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1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GRM
03
(1)L/W
Dimensions
3. Type & Dimensions
L
W
T
e
g
e
(1)-1 L
(1)-2 W
0.6±0.03
0.3±0.03
4.Rated value
(3) Temperature Characteristics
(Public STD Code):F(EIA)
Temp. coeff
or Cap. Change
0±30 ppm/°C
5.Package
mark
(8) Packaging
f180mm Reel
D
PAPER
f330mm Reel
J
PAPER
B
Bulk Bag
C
Bulk Case
Product specifications in this catalog are as of Aug.3,2011,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM0335C1HR20WD01-01
CHIP MONOLITHIC CERAMIC CAPACITOR
GRM0335C1HR20WD01_ (0201, C0G, 0.2pF, 50Vdc)
_: packaging code
3
5C
(2)T
(3)Temperature
Dimensions
Characteristics
(2) T
e
0.3±0.03
0.1 to 0.2
(4)
DC Rated
Temp. Range
Voltage
(Ref.Temp.)
25 to 125 °C
50 Vdc
(25 °C)
Packaging Unit
15000 pcs./Reel
50000 pcs./Reel
1000 pcs./Bag
50000 pcs./Case
1H
R20
(4)DC Rated
(5)Nominal
(6)Capacitance
Tolerance
Voltage
Capacitance
(Unit:mm)
g
0.2 min.
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
0.2 pF
±0.05 pF
1
Reference Sheet
W
D01
(7)Murata's
(8)Packaging
Control Code
Specifications and Test
Methods
(Operationg
Temp. Range)
-55 to 125 °C
D
Code
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Related Manuals for Murata GRM0335C1HR20WD01 Series
Summary of Contents for Murata GRM0335C1HR20WD01 Series
- Page 1 CHIP MONOLITHIC CERAMIC CAPACITOR GRM0335C1HR20WD01_ (0201, C0G, 0.2pF, 50Vdc) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment. 2.MURATA Part NO. System (Ex.) (7)Murata’s (8)Packaging (2)T (3)Temperature (4)DC Rated...
- Page 2 SPECIFICATIONS AND TEST METHODS Specification Item Test Method Temperature High Dielectric Type Compensating Type Operating Temperature -55C to +125C R6 : -55C to + 85C R7 : -55C to +125C Reference Temperature : 25C Range C8 : -55C to + 105C E4 : 10C to + 85C F5 : -30C to + 85C L8/R9 : -55C to +150C The rated voltage is defined as the maximum voltage which may be...
- Page 3 SPECIFICATIONS AND TEST METHODS Specification Item Test Method Temperature High Dielectric Type Compensating Type 11 Vibration Appearance No defects or abnormalities Solder the capacitor on the test jig (glass epoxy board) in the Resistance same manner and under the same conditions as(10). The Capacitance Within the specified tolerance capacitor should be subjected to a simple harmonic motion Q/D.F.
- Page 4 SPECIFICATIONS AND TEST METHODS Specification Item Test Method Temperature High Dielectric Type Compensating Type 15 Temperature Cycle The measured and observed characteristics should satisfy the specifications in Fix the capacitor to the supporting jig in the same manner and the following table under the same conditions as (10).
- Page 5 SPECIFICATIONS AND TEST METHODS Specification Item Test Method Temperature High Dielectric Type Compensating Type 18 High Temperature The measured and observed characteristics should satisfy the specifications Apply 200% of the rated voltage at the maximun operating temperature ±3C for 1000±12 hours . Set for 24±2 hours at Load in the following table room temperature, then measure.
- Page 6 P A C K A G I N G G R M / F T y p e There are three type of packaging for chip monolithic ceramic capacitor. Please specify the packaging code. 1.Bulk Packaging(Packaging Code=B):In a bag. Minimum Quantity : 1000(pcs./bag) , Only GR 43S, GR 55E/F : 500(pcs./bag) ...
- Page 7 P A C K A G I N G G R M / F T y p e 2.2 Dimensions of Tape (in : mm) (2)GR 03/15 4.0±0.1 *1,2：2.0±0.05 ＊1 ＊2 +0.1 φ 1.5 Ａ 0.05 Max. Code ...
- Page 8 P A C K A G I N G G R M / F T y p e (4) GR 21/31/32 T:1.0 min. (in : mm) 4.0±0.1 4.0±0.1 ≦ 0.25±0.1 (T 2.0mm) +0.1 +0.1 2.0±0.1 +0.1 +0.1 0.3±0.1 (T:2.5mm) f1.5 －0 0...
- Page 9 P A C K A G I N G G R M / F T y p e Fig.1 Package Chips (in : mm) Chip Fig.2 Dimensions of Reel 2.0±0.5 f21±0.8 Fig.3 Taping Diagram 8.0 max 5±1.5 32 max. 16.5 max.
- Page 10 P A C K A G I N G G R M / F T y p e 2.3 Tapes for capacitors are wound clockwise shown in Fig.3. (The sprocket holes are to the right as the tape is pulled toward the user.) 2.4 Part of the leader and part of the vacant section are attached as follows.
- Page 11 3.2 Case is made by resin of transparence or semitransparency, and appeaser and dimension is shown in Fig.4. There are possibility to change the material and dimension due to some impairment. 3.3 Case must be marked in Customer ‘s part number, MURATA part number, MURATA name, Inspection number and quantity(pcs). JEMCGP-2694T...
- Page 12 Caution ■ Limitation of use Please contact our sales representatives or product engineers before using our products for the applications listed below which require of our products for other applications than specified in this product. ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment ⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment ⑧Disaster prevention / crime prevention equipment...
- Page 13 Caution ■Rating 1.Temperature Dependent Characteristics 1. The electrical characteristics of the capacitor can change with temperature. 1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes. The following actions are recommended in order to insure suitable capacitance values. (1) Select a suitable capacitance for the operating temperature range.
- Page 14 Caution 3.Applied Voltage 1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications. 1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage. (1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
- Page 15 Caution 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied. Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit. 1-1.
-
Page 16: Vibration And Shock
Caution 7.Vibration and Shock 1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance. Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals. 2. Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor. Do not use a fallen capacitor because the quality and reliability may be deteriorated. - Page 17 Caution 2.Information before mounting 1. Do Not re-use capacitors that were removed from the equipment. 2. Confirm capacitance characteristics under actual applied voltage. 3. Confirm the mechanical stress under actual process and equipment use. 4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly. 5.
- Page 18 Caution 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes Infrared Reflow deformation inside the components. In order to prevent Temperature(℃) mechanical damage to the components, preheating is Soldering...
- Page 19 Caution 4-2.Flow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Flow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent Temperature(℃) Soldering Soldering Peak mechanical damage in the components, preheating should...
- Page 20 Caution 4-3.Correction with a Soldering Iron 1. When sudden heat is applied to the components when using a soldering iron, the mechanical strength of the components will decrease because the extreme temperature change can cause deformations inside the components. In order to prevent mechanical damage to the components, preheating is required for both the components and the PCB board.
-
Page 21: Not Recommended
Caution 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs. 6.Electrical Test on Printed Circuit Board 1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board. - Page 22 Caution 7.Printed Circuit Board Cropping 1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is caused by bending or twisting the board. 1-1. In cropping the board, the stress as shown right may cause the capacitor to crack. Try not to apply this type of stress to a capacitor.
- Page 23 Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of a electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
- Page 24 Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1.Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with a suitable rated temperature which will cover the operating temperature range.
-
Page 25: Pcb Design
Notice ■ Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking. - Page 26 Notice 2. Land Dimensions Chip Capacitor Land 2-1. Chip capacitor can be cracked due to the stress of PCB bending / etc if the land area is larger than needed and has an excess amount of solder. Please refer to the land dimensions in table 1 for flow soldering, table 2 for reflow soldering.
-
Page 27: Adhesive Application
Notice 2.Adhesive Application 1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering. The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain the correct bonding strength. The chip's electrode thickness and land thickness must also be taken into consideration. - Page 28 Notice 6.Washing 1. Please evaluate a capacitor by actual cleaning equipment and condition surely for confirming the quality and select the applicable solvent. 2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of electrical characteristics and the reliability of the capacitors. 3.
- Page 29 NOTE 1.Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2.Your are requested not to use our product deviating from this product specification. 3.We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents.
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