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Orbotech SPTS Xactix e1 Series Manual

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Xactix
Series System Manual
® e1
Manual Version e1-4.3.0.ae-R3 (2015/04)

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  • Page 1 Xactix Series System Manual ® e1 Manual Version e1-4.3.0.ae-R3 (2015/04)
  • Page 2 Revision Notice This is the 1st release of this publication on September 2015 This document is not for use, reproduction, or disclosure in any form without expressed written consent from SPTS Technologies. Every effort has been made to ensure the accuracy of the information presented herein. However, specifications are subject to change without notice.

  • Page 3: Table Of Contents

    TABLE OF CONTENTS TECHNICAL SPECIFICATIONS…………………………………………………………………………. 4 PRECAUTIONS AND SAFETY INSTRUCTIONS………………………………………………………. 6 General Safety Personal Protective Equipment (PPE) Mechanical Safety Compressed Air Electrical Safety 2.5.1 Live Works Gas Safety 2.6.1 General 2.6.2 Discovering a Gas Leak 2.6.3 Treatment of Exhaust Gases Contamination Gas Lines (Toxic &...
  • Page 4 5.2.1 Sample Loading 5.2.2 Viewing the Log 5.2.3 Other Main Menu items Software operation details 5.3.1 Recipe Storage 5.3.2 Recipe Manager 5.3.3 Performing an Etch 5.3.4 Etch Menu Features 5.3.5 Performing an Etch in the Normal Mode 5.3.6 Performing an Etch in the Normal with Delays Mode 5.3.7 Performing an Etch in the Advanced Normal Mode 5.3.8 Performing an Etch in the High Conductivity Mode Maintenance Menu...
  • Page 5 6.18 Main Chamber Leak Check DECOMMISSIONING…………………………………………………………………………………….. 113 DISMANTLING, DEMOLITION; STORAGE AND TRANSPORT…………………………………… 114 Dismantling and demolition Storage 8.2.1 Storage in the clean room Storage and transport BREAKDOWNS AND REPAIRS……………………………………………………………………….. 115 What to do in case of a problem. Contacting Customer Support 10 DISCARD…………………………………………………………………………………………………...116 Page 3 Manual Version e1-4.3.0.ae-R3.

  • Page 6: Technical Specifications

    1 Technical Specifications 1. The system provides pulsed delivery of xenon difluoride gas, using a single expansion chamber, to a reaction chamber capable of holding a wide variety of samples up to a 6” wafer. 2. Physical Characteristics: a. A table top unit to minimize use of expensive lab space (620mm wide X 780mm deep X 770mm high, plus computer, monitor, keyboard and pump control box).
  • Page 7 c. Set pump down pressure for chamber and expansion chambers when etching with XeF2 from software user interface. (Available with Purchase of the Advanced Recipe Package). d. Digital camera integrated with and controlled by the control software to periodically capture images either at a given time interval or every X pulses, where X is defined by the user in the GUI.

  • Page 8: Precautions And Safety Instructions

    2 Precautions and Safety Instructions WARNING READ THIS MANUAL BEFORE INSTALLING AND USING THE XACTIX E1 SERIES. FAILURE TO DO SO COULD RESULT IN HARM OR INJURY. ALSO, READ THE MSDS FOR XENON DIFLUORIDE. 2.1 General Safety CAUTION : Service personnel must be aware of and understand the risks of exposure to XeF and its by-products.

  • Page 9: Mechanical Safety

    CAUTION Sampling Checks: Before breaking seals undertaking air sampling checks, full Personal Protective Equipment must be worn including a respirator. The immediate area must be well ventilated. All non-essential personnel must be evacuated to a safe area and air sampling warning notices must be displayed in the immediate vicinity.

  • Page 10: Compressed Air

    CAUTION Gasbox Extract: Ensure that the gasbox extract is running before opening the gasbox door. The gasbox extract minimum threshold flow rate value is set during installation and must not be altered. 2.4 Compressed Air CAUTION General Health Risk (Compressed Air): High pressure gases should never be brought into close contact with bare skin;...

  • Page 11: Live Works

    WARNING ELECTRICAL HAZARD (LOCKOUT/TAGOUT REQUIRED): POTENTIALLY LETHAL VOLTAGES (IN EXCESS OF 30 VOLTS AC AND 50 VOLTS DC) ARE PRESENT ON THE EQUIPMENT. TO PREVENT INJURY, ENSURE THE SYSTEM, CIRCUIT OR COMPONENT IS ISOLATED AND ‘LOCKED OFF’ FROM SOURCE SUPPLY PRIOR UNDERTAKING ANY MAINTENANCE OR REPAIR OF THE EQUIPMENT.

  • Page 12: General

    CAUTION Equipment Damage/General Health Risk: The system is designed and tested only to use those gases indicated on system accompanying instructions. modification of the system by the user to handle different gases and/or flow rates may render the system unsafe. Contact SPTS if such a need arises.

  • Page 13: Contamination

    • Packed Solid Reagent Beds into which the waste gas is passed. The chemical reagents used in all such equipment shall be closely monitored to ensure continued efficiency. The ‘spent’ scrubber liquid, or solid, will require disposal in an environmentally acceptable manner.

  • Page 14: Hazardous Substances

    CAUTION Chemical Hazard: Before undertaking air sampling checks, full protective clothing must be worn including a respirator. The immediate area must be well ventilated. All non- essential personnel must be evacuated to a safe area and air sampling warning notices must be displayed in the immediate vicinity.

  • Page 15: Additional Safety Notes

    2.10 Additional Safety Notes To maintain cleanliness within the vacuum system and to prevent contamination, corrosion, and reduce particulate levels; consideration must be given to preventing air from coming into contact with gases or process by-products in the vacuum system. This can be achieved by means of nitrogen purging, for example.

  • Page 16: Description Of The Product; Composition Of The Product

    3 Description of the product; composition of the product ® Thank you for purchasing the XACTIX e1 Series™ xenon difluoride etching system. (xenon difluoride) isotropic silicon etching is particularly well suited to MEMS applications. XeF vapor phase etching exhibits nearly infinite selectivity of silicon to photo-resist, silicon dioxide, silicon nitride and aluminum.
  • Page 17 Etch Remote AC Power AC Power Module Vacuum Pump Figure 1. System Overview. Blue, thin lines indicate electrical and orange, thick, indicates vacuum connections. The top level diagram showing the major components of the system is shown in Figure 1. Within these main components are: •...

  • Page 18: Assembly; Installation; First Operation

    4 Assembly; Installation; First operation 4.1 Preparation 4.1.1 General Requirements of the Site A solid laboratory table capable of accommodating the weight of the e1 Series must be provided. The table should be flat and rigid, and allow adequate airflow and access around the system. Normal clean room and/or laboratory environmental conditions are adequate for the system.

  • Page 19: Space Requirements

    Figure 2. Machine dimensions and locations of utility connections. Note, some systems do not require connection 4. Please contact SPTS for more info. 4.1.3 Space Requirements The suggested free table space for the e1 Series in the clean room or laboratory environment is shown in Figure 2.

  • Page 20: Electrical Services Required

    Figure 4. nXDS6i pump dimensions in mm. Graphic taken from Edwards nXDS6i datasheet. See www.edwardsvacuum.com for more details. The pump is to be connected near the system using the supplied 1.2 m long bellows connection. If necessary, longer connections are possible with customer supplied connections.

  • Page 21: Gas Requirements

    WARNING ANY INTERRUPTION OF THE EARTH CONNECTION INSIDE OR OUTSIDE THE E1 SERIES IS LIKELY TO MAKE THE UNIT DANGEROUS. THE SAFETY EARTH CONNECTION SHOULD FULFILL ALL LOCAL SAFETY REQUIREMENTS. ENSURE THAT THIS IS CHECKED DURING THE PRE- INSTALLATION SITE CHECK. 4.1.6 Gas Requirements •...

  • Page 22: Exhaust Requirements

    4.1.7 Exhaust Requirements There are three exhaust/ventilation connections to the e1 Series: 1. Exhaust connection from the vacuum pump, which is NW25 2. Ventilation connection from the chamber ventilation shroud, which is to be connected to a 3” inside diameter hose 3.

  • Page 23: Installation Material

    WARNING VENTILATION CONNECTIONS SHOULD SUFFICIENTLY INDEPENDENT SUCH THAT VENTILATION SYSTEM FAILURE DOES NOT ALLOW ANY EFFLUENTS DISCHARGING INTO SYSTEM TOWARDS OPERATOR. ALSO, EXHAUST CONNECTION MUST CONFORM WITH LOCAL REQUIREMENTS. 4.1.8 Installation Material • Electrical connectors as required for local electrical outlets •...

  • Page 24: Pre-Installation Checklist

    4.2 Pre-Installation Checklist Subject Requirement Comments Space requirements See above Room temperature 65-75°F (19-24°C) Minimize temperature fluctuations Relative humidity 40-70% 100-120 V ±10% e1 Series and pump mains supply (optional 220-240 V ±10%) includes transient fluctuation, 15 A Single phase 50/60 Hz Earthing Consult local...

  • Page 25: Cylinder And Valve For Xef2

    4.3 Cylinder and valve for XeF2 Figure 5: Xenon Difluoride Lecture Bottle (drawing not to scale). Cylinder size Maximum XeF 0.3 L 0.6 kg 51 mm 253 mm 273 mm 325 mm • Cylinder: Seamless Aluminum • Valve: Stainless steel, angle diaphragm valve and ¼” VCR male outlet Page 23 Manual Version e1-4.3.0.ae-R3.

  • Page 26: Uncrating

    4.4 Uncrating 4.4.1 Receiving the System Inspect the shipping crate for signs of obvious damage encountered during shipment (dents, scrapes, holes, etc.). Also inspect the "Tip n' tell" gauges and ensure that they have not been tripped (blue powder will be in the arrowhead if it was handled roughly). If a gauge has been tripped, this indicates that the crate was handled roughly and/or tilted at high angles during shipment.

  • Page 27: Uncrating The System

    Figure 7. Moving the Crated System 4.5 Uncrating the System WARNING BECAUSE OF THE WEIGHT OF THE E1 SERIES, THREE OR MORE PEOPLE REQUIRED DURING INSTALLATION TO REMOVE THE UNIT FROM THE SHIPPING CONTAINER AND TO POSITION IT INTO ITS FINAL POSITION FOR OPERATION.
  • Page 28 Figure 8. Shock sensor Notice in Figure 8 that there is a shock sensor that should be inspected to determine if the shipment may have been subjected to mishandling. In addition, you should look for any included tip sensors inside of the crate (see Figure 9) for any other indications of mishandling (mishandling is indicated by blue powder in the upper portion of the arrow).
  • Page 29 WARNING BECAUSE OF THE WEIGHT OF THE E1 SERIES, THREE OR MORE PEOPLE REQUIRED DURING INSTALLATION TO REMOVE THE UNIT FROM THE SHIPPING CONTAINER AND TO POSITION IT INTO ITS FINAL POSITION FOR OPERATION. The system should be picked up (with 3 or more people or other appropriate technique) from the bottom, being careful not to damage any external system components, and placed onto a suitable work surface.

  • Page 30: Setup

    4.6 Setup The installation process is described below. To begin the setup of the e1 Series, unpack all items from the boxes, then: Step Number Step Details Completed Level the system using the leveling feet (Figure 10) Setup the computer and plug into customer supplied electrical outlet Set up the display and plug its power supply into customer supplied electrical outlet...
  • Page 31 Figure 10. One of four levelling feet. Figure 11. Close-up of vacuum connection with bellows attached. Page 29 Manual Version e1-4.3.0.ae-R3.
  • Page 32 Figure 12. Edwards nXDS6i pump Figure 13. Pump ballast control should be set to open as show. Page 30 Manual Version e1-4.3.0.ae-R3.
  • Page 33 DeviceNet connection Power connection Figure 14. DeviceNet and power connections to rear of e1 Series. Page 31 Manual Version e1-4.3.0.ae-R3.
  • Page 34 Figure 15. Power controller box. Figure 16. e1 to power controller cable connection. Page 32 Manual Version e1-4.3.0.ae-R3.
  • Page 35 Figure 17. DeviceNet connection on rear of PC. Figure 18. Pump power connection. Page 33 Manual Version e1-4.3.0.ae-R3.
  • Page 36 Figure 19. Rear Gas Connections of system. Figure 20. Set N regulator to approx. 10 psi. Page 34 Manual Version e1-4.3.0.ae-R3.
  • Page 37 CDA inlet connection pressure regulator Figure 21. CDA pressure regulator and connection. Figure 22. Gas box exhaust connection. Page 35 Manual Version e1-4.3.0.ae-R3.
  • Page 38 Shroud ventilation connection Figure 23. Shroud ventillation connection. Page 36 Manual Version e1-4.3.0.ae-R3.
  • Page 39 Figure 24. Showerhead stop. Figure 25. Insert showerhead stop into holes behind chamber. Note, it is not necessary to expose adhesive. Page 37 Manual Version e1-4.3.0.ae-R3.
  • Page 40 Figure 26. Showerhead stop installed. Page 38 Manual Version e1-4.3.0.ae-R3.

  • Page 41: Initial Start-Up

    4.7 Initial Start-up 4.7.1 Safety verification At this point, verify the following points: a) Exhaust ventilation is on and all system exhaust including that for the vacuum pump is properly installed. b) Dry compressed air pressure is between 70 and 100 psi c) Nitrogen pressure is between 10 and 20 psi at the process connection d) Nitrogen is flowing in through the gas box purge connection e) Power is available to the system.
  • Page 42 Power ON Power OFF Figure 28. Main power controls. Press the ON button to start up the e1 Series and the vacuum pump. Since the system has not been running, let the system warm up for 4 hours so that the gas box temperature can stabilize.
  • Page 43 Allow the NORMAL startup routine to complete. The control program will run an automatic system purge routine that sequences the various valves making sure that all of the chambers have been purged. This routine will last approximately ten minutes. At the end of this process, the control screen will display a log in menu as shown below: The e1 Series is now ready for use.

  • Page 44: Description Of Operation; Method Of Use

    5 Description of operation; Method of use The e1 Series performs several activities when the system is turned on, including initializing hardware, purging the chambers, and preparing the software to run. There are three options displayed after the machine initializes the hardware, and this dialog box is shown below. •...

  • Page 45: E1 Series Log In

    5.1 e1 Series Log in The e1 Series is set up so that individual users are required to log in to the system. When starting the e1 Series the prompt below will be displayed. Each operator is required to input their username and password which will be assigned to them by the system administrator.

  • Page 46: Main Menu

    5.2 Main menu Upon a successful login, the main menu will be displayed as shown below which also indicates the software version number. The software version number may be newer than that shown in this manual. The machine status is shown in the bottom left corner. When the main menu is displayed, the chamber is under vacuum and ready for use.
  • Page 47 2. Swing the optional microscope out of the way of the chamber. If the chamber ventilation shroud covering the chamber is not pulled fully forward (see Figure 29), a request to close the shroud will be displayed before venting the chamber. Move the shroud forward (see Figure 30) and acknowledge the prompt.
  • Page 48 Figure 29. Chamber ventilation shroud moved to back. Page 46 Manual Version e1-4.3.0.ae-R3.
  • Page 49 Figure 30. Chamber ventilation shroud pulled forward. Page 47 Manual Version e1-4.3.0.ae-R3.

  • Page 50: Viewing The Log

    Figure 31. Wafer holding pins in place. Figure 32. Wafer holder placed on pins. 5.2.2 Viewing the Log The log may be viewed by clicking on the “View Log” button on the Main Menu. The log file is a database that is queried by beginning date and ending date. The “Today”: button will automatically set the dates to the current month, day, and year.
  • Page 51 If the boxes are left blank, clicking the search button will reveal all history info, displayed in a tabular form. Page 49 Manual Version e1-4.3.0.ae-R3.
  • Page 52 Figure 33. Database Information screen. The export data button allows you to export all of the information shown in the table to a tab-separated text file that can be opened in the program of your choice, such as Microsoft Excel, Microsoft Access, and Microsoft Word, as shown below.
  • Page 53 Besides being able to export the information, a selection from the displayed in the “database information” screen (see Figure 34), the information for a particular date and time can be accessed by highlighting the row of information desired and clicking the “detailed info” button. Note that the file is automatically scrolled to the bottom of the file, the “Top”...

  • Page 54: Other Main Menu Items

    5.2.3 Other Main Menu items At the bottom left side of the main menu are buttons for changing the user’s password and logging out. The log shows all of the operations that have been recently performed. The log can also be useful for accessing the exact start and end times of a run.

  • Page 55: Software Operation Details

    5.3 Software operation details 5.3.1 Recipe Storage To save a recipe, click on the save button located near the top of the “perform etch screen”. The save new recipe screen is pictured below. By using the toggle switch in the middle of the screen users can save the new recipe to their Personal Directory or the accessible to all users Global Recipes directory (the ability to save recipes to the global directory may be turned off for some users as described below).

  • Page 56: Performing An Etch

    5.3.3 Performing an Etch In order to perform an etch, the “perform etch” button in the main menu must be selected. The Xetch will prompt you to enter the lot number of the sample being etched. Press done once number is entered.

  • Page 57: Etch Menu Features

    5.3.4 Etch Menu Features On the right side of the “perform etch” screen a valve schematic of the e1 Series is shown so that the user can monitor the machine operation. In addition to this, at the bottom of the right side of the screen are two counters. The first counter displays how much time has transpired during the etch portion of the cycle.
  • Page 58 If “Soft Stop” is made “TRUE” in the “Etch Parameters” menu, the Xetch will allow the current cycle to finish before ending the entire etch. If the “STOP” button is pressed twice, the Xetch will prompt the above menu (See also “Soft Stop” on page 78). Choosing “Yes, Hard Stop” will end the etch cycle immediately and return the user to the main menu.

  • Page 59: Performing An Etch In The Normal Mode

    At the bottom left side of the main menu are buttons for viewing the e1 Series Log, changing the user’s password, and logging out. The log shows all of the operations that have been recently performed. The log can also be useful for accessing etch information, such as the exact start and end times of a run.
  • Page 60 5.3.5.1 Normal Mode Etching Variables Number of cycles Since the e1 Series is primarily a pulsed xenon difluoride etching system, the duration of etching is controlled by the number of cycles. A cycle consists of the xenon difluoride sublimating to the set pressure in the expansion chamber, etching for a set amount of time and evacuation of the main chamber and expansion chamber.

  • Page 61: Performing An Etch In The Normal With Delays Mode

    5.3.6 Performing an Etch in the Normal with Delays Mode An additional etch mode included with the system is Normal with Delays which allows for a pause between etching cycles. This pause is intended to allow the sample being etched to cool between etching cycles and its screen is shown below: 5.3.6.1 Normal with Delays Mode Etching Variables Number of cycles...

  • Page 62: Performing An Etch In The Advanced Normal Mode

    Due to the slightly elevated temperature inside of the etcher cabinet, you may be able to get considerably higher XeF pressures, however. Pressure Nitrogen can be added into a recipe to improve selectivity. The pressure obtained in the expansion chamber likewise controls the amount of nitrogen introduced into the process chamber. The above variables can be set either by moving the white slider on the scroll bar or by tapping or depressing on the arrows at the top and bottom of the scroll bar to increment each value or by direct entry through the keyboard.
  • Page 63 Etch Time When the valve between the main chamber and expansion chamber is opened the pressure equilibrates and the etching process begins. The etch time is the time between the opening of the valve between the expansion chamber and the process chamber and the opening of the valve between the process chamber and the pump.

  • Page 64: Performing An Etch In The High Conductivity Mode

    5.3.8 Performing an Etch in the High Conductivity Mode The operation of the e1 Series in the high conductivity mode (optional upgrade) is similar to the normal mode; however in the high conductivity mode, there is the ability to flush the chamber between each cycle with nitrogen.
  • Page 65 Due to the slightly elevated temperature inside of the etcher cabinet, you may be able to get considerably higher XeF2 pressures. Pressure Nitrogen can be added into a recipe to improve selectivity. The pressure obtained in the expansion chamber likewise controls the amount of nitrogen introduced into the process chamber. Chill Pressure Between each cycle, the Main Chamber can be pressurized with nitrogen which corresponds to the Chill Pressure setting.

  • Page 66: Maintenance Menu

    5.4 Maintenance Menu WARNING MAINTENANCE MODE SHOULD ONLY BE USED BY THOSE INDIVIDUALS UNDERSTAND RISKS EXPOSURE TO XeF2 AND ARE FULLY TRAINED IN THE USE OF THE MAINTENANCE ACTIVITIES FOR THE SYSTEM. The Maintenance Menu may be accessed via the “Maintenance Menu” button found on the main menu screen.

  • Page 67: Viewing The Full Log

    5.4.1 Viewing the Full Log The full log may be viewed by clicking on the “View Full Log” button within the maintenance menu. The log file is a database that is queried by beginning date and ending date. The “Today”: button will automatically set the dates to the current month, day, and year.
  • Page 68 Figure 34. Database Information screen. The export data button allows you to export all of the information shown in the table to a tab-separated text file that can be opened in the program of your choice, such as Microsoft Excel, Microsoft Access, and Microsoft Word, as shown below.
  • Page 69 Besides being able to export the information, a selection from the displayed in the “database information” screen (see Figure 34), the information for a particular date and time can be accessed by highlighting the row of information desired and clicking the “detailed info” button. Note that the file is automatically scrolled to the bottom of the file, the “Top”...
  • Page 70 For system errors and maintenance related issues, the full log can offer valuable information. To display the details of the full log, click “details” on the “display detailed etch info” screen, shown on next page, to view the log file in its entirety. In the notepad program, the date, time, and actions executed are displayed as shown below.

  • Page 71: User Manager

    5.4.2 User Manager The user manager can be used to add, delete and assign privileges to various users. Only the System Administrator can access the “user manager”. Users can be added using the “New” button, while current users can be removed using the “Delete” button.
  • Page 72 Adding a User A new user can be added to the system by clicking on the new button within the user manager. The edit user screen will appear as shown on next page. The name of the user should be entered into the User Name box and a password then entered, if desired.
  • Page 73 Public recipes allows the recipes of the user to be visible to other users. For users with no privileges a default recipe is required. It is recommended that foundry operator accounts be set up with no privileges. A number of allowed recipes can be given to the user and by checking the box next to the recipe name, it can be enabled.

  • Page 74: Configuration Menu

    5.4.3 Configuration Menu The configuration menu can be edited to change various system operations relating to basic system parameters, startup parameters, standby parameters, maintenance parameters, etch parameters, and validation codes; NOTE: The validation code should only be changed by the system administrator. To edit the configuration menu select the “Edit CFG”...

  • Page 75: System Configuration Menu

    5.4.4 System Configuration Menu The system configuration options screen is displayed below. Each of the options is briefly explained: Card Present Query for the presence of system controller card. This should normally be true for systems. Otherwise, the software will operate in a simulation mode. Machine Present Query for the presence of e1 Series machine.

  • Page 76: Startup Configuration Menu

    Log Low Level Keeps track of all operating machine details in the full log. Full Shutdown Allows for the entire system to be shutdown when the Xetch software is shutdown. Show warnings Allows the system to display on-screen warnings. Such warnings include vacuum related warnings. Automatic Gauge Recalibration This feature allows the user to decide if and how often a gauge calibration will be executed automatically.
  • Page 77 Process Purge Low Allows the user to set the vacuum pressure for the process chamber purge cycles during the machine startup. Exp Purge Cycles Allows the user to set the number of purge cycles for expansion chamber during the machine startup. Exp Purge High Allows the user to set the nitrogen pressure for expansion chamber purge cycles during the machine startup.

  • Page 78: Standby Configuration Menu

    5.4.6 Standby Configuration Menu The standby parameters options screen is displayed on next page. Each of the options is briefly explained. Process Purge High Allows for the user to set the nitrogen pressure in the process chamber for purging the system during the load/unload cycle.

  • Page 79: Gas Bottle Change Parameters Menu

    5.4.7 Gas Bottle Change Parameters Menu The maintenance parameters options screen is displayed on next page. Each of the options is briefly explained Pre-Change Cycles Allows user to set the number of purge cycles prior to disconnecting the XeF2 lecture bottles. Pre-Change High Allows the user to set the nitrogen pressure for the purge cycles prior to disconnecting the XeF2 bottles.

  • Page 80: Etch Configuration Menu

    Post-Change Cycles Allows user to set the number of cycles used to ensure that the XeF2 bottle is operating correctly. Post-Change High Allows user to set the XeF2 pressure for the conditioning cycles following a XeF2 bottle change. Post Change Vac Time Allows user to set the vacuum time for the conditioning cycles following a XeF2 bottle change.
  • Page 81 V3 Keep-open N2 Feature and V3 Keep-open Pressure This feature is typically used in conjunction with etches that use nitrogen. Enabling this feature by setting V3 Keep-open N2 Feature to True allows the expansion chamber side nitrogen valve (V3) to remain open throughout the etch and can reduce cycle times.
  • Page 82 XeF2 Pressure Estimation # Bins The pressure overshoot is also recorded separately for different fill targets. This parameter allows the user to set the number of “bins” that the pressure range between 0T and 8T is divided into. For example, 4 bins would mean that the 4 bins would be from 0 to 1.999T, 2T to 3.999T, 4T to 5.999T, and 6T to 8T.
  • Page 83 Page 81 Manual Version e1-4.3.0.ae-R3.

  • Page 84: Leak-Back Utility

    5.5 Leak-Back Utility To test the leak-back rate of each of the chambers, the Leak-back Utility can be used. This program pumps down all chambers, and then closes all valves for a pre-set amount of time. It then estimates the leak-back rates for each chamber and displays them.

  • Page 85: Main Chamber Purge

    5.6 Main Chamber Purge To repeatedly pump and purge the main chamber to remove residual gas or water vapor, the Chamber Purge Utility can be used. First, set the parameters for the purge routine, including N2 fill high-pressure, high-pressure time, pump-down low pressure, low-pressure time, and number of purge cycles. Then press, “Start”...
  • Page 86 Page 84 Manual Version e1-4.3.0.ae-R3.

  • Page 87: Maintenance And Maintenance Schedule

    6 Maintenance and Maintenance Schedule WARNING SERVICE MAINTENANCE SHOULD ONLY PERFORMED TO THOSE INDIVIDUALS WHO UNDERSTAND THE RISKS OF EXPOSURE TO XEF2 AND ARE FULLY TRAINED IN THE MAINTENANCE ACTIVITIES FOR THE SYSTEM. 6.1 Shutting Down It is strongly recommended that the Xactix e1 be left on and running unless it will not be used for an extended period of time.

  • Page 88: Gas Supply Disconnect And Lockout / Tagout

    Figure 35. Electrical plug lockout and tagout. 6.2.2 Gas Supply Disconnect and Lockout / Tagout When working on the system the user should ascertain if there is any danger to themselves or the system from the pressurized gasses delivered to the system. The required, customer supplied regulators at the gas supply should be used to turn off the gas supply to the system and be the customer supplied lockout / tagout procedure used to prevent accidental pressurization of the system.

  • Page 89: Panel Layouts

    6.2.3 Panel Layouts The panel layouts of the electrical power box (remote unit) and internal electrical units are shown in Figure 36 and Figure 37, respectively. AC Terminal Blocks Figure 36. Remote box panel layout. DC Terminal Blocks and DeviceNet DIGITAL I/O MODULES Figure 37.

  • Page 90: Procedures And Schedules

    6.4 Procedures and Schedules 6.4.1 Maintenance Procedures Task Approx. Frequency Section XeF2 Bottle Change Annual Pump Tip Seal Replacement Annual Chamber/Lid Clean As needed Showerhead Replacement As needed 6.10 6.4.2 Regular Inspection The following schedule for regular inspection of the system is recommended. Task Approx.

  • Page 91: Changing Xef2 Bottle

    6.6.2 Changing XeF2 Bottle WARNING IMPERATIVE THAT THESE DIRECTIONS FOLLOWED EXACTLY TO SAFELY CHANGE THE XENON DIFLUORIDE BOTTLE. USE THE PPE DESCRIBED IN SECTION 2.2. Beginning from the Main Menu screen, click on Maintenance Menu. To change the gas bottle click on the top right button, Change XeF bottle, shown in Figure 39.
  • Page 92 Bottle Connection Bottle Clamp fasteners Figure 38. Bottle connection location. Page 90 Manual Version e1-4.3.0.ae-R3.
  • Page 93 Figure 39. Maintenence menu. The e1 Series will automatically test the pressure of the bottle. This provides a test method to qualify pressure at any point in time as shown below. Please note that the 2 Torr value used below is an illustration and your organization may decide to choose another pressure value to make the bottle change determination.
  • Page 94 NOTE: Clicking Stop Button At Lower Right Can Stop Process At Any Time The e1 Series will proceed to clear out or purge the lines to assure all XeF gas is removed from the system lines. This will take approximately 5 minutes. You will then be instructed as below to remove the gas bottle, refill it, and replace with full bottle.
  • Page 95 Removing Gas Bottle To remove the XeF bottle you have chosen, use a 3/4” standard wrench on the female or larger nut. You will also use a 5/8” standard wrench on the male or smaller nut that is attached to the bottle. The male nut is held firmly, while rotating the wrench on the female nut to loosen the female nut.
  • Page 96 (A.) (B.) (C.) (D.) Figure 40. VCR Gasket Assembly Procedure (Image from www.swagelok.com). Page 94 Manual Version e1-4.3.0.ae-R3.

  • Page 97: Completing Bottle Change

    The e1 Series will ask you to double check that the manual valve is closed on the bottle. When positive that valve is closed click “YES”. If you decide not to change bottle and continue, click “NO”. If NO was selected you will be to the previous screen and must click “YES”...

  • Page 98: Adjusting Nitrogen Flow Rates

    6.7 Adjusting Nitrogen Flow Rates 6.7.1 Main Chamber The fill rate of the Main Chamber is determined by the nitrogen regulator setpoint (see Figure 20). It is normally set to 10 psi, but may be set to higher or lower pressures. Higher pressures will increase the vent rate of the chamber and lower pressures will decrease the rate.

  • Page 99: Showerhead Replacement

    6.10 Showerhead Replacement During normal usage, the showerhead will become cloudy and can’t be cleaned. To maintain optical clarity, it will be necessary to replace the showerhead. To do so, perform a successful unload procedure to open the chamber (see section 5.2.1 which will perform pump purges and vents). Remove the four screws identified in Figure 42 using a 2 mm Allen wrench.

  • Page 100: Gas Box Heater

    inserted far enough to hold the plug in place. The excess of the plug can be trimmed using wire cutters as shown in Figure 45, leaving approx. 1-2 mm exposed so that the plug can be easily removed. Figure 44. Plug insertion with pliers. Figure 45.
  • Page 101 Figure 46. Gax box heater. Page 99 Manual Version e1-4.3.0.ae-R3.

  • Page 102: Vacuum Interlocks

    Figure 47. Gas box heater connector near the base of the expansion chamber. 6.13 Vacuum Interlocks The e1 Series has two vacuum interlocks, one to make certain that the chamber is below approximately 375 Torr of pressure before permitting the source bottle valve (Valve 1) on the gas panel to open. The other interlock prevents all valves on the gas panel from opening if the pressure at the main vacuum line is above approximately 375 Torr.
  • Page 103 Main vacuum switch. Chamber vacuum switch Figure 48. Vacuum interlock switches. Page 101 Manual Version e1-4.3.0.ae-R3.

  • Page 104: Manual Valve Operation

    6.14 Manual valve operation Figure 49. Valve manifold which is mounted on the outside of the gas box towards the front of the system. Page 102 Manual Version e1-4.3.0.ae-R3.

  • Page 105: Ventilation Shroud Interlock

    Figure 50. Valve diagram. WARNING MANUAL OPERATION OF THE VALVES COULD LEAD TO DAMAGE TO THE EQUIPMENT OR HARM TO PERSONNEL. MANUAL VALVE OPERATION INDEPENDENT INTERLOCKS AND SHOULD ONLY BE PERFORMED BY TRAINED PERSONNEL. In service or maintenance circumstances, only to be performed using trained personnel, where manual operation of the valves is necessary, manual valve operation can be accomplished using a small allen wrench or other small, pointed object.

  • Page 106: System Startup Through Normal Issues

    Figure 51. Ventilation shroud interlock with key to override lock. Figure 52. I/O signals are communicated via this unit to the PC. 6.16 System startup through Normal issues If the software startup through the Normal starup procedure does not complete within 1 hour of starting the software, there may be a problem.
  • Page 107 4. Press the STOP button at the lower right of the screen: 5. Acknowledge the following prompt by pressing yes: 6. Log in (if first time use Admin as the Username and no password): Page 105 Manual Version e1-4.3.0.ae-R3.
  • Page 108 7. Go to the maintenance menu by pressing the Maintenance Menu button: 8. Go to Gauge Recalibrate: Page 106 Manual Version e1-4.3.0.ae-R3.
  • Page 109 9. Set number of purge cycles to 0 and Hard Pump Time to 10 minutes: Page 107 Manual Version e1-4.3.0.ae-R3.
  • Page 110 10. Press Start Test and wait for procedure to end. Record the: Process Low Change: Torr Exp Change: Torr which are the values displayed at the completion of the Pressure Sensor Recalibratioin Utility (see below) that correspond to the offsets of the gauges. Please send these values to support@xactix.com and continue on with the procedure.

  • Page 111: Xef 2 Bottle/Valve/Fitting Leak

    6.17 XeF Bottle/Valve/Fitting Leak If a leak at the bottle, the valve, or the fitting is suspected, follow the procedures in this Section. See Figure 53 for possible leak areas that are described in this Section. Note that newer bottles have a welded VCR fitting which virtually eliminates failure area 1 below.
  • Page 112 6.17.1.8 Wait 25 minutes. If the expansion chamber pressure changes by 0.2 Torr or more then there is a probably leak in the connection to the bottle or at the NPT to VCR adapter. Tighten the VCR connection slightly and see if that solves the leak.

  • Page 113: Bottle And Valve Leak Check For Bottle

    6.17.2 Bottle and valve leak check for bottle Completed Step Number Step Notes (Initials) 6.17.2.1 Go to maintenance menu if not already there 6.17.2.2 Make sure the valve on the bottle is open 6.17.2.3 Open V5, V4, and V1 and pump down for 1 minute.

  • Page 114: Main Chamber Leak Check

    6.18 Main Chamber Leak Check If a main chamber leak is suspected, perform the following sequence of tests. Most apparent leaks are actually trapped gas in the showerhead and are not usually leaks. Completed Step Number Step Notes (Initials) 6.18.1 Using the Maintenance Menu (see Section 5.4), Open V10 for 30 minutes...

  • Page 115: Decommissioning

    7 Decommissioning Should your Xactix e1 system need to be decommissioned, please contact SPTS customer support for assistance. Page 113 Manual Version e1-4.3.0.ae-R3.

  • Page 116: Dismantling, Demolition; Storage And Transport

    8 Dismantling, demolition; storage and transport 8.1 Dismantling and demolition Before dismantling or demolishing your Xactix e1 system please contact SPTS customer support for assistance. 8.2 Storage 8.2.1 Storage in the clean room It is strongly recommended that the Xactix e1 be left on and running unless it will not be used for an extended period of tiem.

  • Page 117: Breakdowns And Repairs

    9 Breakdowns and repairs 9.1 What to do in case of a problem. Should your Xactix e1 system not be operating correctly and after a thorough review of the maintenance section you determine that the system needs repair, please contact SPTS customer support for assistance and detailed instructions that may be needed for ordering spare parts and their installation.

  • Page 118: Discard

    10 Discard As the system has been in contact with hazardous materials the system should be discarded by a certified company, familiar with the disposal of hazardous waste. Page 116 Manual Version e1-4.3.0.ae-R3.

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