Related Manuals for Hynix Semiconductor UB-DIMM
Summary of Contents for Hynix Semiconductor UB-DIMM
- Page 1 Rev. H (Oct. 2010) Rev. H (Oct. 2010) Module Handling Guide Book October.2010 Semiconductor Page...
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Page 2: Table Of Contents
Rev. H (Oct. 2010) Contents 1. Introduction 1. Overview 2. Understanding of memory module 3. Module Design Review 4. Memory Module Component Description 5. DDR2 Vs. DDR3 Module Design 6. DDR2 REG-DIMM, FB-DIMM Vs. DDR3 REG-DIMM Design 2. Module Handling Guide Page... -
Page 3: Introduction
Rev. H (Oct. 2010) 1. Introduction 1. Overview We have analyzed the causes of failure products for a long time. Most failure products are related with wrong handling and mechanical damages. Those causes can raise the problem like booting failure and wrong operation. -
Page 4: Understanding Of Memory Module
Rev. H (Oct. 2010) 1. Introduction 2. Understanding of memory module Memory Module ..? It is made by Many Memory IC‟s at the Printed Circuit Board Register DIMM Server Fully Buffered DIMM Unbuffer DIMM Desktop SODIMM Notebook Page... -
Page 5: Module Design Review
Rev. H (Oct. 2010) 1. Introduction 3. Module Design Review : Weak Point (Component Crack, Damage) Major Cause is “Handling” UB-DIMM (Un-Buffered DIMM) : Weak Point (PCB Damage, Scratch). Major Cause is “Socket or Socket JIG” : Weak Point (Component Crack, Damage) Major Cause is “Handling”... -
Page 6: Memory Module Component Description
Rev. H (Oct. 2010) 1. Introduction 4. Memory module component Description Component Picture Description MLCC is the abbreviation of “Multi layer Ceramic Capacitor”. MLCC A/R is the abbreviation of “Array Resister”. C/R is the abbreviation of “Chip Resister”. Chip Resister PCB is the abbreviation of “Print circuit board”. - Page 7 Rev. H (Oct. 2010) 1. Introduction 5.DDR2 Vs. DDR3 Design (1/4) DDR2 Package (FBGA Type) DDR3 Package (FBGA Type) Force Pressure on FBGA Package FBGA: Ball may not be operated as buffer PCB Bow Ball Crack Force Force DDR2 And DDR3 Package is used same package type 1.
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Page 8: Ddr2 Vs. Ddr3 Module Design
As “0805” Cap height is higher than IC Height, “Cap” crack occur. Difference of DDR2 Vs. DDR3 UB-DIMM 1. „0402‟ Type Cap is cracked easily on small pressure as compared with “0603” Type Cap. 2. As “0805” Cap height is higher than IC Height, “Cap” crack occur. - Page 9 Rev. H (Oct. 2010) 1. Introduction 5.DDR2 Vs. DDR3 Design (3/4) DDR2 REG-DIMM DDR3 REG-DIMM DRAM IC DRAM IC DRAM IC of the top point is cracked easily DRAM IC of the top point is cracked easily by external damage by external damage „0402‟...
- Page 10 Rev. H (Oct. 2010) 1. Introduction 5.DDR2 Vs. DDR3 Design (4/4) DDR2 SO-DIMM DDR3 SO-DIMM „0402‟ Type Cap „0402‟ Type Cap „0402‟ Type Cap crack easy as compared „0402‟ Type Cap is cracked easer than with “0603” Type Cap „0603‟...
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Page 11: Ddr2 Reg-Dimm, Fb-Dimm
Rev. H (Oct. 2010) 1. Introduction 6.DDR2 REG-DIMM, FB-DIMM Vs. DDR3 REG-DIMM Design (1/1) DDR2 REG-DIMM, FB-DIMM DDR3 REG-DIMM 3.5㎜ 3.5㎜ [REG-DIMM ] [REG-DIMM, Unused Full Cover ] Approximately Approximately 7㎜ 7㎜ Approximately Approximately [ Full Cover Type FB-DIMM ] [REG-DIMM, Used Full Cover ] Difference of DDR2 REG-DIMM, FB-DIMM Vs. - Page 12 Rev. H (Oct. 2010) 2. Module Handling Guide (Common) Proper Handling Wrong Handling “Anti-ESD Wrist Strap” Belt is contacted on Skin, Not Cloth Or Glove. Page...
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Page 13: Module Handling Guide
Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Strap Check : No. Strap Check : OK “Anti-ESD Wrist Strap” should be Applied. When using Strap, You Must Check the “Strap” Ground your Strap at the Machine. Page... - Page 14 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Don’t Drop to the Floor. No Picture Don‟t Drop to the Floor. Reject mode : Component Crack, PCB Damage, Scratch Etc. Page...
- Page 15 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Don’t Handle product at non-grounded Table Product should be handled at Conductive Mat All Product should be put at Anti-ESD Area. Product should be handled at Conductive Mat or Grounded Table. Page...
- Page 16 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling No Picture Handling with care (To Prevent “PCB Bow”) Especially, FBGA type Product should be Handled with Care Reject mode : IC Ball Crack etc. Page...
- Page 17 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Don‟t Grab Two Modules!! One Module Handling!! Reject mode : IC Crack, Component Crack, Tab Scratch etc. Page...
- Page 18 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Don‟t Push the Edge of Heat Spreader Excessive force Excessive force Reject mode : IC Ball Crack, IC Body Crack etc. Page...
- Page 19 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Don‟t work on Naked Hands. Put on gloves !! Reject mode : Tab Contamination (Finger Print, Grease etc.) Page...
- Page 20 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling No Picture Running System, Don‟t Touch the Heat Spreader of FB-DIMM. (FB-DIMM) Because the Surface of Heat Spreader is “Very Hot” “Caution” - Be careful “Burn” !! Page...
- Page 21 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Unstable Handling. Carrying Module Tray, you must move to hold a tray with both hands.. Carrying Module Tray, you must move to hold a tray with both hands. Don‟t hold a tray with one hand.
- Page 22 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Module should be put at the straight Tray If you use a wrong Tray, Product is damaged by falling or overlapping. Module should be put at the straight Tray. If you use a wrong Tray, Product is damaged by falling or overlapping.
- Page 23 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Use with “Both hands” Don’t insert with “One Hand” and Don’t insert on a tilt Inserting Module, We Use with “Both Hands” Don‟t insert with “One Hand” and Don‟t insert on a tilt Reject mode : PCB damage, Scratch etc.
- Page 24 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Insert correctly the Module in Tray When you insert the Module in Tray, You don‟t overlap the module with neighboring module. Reject mode : PCB damage, Component Crack etc. Page...
- Page 25 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Don’t put much pressure on a module when inserted. You check to put straightly and then you insert the module. You check to put straightly and then you insert the module. Don‟t put much pressure on a module when inserted.
- Page 26 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Operation Order Don’t grab component or IC area When you insert FBGA Module, you don‟t grab component or IC area and you push top side. (Inserting Operation Order : ①Insert Module on Socket ②Push the Top side of PCB ③Hook side latch) Reject mode : IC Ball Crack, Component crack etc.
- Page 27 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Operation Order Don’t extracting with “One Hand” and Don’t extracting on a tilt. Extract Operation Order : ①Unhook the Latch. ②Extract module in Socket (Attention : When unhooking the Latch, Module push slowly Latch not to Bound ) Don‟t extracting with “One Hand”...
- Page 28 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling No Picture Inserting/extracting Module, Be careful not to touch the neighboring module. Don‟t drop module at Mother board and Be careful not to touch the neighboring component. Reject mode : Component Crack, Scratch, Damage etc. Page...
- Page 29 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Inserting Module, Check the PCB notch position. Don‟t put much pressure on a module when inserted. Reject mode : Tab Damage etc. Page...
- Page 30 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling No Picture Inserting Module, Vertically Push the Module. Don‟t Push Front and Don‟t wave when Inserting/extracting. Reject mode : IC Ball Crack etc. Page...
- Page 31 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling After fully insert the module into the socket , Press it proper force. (※Caution!! Don‟t touch passive components on the module.) If insufficiently insert or excessively press the module into the socket, it has caused faults as below. Reject mode : IC Ball Crack, Tab Scratch Excessive force SO-DIMM...
- Page 32 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling No Picture Inserting the Module, Be careful to be crashed into a projecting part. Before inserting the Module, check the PCB Notch position. Reject mode : IC Ball Crack, PCB Damage. Page...
- Page 33 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Inserting Module, Be careful of PCB Notch damage. By Incompletely Inserting, Damage is Occurred Reject mode : PCB Notch Damage, IC Ball Crack. Page...
- Page 34 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Inserting Module, Be careful of Component damage. Please Check The Module Alignment. Reject mode : Component Crack. Page...
- Page 35 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Avoid component touching press in the side of the memory module When You Insert The Memory Module, Be careful of FBGA ICs or Component damage. Please Avoid component touching and press in the side of the memory module. Reject mode : IC Ball Crack, Component Crack.
- Page 36 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Don’t incompletely open the key board. Completely open the key board Notebook Board Notebook Board If the socket is located in the key-board, Completely open the key-board. And carefully insert the module. Reject mode : IC &...
- Page 37 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling “Insert” Operation Order The Front View The Rear View “Insert” Operation Order : ① Insert Module in Socket with an inclination of 45 degrees. ② Avoid component touching and Press in the side of the module. When you insert FBGA Module, you don‟t grab component or IC area and you push top side.
- Page 38 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Proper Excessive Slow + Smooth Fast + Heavy at Edge Force Force Notebook Board Notebook Board Solder Joint Crack Fail Mechanism due to heavily press Please, Press a Module with the Proper Force. Reject mode : IC Ball Crack, Component Crack.
- Page 39 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling First Second After Completely Inserting the Module at the lower socket, Insert the next Module Pleas, Don‟t insert two Modules at the same time Reject mode : IC Ball Crack, Component Crack etc. Notebook Board Page...
- Page 40 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling “Extract ” Operation Order “Extract” Operation Order : ①Unhook the Latch. ②Extract module in Socket with an inclination of 45 degrees. When you extract FBGA Module, you don‟t grab component or IC area. Reject mode : IC Ball Crack etc.
- Page 41 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Excessive Proper Slow + Smooth Fast + Heavy at Edge Force Force Insert Insert Notebook Board Notebook Board Be Careful !! Don‟t Press Module by excessive force Don‟t strike Module against the lower Module Page...
- Page 42 Rev. H (Oct. 2010) 2. Module Handling Guide Proper Handling Wrong Handling Excessive Fast + Heavy Force Proper Slow + Smooth Force Notebook Board Notebook Board Red circle area is damage source Carefully insert the module into the socket . Please, Press the module with the proper force..
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