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ZTEWelink MF206A Hardware Development Manual

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Hardware Development Guide of
Module Product
MF206A
Version 2.5, 2015-06-18

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Summary of Contents for ZTEWelink MF206A

  • Page 1 Hardware Development Guide of Module Product MF206A Version 2.5, 2015-06-18...
  • Page 2 Legal Information By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as ZTEWelink), you are deemed to have agreed to the following terms. If you don’t agree to the following terms, please stop using the document.
  • Page 3 IMEI in picture Modify the test result in Table 6-6 Modify the name of Table 5-1 to sourceless 2013-05-31 Release as Version 2.1 2013-12-09 Modify the Figure 2-2. Add the contact information All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 4 17. Add chapter 11 of Safety Information 18. Add the chapter 10.3 of Package System Add the description of Suspend and Resume of module in 2015-06-15 chapter 3.10 &3.7 Update the figures of module All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 5 Note: Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips, and press releases Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone, website, instant messaging, E-mail and on-site. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 6: Table Of Contents

    3.4.2 Requirement of Power Supply ................... 30 (U)SIM Card Interface ...................... 31 3.5.1 Description of PINs ......................31 3.5.2 Electric Feature ........................ 31 3.5.3 Application of (U)SIM Card Interface ................32 SD Card Interface ......................32 All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 7 Interactive Application Interface ..................44 3.13 3.13.1 Description of PINs ......................44 3.13.2 Interface Application ......................45 LED Indicator Interface ....................45 3.14 3.14.1 Description of PINs ......................45 3.14.2 Interface Application ......................46 All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 8 Antenna Indexes ....................... 62 5.7.1 Passive Indexes ........................ 63 5.7.2 Active Indexes ......................... 63 5.7.3 Test Methods for Whole-Set Antenna OTA ................ 64 Electric Feature ....................65 Power Supply ........................65 All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 9 Recommended Product Upgrading Plan ................79 Manufacturing Guide ..................80 Design of Steel Mesh ......................80 10.1 10.2 Furnace Temperature Curve ....................81 10.3 Package System ........................ 83 Safety Information ................... 85 All Rights reserved, No Spreading abroad without Permission of ZTEWelink VIII...
  • Page 10 Figure 5–3 RF Interface Testing Console ................55 Figure 5–4 Profile Dimensions of RF antenna console ............55 Figure 5–5 Recommended Receptacles Mode for MF206A ............. 57 Figure 5–6 Transition Circuit ....................59 Figure 5–7 The OTA test system of CTIA ................64 Figure 9–1 Recommended PCB Wielding Panel Design............
  • Page 11 Figure 10–1 Recommended Pattern of Steel Mesh on Wielding panel ........80 Figure 10–2 Furnace Temperature Curve Reference Diagram ..........82 Figure 10–3 The dimensions of Package tray ................. 83 Figure 10–4 Package process of modules ................84 All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 12 Table 5–1 The Cable Consumption ..................56 Table 5–2 Passive Indexes of Main Antennas on PAD Products ..........63 Table 5–3 ZTEWelink Indexes for Mobile Terminal Devices ..........63 Table 6–1 Input Voltage ..................... 65 Table 6–2 Averaged standby DC power consumption ............. 65 Table 6–3 Averaged idle mode DC power consumption ............
  • Page 13 Table 8–4 Reliability Features ..................... 74 Table 8–5 Temperature Testing Result Under Windless Environment ........75 Table 8–6 High/Low-temperature Running & Storage Testing Result ........75 Table 10–1 Curve Temperature Curve Parameter Setting ............81 All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 14: About This Document

    This document provides the hardware solutions and development fundamentals for a product with the ZTEWelink module. By reading this document, the user can have an overall knowledge of MF206A and a clear understanding of the technical parameters. With this document, the user can successfully fulfill the application and development of wireless 3G Internet product or equipment.

  • Page 15: Abbreviations

    Global Standard for Mobile Communications Input/output Light Emitting Diode Power Level Subscriber Identification Module Surface Mount Technology Serial Peripheral Interface UMTS Universal Mobile Telecommunication System WCDMA Wideband Code Division Multi Access All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 16: Product Overview

    Hardware Development Guide of Module Product Product Overview MF206A is a wireless Internet module with LGA interface. A rich set of internet protocols and abundant functions extend the applicability of the module to a wide range of M2M applications such as metering, tracking systems, security solutions, routers, wireless POS, mobile computing devices, PDAs, tablet PC and so on.

  • Page 17: Mechanic Features

    Hardware Development Guide of Module Product Mechanic Features MF206A is a 108-pin LGA encapsulation module. Except for the signal PIN, there are many dedicated heat-dissipation ground wielding panel to improve the grounding performance, mechanical strength and heat-dissipation performance. There are altogether 30 heat-dissipation ground wielding panels, evenly distributed at the bottom of PCB.

  • Page 18: Technical Parameters

    The major features of module can be described from the aspects of mechanic feature, base band, radio frequency, technical standard and environment feature. Table 2-1 is a list of the major technical parameters and features supported by module. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 19: Table 2-1 Major Technical Parameters

    Max. Transmitter Power GSM/GPRS 1800MHz/1900MHz: Power Class 1 (+30± 2dBm) EDGE 850MHz/900MHz: Power Class E2 (+27± 3dBm) EDGE 1800MHz/1900MHz: Power Class E2 (+26 -4/+3dBm) WCDMA2100: ≤-106.7dBm Receiving sensitivity WCDMA1900/850: ≤-104.7dBm All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 20 -45 to 90° C Humidity 5%~ 95% RAS dialup Support GPS/AGPS Support Application Support Text and PDU mode. Point to point MO and MT. SMS Status Report & SMS centre address setting All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 21: Function Overview

    UART signal, SD interface signal, I2C interface signal, module power-on/resetting signal, SPI, main antenna interface, GPS antenna interface and power-supply interface. Figure 2–3 is a diagram of the system connection structure. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 22: Radio Frequency Function

    Working Frequency Band Uplink Frequency Band Downlink Frequency Band 824 MHz — 849 MHz 869 MHz — 894 MHz UMTS850 880 MHz — 915 MHz 925 MHz — 960 MHz UMTS900 All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 23 869 MHz — 894 MHz GSM850 890 MHz — 915MHz 935 MHz — 960MHz GSM900 1710 MHz — 1785MHz 1805 MHz — 1880MHz GSM1800 1850 MHz — 1910MHz 1930 MHz — 1990MHz GSM1900 All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 24: Interfaces

    PIN group 2, the power supply voltage is VDD_P2 PIN internal pull-up PIN internal pull-down 3.1.2 PIN Configuration Diagram The PIN sequence of interfaces on module is defined as shown in Figure 3–1. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 25: Figure 3-1 Pin Configuration Diagram

    LED_RED JTAG_TCK LED_BLUE VPH_PWR JTAG_RTCK VPH_PWR JTAG_TRST_N VPH_PWR GPS_ANT VPH_PWR UART_CTS UART_RFR UART_TXD UART_RXD 100 101 102 SD_DET_N SDCC_DATA0 SDCC_DATA1 SDCC_DATA2 104 105 106 107 SDCC_DATA3 SPI_CS_N SDCC_CLK (Top View) All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 26: Pin Description

    To make the module standby, the AP needs to raise up this low signal. MODULE Module wakes up AP _WAKEUP_AP MODULE_POWER MODULE power-on status indicator LED_GREEN Signal indicator high-current driver. interface All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 27 SPI interface channel signal SPI_CLK SPI clock signal SPI_DATA_MI_SO SPI data IO signal SPI_DATA_MO_SI SPI data IO signal USB_VBUS Power sense for the Pay attention to the internal USB power-on sequence of All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 28 SD card control signal SDCC_CLK SD card clock signal SDCC_DATA3 SD card data signal SDCC_DATA2 SD card data signal SDCC_DATA1 SD card data signal SDCC_DATA0 SD card data signal SD_DET_N Reserved Ground Ground All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 29: Table 3-3 Mandatory Pins Of Module

    It must be able to provide sufficient current in a transmitting burst which typically rises to 2.0A. USB_VBUS Require differential impedance of 90Ω. USB_DP Require differential impedance of 90Ω. USB_DM VREG_RUIM UIM_DATA All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 30: Working Condition

    If it is higher than the maximum value, the module might be damaged All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 31: Feature Of Digital Power Level

    2A. So the power supply capacity for peak current needs to be above 2.5A, and the average current needs to be above 2A.  NOTE: More details about the designing of power supply please refer to Chapter 4 of Power Interface Design Guideline of this document. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 32: U)Sim Card Interface

    VREG_RSIM and GND, and cascade a 33pF capacitor between UIM_CLK, UIM_RST and GND, to filter out the interference by RF signals. It is recommended to cascade a 20ohm resistance on UIM_DATA cable. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 33: Application Of (U)Sim Card Interface

    SD card data cable PIN SDCC_DATA3 SD card data cable PIN SD control clock output can SDCC_CLK SD card clock cable PIN reach up to 20MHz SDCC_CMD SD card control PIN All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 34: Electric Feature

    Figure 3–3 is the reference design diagram for the SD interface. The detection of SD card adopts the polling mode of DATA3 signal cable to judge whether T card is inserted or not. Figure 3–3 SD Typical Application Circuit All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 35: Usb2.0 Interface

    USB2.0 Interface 3.7.1 Description of PINs MF206A has the high-speed USB2.0 interface, which supports both the full-speed mode and the high-speed mode. The main processor (AP) is connected with the module via the USB interface to transmit data. 3.7.2 Electric Feature The USB interface complies with the USB2.0 specifications and the electric features.

  • Page 36: Spi (Serial Peripheral Interface) Bus Interface

    Main input, slave output SPI_MOSI_DATA Main input, slave output 3.8.2 Electric Feature The SPI bus is configured as the master equipment, and there are three modes for SPI: Running mode: Basic running mode. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 37: I2C Bus

    Each equipment is identified by the unique address (such as the micro controller, storage, LCD driver, audio DAC or keyboard interface). Due to the different functions of the equipment, it can be used as both the sender and the receiver. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 38: Electric Feature

    The I2C interface has two working modes with different transmission ratios: standard mode with a speed as high as 100kbps; high-speed mode with a speed as high as 400kbps. Figure 3–6 is the I2C reference circuit design diagram. Figure 3–6 I2C Reference Circuit Diagram All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 39: Uart Interface

    The 4-wires or 2-wires mode can be used for connection. The module interface PWL is 1.8V. If it does not match the PWL of AP interface, it is recommended to add the PWL conversion circuit. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 40: Jtag (Joint Test Action Group) Interface

    DI-PD JTAG reset JTAG_RTCK JTAG return clock JTAG_TCK DI-PU JTAG clock input JTAG_TDO JTAG test data output JTAG_TDI DI-PU JTAG test data input JTAG_TMS DI-PU JTAG test mode select Grounding All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 41: Application Of Jtag Interface

    A simple circuit to do it is as shown in the following Figure 3-9.  NOTE: The resistors R1 and R2 in Figure 3-9 and Figure 3-1 are only the recommended value and they may different according to the users transistor selection. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 42: Figure 3-9 Turn On The Module Using Driving Circuit

    You can reset the module by driving the PON_RST_N to a low level voltage for more than 100ms and then releasing. A simple circuit to do it is as shown in the following Figure 3-10. Figure 3–9 Resetting the Module Using Driving Circuit PON_RST_N ≥100ms Reset pulse All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 43: Power-On/Power-Off Flow

    PWL. After VPH_PWR is established normally, the interval between it to the POWER_ON signal cannot be too short. Refer to T2 parameter. ZTEWelink recommends that VPH_PWR adopt the power-off plan that does not disconnect the power supply.

  • Page 44: Resetting Flow

    The PON_RST_N reset signal of module is the increasing resetting, so it is reset after decreasing this PIN by 100ms. Figure 3-13 is the module resetting flow. Figure 3-14 is the timing of resetting module. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 45: Interactive Application Interface

    Pin Name I/O Type Signal Description AP_READY Module querying AP sleep status MODULE_READY AP querying Module sleep status AP_WAKEUP_MODULE AP wakeup Module MODULE_WAKEUP_AP Module wakeup AP MODULE_POWERON MODULE power-on status indication All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 46: Interface Application

    Description of PINs Table 3–13 Definition of LED PIN Signal Signal Name I/O Type Function LED_GREEN Module signal indicator interface LED_RED Module signal indicator interface LED_BLUE Module signal indicator interface All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 47: Interface Application

    BLUE indicator always on Have been registered to 3G network Have been registered to 3G network, BLUE indicator flashing and there is data service as well. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 48: Power Interface Design Guideline

    Power Supply Requirement The power supply of ZTEWelink LGA Type module is usually recommended to be within the range of 3.4~4.2V. According to the requirement of mobile terminal device, the power supply voltage of module is 3.8V under normal working condition.

  • Page 49: Circuit Requirements Of Power Supply Output

    If the network is in well situation, the peak work current on the module will be small. But if the network is in poor situation, its peak current will be great as shown in Figure 4-1. When ZTEWelink module works under the EDGE/GPRS Time Slot (2-high 6-low) and CLASS 10, if the module works under the 2-high work Time Slot, it requires greater current, and the voltage drop will occur accordingly.

  • Page 50: Recommended Power Reference Circuit

    Can provide well transient current under 2G weak signal environment to satisfy modules requirements, to prevent device from shutdown and Ports re-enumeration as a consequence of the supply voltage drop. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 51: Figure 4-3 Dc/Dc Switching Power Supply

    LDO. The output of LDO, place a capacitors above 2000μ F. The reference power supply circuit design with LDO is as shown in Figure below. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 52: Pcb Layout Guideline Of Power Supply

    The Bypass low ESR capacitor must be placed close to the ZTEWelink module power input pads, or in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to the module is wide enough to ensure a dropless connection even during the 2.5A...
  • Page 53 If your application doesn't have audio interface but only uses the data feature of the ZTEWelink module, then this noise is not so disturbing and power supply layout design can be more forgiving.

  • Page 54: Rf Antenna Design Guide

    RF signal: by LGA wielding panel mode and by RF connector mode. The GPS antenna only supports the access mode of LGA wielding panel. Figure 5-1 is the main antenna connector All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 55: Figure 5-1 Main Antenna Rf Connector Interface

    Hardware Development Guide of Module Product interface, and Figure 5-2 is the Interface of Main Antenna and GPS Antenna Welding Pad. Figure 5-3 shows the main antenna RF connector. Currently, ZTEWelink module adopts the ECT818000157 RF connector testing console from ECT Company.

  • Page 56: Figure 5-3 Rf Interface Testing Console

    The micro stripline or stripline is designed according to the 50ohm impedance, and the dual-L model matching circuit is reserved. RF interface on ZTEWelink module is ECT818000157. Because this type of RF interfaces requires RF cables with smaller diameters and larger consumptions, it is usually recommended not to directly connect RF...

  • Page 57: Rf Cable

    RF137XR4 of GBE RF-1.37 of Shenyu 0.8DS-PBM(1.35) 0.4GHz 0.8GHz ≤1.7 ≤1.5 1.0GHz 1.5GHz ≤2.5 ≤2.2 2.0GHz ≤2.6 2.4GHz ≤3 ≤2.8 3.0GHz ≤3.5 ≤3.4 4.0GHz ≤4 ≤3.8 5.0GHz 5.2GHz 5.8GHz ≤4.5 ≤4.3 6.0GHz All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 58: Design Of Antenna

    RF engineers, baseband engineers, structure engineers, and ID engineers work together to make an estimation for both 2D and 3D design. The antenna interface should have an impedance of 50Ω. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 59: Suggested Antenna Location

    5.3.4 Matching Circuit of Antenna For all products with ZTEWelink module, the antenna is basically connected to the module through RF cables and RF connectors. This section describes two situations. If the RF terminal connector of the module does not match the RF cables used by the antenna, or the...

  • Page 60: Type Of Antenna Rf Cable & Rf Connector

    Shin Din. The antenna RF cable usually adopts a line width of 1.37mm. The antenna RF connector usually adopts Japanese IPX, or HRS, while the price of the latter is higher. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 61: Recommended Antenna Manufacturers

    Yaodeng Electronic Communication Technology (kunshan) Co., Ltd. PCB line guidelines The users of ZTEWelink modules should do as the following guidelines in the process of RF PCB line design: Make sure that the transmission line’s characteristic impedance is 50ohm ;...

  • Page 62: Suggestions For Emc & Esd Design

    10. Keep the antenna line far away from the module power supply lines; 11. If EM noisy devices are present on the PCB hosting the ZTEWelink module, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.

  • Page 63: Esd Design Requirements

    ESD Design Requirements MF206A is embedded on the side of system board, so the user needs to make the ESD protection during design. For the key input/output signal interface, such as the (U)SIM card signal interface, the ESD device should be placed closely for protection.

  • Page 64: Passive Indexes

    Active indexes. There is no universal international standard for mobile terminal products, so mobile terminals are all designed according to the carrier requirements. Table 5-3 describes the requirement of Active indexes by ZTEWelink for Mobile Terminal Devices as a reference to users.

  • Page 65: Test Methods For Whole-Set Antenna Ota

    The main RF instruments are integrated RF test equipment, Spectrum Analyzer, Network Analyzer. The radio equipments, Relay Switch Unit and PC with automatic test software are communicated via GPIB interface. Figure 5–7 The OTA test system of CTIA All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 66: Electric Feature

    GPRS 900 GPRS 850 Note: assumes USB bus is fully suspended during measurements. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 67: Table 6-3 Averaged Idle Mode Dc Power Consumption

    Band II (PCS1900) transmission power Band V (850M) GPRS GPRS1900 Acquired under the maximum GPRS1800 transmission power GPRS900 GPRS850 EDGE EDGE1900 Acquired under the maximum EDGE1800 transmission power EDGE900 All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 68  NOTE: The above average current is acquired under the maximum transmission power. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 69: Technical Index Of Radio Frequency

    The RF index should be tested strictly in accordance with the related testing specifications of 3GPP. The RF indexes of UMTS2100/1900/850 should satisfy the requirements of 3GPP TS 34.121 protocol. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 70: Acquiring Radio Frequency Index

    Table 7–2 Reference Table of Receiving Sensitivity Operating Band Unit 3GPP Protocol Claim Test value ≤-104.7dBm UMTS850 dBm/3.84 MHz -109dBm ≤-104.7dBm UMTS1900 dBm/3.84 MHz -109dBm ≤-106.7dBm UMTS2100 dBm/3.84 MHz -110dBm All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 71: Spurious Emission Index

    3GPP Protocol Claim (dBm) Test value GSM850 Class 4 +33dBm± 2dBm 32.0dBm GSM900 Class 4 +33dBm± 2dBm 32.0dBm GSM1800 Class 1 +30dBm ± 2dBm 29.0dBm GSM1900 Class 1 +30dBm ± 2dBm 29.0dBm All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 72: Receiving Sensibility

    The power measured in bandwidth of 9kHz to 1GHz shall be no more than -36 dBm. The power measured in bandwidth of 1GHz to 12.75GHz shall be no more than -30dBm. And the test result of module in GPRS/GSM/EDGE mode meets the requirement above. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 73: Related Test & Test Standard

    Try Ea & Introduction: Shock GB/T 2423.11 Basic environment experiment of electronic products-Part2:Experiment method Try Fd: Broad frequency band random vibration (General requirement) TIA/EIA 603 3.3.5 TIA Standard-part3-5:Shock Stability All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 74: Description Of Testing Environment

    -30° C 75° C All the indexes are good. working condition Extreme -40° C 85° C Some indexes become working poorer. condition Storage -45° C 90° C Storage environment of module All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 75: Reliability Testing Environment

    Normal high temperature: 75 ° C ZTE standard running Extreme high temperature: 85° C Duration: 24 hours Low-temperature Normal low temperature: -30° C ZTE standard running Extreme low temperature: -40° C Duration: 24 hours All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 76: Reliability Testing Result

    RF test & function test working Pass High-temperature Refer to Table 8-4 RF test & function test working Pass Extreme low- Refer to Table 8-4 RF test & function test temperature working All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 77 RF test & function test high-temperature working Pass Low-temperature Refer to Table 8-4 RF test & function test storage Pass High-temperature Refer to Table 8-4 RF test & function test storage All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 78: Design Guide

    USB of high-speed signal cable is required to have 90ohm differential resistance. For the common signal interface, it is required to design according to ZTEWelink requirements, which needs to comply with the power level of interface signal, so as to prevent the impedance from damaging the module.

  • Page 79: Suggestions For Heat-Dissipation Design

    The module will dissipate heat during the working process, and might also be affected by other high-temperature devices. The heat dissipation is taken into full consideration during the product design, as 30 heat wielding All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 80: Recommended Product Upgrading Plan

    It’s recommended to use the one-click software upgrade tool to upgrade through the USB port provided by ZTEWelink in the Windows system. If the customer wants to upgrade the module in other operation systems, ZTEWelink provides the corresponding reliable tools as well.

  • Page 81: Manufacturing Guide

    It is recommended to design to the mouth of steel mesh on the thermal pad wielding panel to the lattice form. Figure 10-1 shows the recommended pattern for the steel mesh. Figure 10–1 Recommended Pattern of Steel Mesh on Wielding panel All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 82: Furnace Temperature Curve

    <3 ℃ /second 150 ℃ ~200 ℃ Temperature keeping 40~110 seconds Greater than 217 ℃ Wielding 40~70 seconds Above 230 ℃ 15~45 seconds MAX: 245 ℃ Peak temperature MIN: 230 ℃ All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 83: Figure 10-2 Furnace Temperature Curve Reference Diagram

    Seconds  NOTE: More Guide Information about SMT & Baking about the Manufacturing process, please refer to the document named SMT & Baking User Guide of ZTEWelink LGA Module Products.pdf All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 84: Package System

    The dimensions tolerance of tray is between 1mm except the dimensions with ☆ in the Figure below (and the unit of dimensions is mm): Figure 10–3 The dimensions of Package tray The package process of modules is shown as the Figure below: All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 85: Figure 10-4 Package Process Of Modules

    MF206A Hardware Development Guide of Module Product Figure 10–4 Package process of modules All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

  • Page 86: Safety Information

    It’s the responsibility of users to enforce other country regulations and the specific environment regulations. And ZTEWelink does not take on any liability for customer failure to comply with these precautions. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules.
  • Page 87 This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
  • Page 88 RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. All Rights reserved, No Spreading abroad without Permission of ZTEWelink...

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