HP Compaq dc7900 CMT Specifications page 36

QuickSpecs
Technical Specifications - Communications
Operating Temperature Operating Temperature Operating Temperature Operating Temperature
Operating Humidity Operating Humidity Operating Humidity Operating Humidity
Power Power Power Power
Chipset Chipset Chipset Chipset
Dimensions (L X H) Dimensions Dimensions Dimensions
Connection Connection Connection Connection
Other Features Other Features Other Features Other Features
Safety Safety Safety Safety
EMC EMC EMC EMC
Telecom Telecom Telecom Telecom
Other Other Other Other
DA - 13029 North America — Version 11 — February 9, 2009
32° to 158° F (0° to 70° C)
20% to 90%, non-condensing
Requires a 3.3-V auxiliary power rail on PCI express bus
Uses only one PCI express load (i.e., one grant/request pair), one shared
IRQ, one electrical load
LSI SV92EX – Integrated PCI interface with 3.3-V tolerant buffers and
CardBus support
Complies with PCI express low profile specifications-—6.7 x 2.3 in (17.0 x
5.8 cm) and supports high- and low-profile brackets
Single RJ-11 connector
Digital line protection, call progress monitoring via on-board piezo device,
support for high profile and low profile brackets, PnP ID support
UL recognized to UL 1950, 3
NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO,
SEMKO, CE mark
FCC Part 15, IC ES003, EN 55022, 3
61000-4-6, EN 61000-4-8
FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals
Not available in Korea or the Republic of South Africa.
The SV92EX device is packaged in a 32-pin micro leadless chip carrier
(MLCC). The SV92EX is fully compliant with the PCI Express revision 1.1
specification. WHQL approved; ASPM compliant.
HP Compaq dc7900 Business PC HP Compaq dc7900 Business PC HP Compaq dc7900 Business PC HP Compaq dc7900 Business PC
rd
edition (U.S. and Canada); IEC 950 (TUV,
rd
edition, EN 55024, annex A, EN
Page 36