Express M.2 Cards with a 3042 form factor are specified and shown in Figure Figure 5 Figure Figure 4: 5G M.2 Data Card MV31-W Dimensions Figure 5: 5G M.2 Data Card MV31-W Ground area (with gold plating) on bottom side Figure 6: 5G M.2 Data Card MV31-W bottom shield dimensions MV31-W_HID_v01.009a...

  • Page 19: Figure 7: 5G M.2 Data Card Mv31-W On Application Board (Height) [3]

    Cinterion ® MV31-W Hardware Interface Description Page 19 of 76 2.3 Mechanical Dimensions The 5G M.2 Data Card MV31-W complies with the single-sided add-in card H2.3-S5: “Stack- up Top Mount Single-sided Add-in Card for 2.00 Maximum Top-side Component Height and with Higher Clearance above Motherboard”...

  • Page 20: Application Connector Interface

    Cinterion ® MV31-W Hardware Interface Description Page 20 of 76 3 Application Connector Interface Application Connector Interface Pin Assignments and Electrical Description Table 2 matches the 5G M.2 Data Card MV31-W pin assignments at the 75-pin application con- nector to the pin assignments specified in [3]. Table 3 lists electrical characteristics of the as- signed and available pins at the application connector interface.
  • Page 21 Cinterion ® MV31-W Hardware Interface Description Page 21 of 76 3.1 Pin Assignments and Electrical Description Table 2: Pin assignments 5G M.2 Data Card Comments PIN Type MV31-W pin name ® PERn0 1st PCIe lane Rx+/-, Section 3.2.7 Input PERp0 ®...
  • Page 22 Cinterion ® MV31-W Hardware Interface Description Page 22 of 76 3.1 Pin Assignments and Electrical Description Table 2: Pin assignments 5G M.2 Data Card Comments PIN Type MV31-W pin name UIM_1_RESET UIM_1 connect to external SIM socket, Section Output 3.2.8 UIM_1_CLK Output UIM_1_DATA...

  • Page 23: Table 3: Electrical Description Of Connector Interface Pins

    Cinterion ® MV31-W Hardware Interface Description Page 23 of 76 3.1 Pin Assignments and Electrical Description Table 3: Electrical description of connector interface pins Function Pin name Signal form and level Comment Power max = 4.8V supply norm = 3.3V min = 3.14V Ground Application Ground...
  • Page 24 Cinterion ® MV31-W Hardware Interface Description Page 24 of 76 3.1 Pin Assignments and Electrical Description Table 3: Electrical description of connector interface pins Function Pin name Signal form and level Comment WWAN/ LAA_n79_Tx_EN O max = 0.45V at I = TBD. WiFi min = 1.35V at I = TBD.
  • Page 25 Cinterion ® MV31-W Hardware Interface Description Page 25 of 76 3.1 Pin Assignments and Electrical Description Table 3: Electrical description of connector interface pins Function Pin name Signal form and level Comment ® PCIe PERST# RPU: 10K ohm This line must be driven max = NA low by an open drain or (PCIe HW...
  • Page 26 Cinterion ® MV31-W Hardware Interface Description Page 26 of 76 3.1 Pin Assignments and Electrical Description Table 3: Electrical description of connector interface pins Function Pin name Signal form and level Comment 1.8V SIM UIM_1_RESET max = 0.36V at I = 1mA Maximum cable length or card inter- UIM_2_RESET...

  • Page 27: Characteristics

    Cinterion ® MV31-W Hardware Interface Description Page 27 of 76 3.2 Characteristics Characteristics 3.2.1 Power Supply and Ground The 5G M.2 Data Card MV31-W uses the five 3V3 pins and 11 GND pins listed in Section 3.1. All pins have to be used in parallel. 3.2.2 Control Signals 3.2.2.1...

  • Page 28: Figure 8: Wake-Up Scenario

    Cinterion ® MV31-W Hardware Interface Description Page 28 of 76 3.2 Characteristics Wake up signal (SMS) MV 31-W Figure 8: Wake-up scenario The WAKE_ON_WWAN# signal is used to wake up the host. It is open drain and should be pulled up at the host side. When MV31-W needs to wake up the host, it will output a one second low pulse, shown in Figure Figure 9: Wake-up signal...

  • Page 29: Tunable Antenna Interface

    Cinterion ® MV31-W Hardware Interface Description Page 29 of 76 3.2 Characteristics 3.2.3 Tunable Antenna Interface 3.2.3.1 Antenna Control MV31-W provides a MIPI interface (MIPI_DATA/RFFE2_DATA and MIPI_CLK/RFFE2_CLK) for external antenna tuner application to allow the implementation of antenna tuner solutions, e.g.

  • Page 30: Wwan/Wifi Coexistence Control

    Cinterion ® MV31-W Hardware Interface Description Page 30 of 76 3.2 Characteristics 3.2.4 WWAN/WiFi Coexistence Control The signals COEX_RXD, COEX_TXD, LAA_n79_Tx_EN and WLAN_Tx_EN are provided to allow the implementation of wireless coexistence solutions between the radio(s) on the M.2 Data Card and other off-card radio(s). These other radios can be located on another M.2 Card located in the same host platform or as alternate radio implementations.

  • Page 31: Usb Interface

    Cinterion ® MV31-W Hardware Interface Description Page 31 of 76 3.2 Characteristics 3.2.6 USB Interface The 5G M.2 Data Card MV31-W has 6 interface lines for USB (see Figure 12) and is acting as peripheral. USB Design General Guidelines: • Reserve choke on all the USB signals in platform for noise debug.

  • Page 32: Pci Express® Interface

    Cinterion ® MV31-W Hardware Interface Description Page 32 of 76 3.2 Characteristics ® 3.2.7 PCI Express Interface ® The PCI Express Interface with a 1 and 2 lane is compliant to [4]. Please note that with the data card’s USB 3.1 hardware variant the PCIe’s 2 lane pins are used as USB 3.1 interface pins.

  • Page 33: Sim/Uicc Interface

    Cinterion ® MV31-W Hardware Interface Description Page 33 of 76 3.2 Characteristics 3.2.8 SIM/UICC Interface The 5G M.2 Data Card MV31-W provides a SIM/UICC interface at the 75-pin application con- nector compliant to the ISO/IEC 7816-3 specification. The SIM interface is intended for 1.8V and 3V SIM cards in accordance with GSM 11.12 Phase 2.

  • Page 34: Esd Protection For Sim Interfaces

    Cinterion ® MV31-W Hardware Interface Description Page 34 of 76 3.2 Characteristics To avoid possible cross-talk from the UIM_1_CLK signal to the UIM_1_DATA signal, be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the UIM_1_DATA line from the UIM_1_CLK line.

  • Page 35: Status

    Cinterion ® MV31-W Hardware Interface Description Page 35 of 76 3.2 Characteristics 3.2.11 Status The LED_1# signal is provided to enable wireless communication add-in cards to pro- vide status indications to users via system provided indicators. Table 9: Status States Signal State Interpretation Radio is capable of transmitting.

  • Page 36: Table 11: Gpio Signals Mapping For Port Configuration 2

    Cinterion ® MV31-W Hardware Interface Description Page 36 of 76 3.2 Characteristics The Port Configuration defines the signals on the GPIO0 to GPIO11 and provides the following signals in Port Configuration 2: Table 11: GPIO Signals Mapping for Port Configuration 2 GPIO Signal SIM_DETECT_2...

  • Page 37: Antenna Interface

    Cinterion ® MV31-W Hardware Interface Description Page 37 of 76 4 Antenna Interface Antenna Interface MV31-W also provides connectivity for off board antennas. The antennas and their connection interface for this device satisfy the requirements specified in [3]. The antenna elements are typ- ically integrated into the notebook/ultra book /tablet and connected to MV31-W via flexible RF coaxial cables.

  • Page 38: Antenna Interface Specification

    Cinterion ® MV31-W Hardware Interface Description Page 38 of 76 4.1 Antenna Interface Specification Antenna Interface Specification The below Table 13 Table 14 list RF minimum Rx sensitivity specifications. Measurement conditions: T = 25°C, V = 3.3V. Table 13: RF antenna interface LTE: Conductive minimum receiver input sensitivity (dBm) LTE band ANT0 ANT1...

  • Page 39: Table 14: Rf Antenna Interface Fr1 (Sub 6G): Conductive Minimum Receiver Input Sensitivity (Dbm)

    Cinterion ® MV31-W Hardware Interface Description Page 39 of 76 4.1 Antenna Interface Specification Table 14: RF antenna interface FR1 (Sub 6G): Conductive minimum receiver input sensitivity (dBm) 5G band ANT0 ANT1 ANT2 ANT3 MIMO Combined -91.5 -91.5 -91.5 -91.5 -91.5 -91.5 -91.5...

  • Page 40: Table 15: Antenna Interfaces

    Cinterion ® MV31-W Hardware Interface Description Page 40 of 76 4.1 Antenna Interface Specification Table 15 lists the frequency bands as well as the direction (TX/RX) supported by the four an- tenna interfaces. Table 15: Antenna interfaces Antenna interface ANT0 WCDMA: WCDMA: B1/2/4/5/6/8/9/19...

  • Page 41: Figure 17: Antenna Interfaces

    Cinterion ® MV31-W Hardware Interface Description Page 41 of 76 4.1 Antenna Interface Specification Notes: The supported RF antenna directions and bands shown in the above Table 15 apply to the fol- lowing scenarios, i.e., RF antenna vs band configurations: •...

  • Page 42: Gnss Interface Characteristics

    Cinterion ® MV31-W Hardware Interface Description Page 42 of 76 4.1 Antenna Interface Specification 4.1.1 GNSS Interface Characteristics Table 16: GNSS properties Parameter Conditions Min. Typical Max. Unit Frequency 1574.4 1575.42 1576.4 1166.22 1176.45 1186.68 GLONASS (G1) 1597.5 1601.7 1605.9 Beidou (B1) 1559.1 1561...

  • Page 43: Antenna Interface Connector

    Cinterion ® MV31-W Hardware Interface Description Page 43 of 76 4.2 Antenna Interface Connector Antenna Interface Connector 4.2.1 UMTS/LTE & Sub 6G Antenna Connectors Figure 18 Figure 19 show the MHF4 type connectors for the UMTS/LTE & Sub 6G anten- nas.

  • Page 44: Operation

    Cinterion ® MV31-W Hardware Interface Description Page 44 of 76 5 Operation Operation Operating Modes TBD. Operating Temperatures Table 17: Temperature characteristics Parameter Typical Unit Normal operation °C Extended operation -40 to -30 +70 to +85 °C Thermal Throttling Thresholds Level 1 PA Sensor °C Level 1 SKIN Sensor...

  • Page 45: Thermal Design Guidelines

    Cinterion ® MV31-W Hardware Interface Description Page 45 of 76 5.3 Thermal Design Guidelines Thermal Design Guidelines The MV31-W m.2 card temperature rises because electrical energy is turned into heat. De- pending on the application itself and housing different methods are recommend to allow the card operate under ideal conditions.

  • Page 46: Thermal Solutions

    Cinterion ® MV31-W Hardware Interface Description Page 46 of 76 5.3 Thermal Design Guidelines 5.3.1 Thermal Solutions MV31-W requires to be thermally coupled to the application PCB as well as the stepped EMI shielding to spread and thus mitigate the heat. To ensure an optimum heat spreading on the application PCB, the PCB should have a copper GND plane in each layer, and each layer should be thermally coupled by a large amount of vias.

  • Page 47: Figure 21: Option 2 - Heat Sink Only On Heat Spot Of Stepped Shielding And

    Cinterion ® MV31-W Hardware Interface Description Page 47 of 76 5.3 Thermal Design Guidelines Heat spot of th e M.2 card is below the lower shield. Allows internally thinner TIM with lower Rth Shield Heat sink +0.5mm Shield M.2 CON RF PCB +1.3mm Shield Screw...

  • Page 48: Figure 24: Option 5 - Heat Pipe And Big Application Housing

    Cinterion ® MV31-W Hardware Interface Description Page 48 of 76 5.3 Thermal Design Guidelines Heat spot of th e M.2 card is below the lower shield. Allows internally thinner TIM with lo wer Rth Heat pipe Shield Heat pipe +0.5mm Shield M.2 CON RF PCB +1.3mm Shield...

  • Page 49: Power Supply Ratings

    Cinterion ® MV31-W Hardware Interface Description Page 49 of 76 5.4 Power Supply Ratings Power Supply Ratings The following tables provide sample power supply ratings for selected 4G/5G technologies in- cluding carrier aggregations (CA). As a general rule it is recommended to reserve at least 2500mA for the module to be able to handle peak current consumption under all conditions.
  • Page 50 Cinterion ® MV31-W Hardware Interface Description Page 50 of 76 5.4 Power Supply Ratings Table 19: LTE current consumption ratings Description Conditions Typical rating Unit Band Tx power (dBm) Channel Average LTE Band 12 1dBm 23095 (M) BATT+ supply current 23.4dBm 23060 (L) Data transfer...
  • Page 51 Cinterion ® MV31-W Hardware Interface Description Page 51 of 76 5.4 Power Supply Ratings Table 19: LTE current consumption ratings Description Conditions Typical rating Unit Band Tx power (dBm) Channel Average LTE Band 28 1dBm 27410 (M) BATT+ supply current 23.5dBm 27260 (L) Data transfer...

  • Page 52: Table 20: En-Dc Current Consumption Ratings

    Cinterion ® MV31-W Hardware Interface Description Page 52 of 76 5.4 Power Supply Ratings Table 19: LTE current consumption ratings Description Conditions Typical rating Unit Band Tx power (dBm) Channel Average LTE Band 66 1dBm 132422 (M) 376 BATT+ supply current 23.2dBm 132022 (L) Data transfer...

  • Page 53: Table 21: Lte Ca Current Consumption Ratings

    Cinterion ® MV31-W Hardware Interface Description Page 53 of 76 5.4 Power Supply Ratings Table 20: EN-DC current consumption ratings Description Conditions Typical rating Unit EN-DC Tx power (dBm) Channel Average EN-DC DC_B20-n3 LTE=0dBm 349500(M) BATT+ (FDD) supply NR=0dBm current LTE=0dBm 1180 NR=23dBm...

  • Page 54: Timing Sequence Requirement

    Cinterion ® MV31-W Hardware Interface Description Page 54 of 76 5.5 Timing Sequence Requirement Timing Sequence Requirement 5.5.1 Power On Timing Requirement • Requirements: - +3.3V power should be stable earlier than Full_Card_Power_Off ® - Compliance with PCI Express Card Electromechanical Specification Figure below shows the M.2 adapter power-up sequence for an adapter from the system power rail.

  • Page 55: Table 23: Power On Information

    Cinterion ® MV31-W Hardware Interface Description Page 55 of 76 5.5 Timing Sequence Requirement VBAT_3.3V Full_Card_Power Off# ton1 PECLK ton2 PERST# Figure 27: Power on timing diagram Table 23: Power On information Symbol Minimum value Note 10ms Keep 3.3V power supply before Full_Card_Power_Off# assert. There is no tPr if the power supply is always ready.

  • Page 56: Power Off Timing Requirement

    Cinterion ® MV31-W Hardware Interface Description Page 56 of 76 5.5 Timing Sequence Requirement 5.5.2 Power Off Timing Requirement • The platform should follow the requirement when the device power is Off by M.2 PIN#6 and when Windows enters S4 and S5. •...

  • Page 57: Figure 29: Device Power Off Behavior For Linux

    Cinterion ® MV31-W Hardware Interface Description Page 57 of 76 5.5 Timing Sequence Requirement - For Linux: Estimate Software optimization with a minimum power off period. MV31‐W M.2 PIN#6 Full_Card_Power_Off If in online mode , put to LPM There is no CID_MBIM_MSHOSTSHUTDOWN between PC and MV31‐W on Linux.

  • Page 58: Power Off Timing

    Cinterion ® MV31-W Hardware Interface Description Page 58 of 76 5.5 Timing Sequence Requirement 5.5.3 Power Off Timing VBAT_3.3V Full_Card_Power Off# toff2 PERST# toff1 Figure 30: Power off diagram Table 24: Power Off information Symbol Minimum value Note toff1 400ms PERST# should deasserted before Full_Card_Power_Off# toff2 200ms...

  • Page 59: Warm Boot Restart Timing

    Cinterion ® MV31-W Hardware Interface Description Page 59 of 76 5.5 Timing Sequence Requirement 5.5.4 Warm Boot Restart Timing VBAT_3.3V toff2 Full_Card_Power Off# PECLK ton1 PERST# toff1 ton2 Figure 31: Warm boot restart diagram Table 25: Warm boot restart information Symbol Minimum value Note...

  • Page 60: Figure 32: Modern Standby-D3Cold Entry Flow

    Cinterion ® MV31-W Hardware Interface Description Page 60 of 76 5.5 Timing Sequence Requirement ® BIOS is needed to enable the PCIe root port D3cold capability. Host Device Set PMCSR.PowerState=D3 D3hot Backup MMIO registers in case of future D3cold PME_Turn_Off PME_TO_ACK PM_ENTER_L23 PM_Request_ACK...

  • Page 61: Figure 33: Modern Standby D3Cold

    Cinterion ® MV31-W Hardware Interface Description Page 61 of 76 5.5 Timing Sequence Requirement Host Device Pre ‐requisites: M‐State = M3 D‐ State = D3cold L‐State = L3 DEVICE_WAKE mechanism = Disabled Host wakeup condition Enable PCIe ref clock De‐assert PERST# (drive high) Wake up from Enable PCIe RC sleep mode...

  • Page 62: Electrostatic Discharge

    Cinterion ® MV31-W Hardware Interface Description Page 62 of 76 5.6 Electrostatic Discharge Electrostatic Discharge The 5G M.2 Data Card MV31-W is not protected against Electrostatic Discharge (ESD) in gen- eral. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensi- tive components.

  • Page 63: Reliability Characteristics

    Cinterion ® MV31-W Hardware Interface Description Page 63 of 76 5.7 Reliability Characteristics Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 27: Summary of reliability test conditions Type of test Conditions Standard Shock Test Amplitude: 400G, Waveform: 1/2 sine, 2 msec DIN IEC 60068-2-27...

  • Page 64: Mounting Advice

    Cinterion ® MV31-W Hardware Interface Description Page 64 of 76 5.8 Mounting Advice Mounting Advice Maximum force to the top shielding: 30 N Maximum bending: 0,315 mm (0,75% of 42 mm) Figure 34: Mounting Advice MV31-W_HID_v01.009a 2022-04-27 Public / Preliminary...

  • Page 65: Approval Information

    Cinterion ® MV31-W Hardware Interface Description Page 65 of 76 5.9 Approval Information Approval Information The 5G M.2 Data Card MV31-W has been type approved. The reference setup submitted to type approve the MV31-W consisted of the following components: MV31-W, PC as MMI, Power Supply.

  • Page 66: Table 31: Standards (Statutory Instruments) For Uk

    Cinterion ® MV31-W Hardware Interface Description Page 66 of 76 5.9 Approval Information Table 30: Standards of European type approval Draft ETSI EN 301 489-17 ElectroMagnetic Compatibility (EMC) standard for radio equipment and ser- V3.2.3 vices; Part 17: Specific conditions for Broadband Data Transmission Sys- tems;...

  • Page 67: Table 33: Standards Of The Ministry Of Information Industry Of The People's Republic Of China

    Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Thales Hardware Interface Description. Please see...

  • Page 68: Iec 62368-1 Classification

    Cinterion ® MV31-W Hardware Interface Description Page 68 of 76 5.9 Approval Information 5.9.2 IEC 62368-1 Classification With respect to the safety requirements for audio/video, information and communication tech- nology equipment defined by the hazard based product safety standard for ICT and AV equip- ®...

  • Page 69: Sar Requirements Specific To Portable Mobiles

    Cinterion ® MV31-W Hardware Interface Description Page 69 of 76 5.9 Approval Information 5.9.3 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable 5G M.2 Data Card MV31-W based ap- plications to be evaluated and approved for compliance with national and/or international reg- ulations.

  • Page 70: Reference Equipment For Type Approval

    MV31-W Hardware Interface Description Page 70 of 76 5.9 Approval Information 5.9.4 Reference Equipment for Type Approval The Thales reference setup submitted to type approve 5G M.2 Data Card MV31-W is shown in the following figure LTE / GSM Base Station ANT3...

  • Page 71: Compliance With Fcc And Ised Rules And Regulations

    Page 71 of 76 5.9 Approval Information 5.9.5 Compliance with FCC and ISED Rules and Regulations The Equipment Authorization Certification for the Thales reference application described in Section 5.9.4 will be registered under the following identifiers: FCC Identifier: QIPMV31-W ISED Certification Number: 7830A-MV31W...

  • Page 72: Safety Precaution Notes

    Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Thales assumes no liability for customer’s failure to comply with these precautions.

  • Page 73: Appendix

    Product IMEI code (2D) ESD warning sign Product IMEI Date code 1. Note: At the discretion of Thales, module label information can either be laser engraved on the module’s shielding or be printed on a label adhered to the module’s shielding. MV31-W_HID_v01.009a 2022-04-27...

  • Page 74: Packaging

    Cinterion ® MV31-W Hardware Interface Description Page 74 of 76 6.2 Packaging Packaging 6.2.1 Trays MV31-W is shipped in 5 x 2 ESD trays (dimensions: 229 x 152 x 15mm), pictured in Figure Module orientation can be seen in Figure 37.

  • Page 75: Declaration Of Conformity

    Cinterion ® MV31-W Hardware Interface Description Page 75 of 76 6.3 Declaration of Conformity Declaration of Conformity TBD. MV31-W_HID_v01.009a 2022-04-27 Public / Preliminary...
  • Page 76 THALES DIS AIS Deutschland GmbH Werinherstrasse 81 81541 Munich Germany...

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