Summary of Contents for FE P633A Series
- Page 1 Fuji Small IPM (Intelligent Power Module) P633A Series 6MBP**XS*060-50 Chapter 6 Mounting Guideline and Thermal Design Application Manual October 2021 MT6M08855 a...
- Page 2 Cautions This Instruction contains the product specifications, characteristics, data, materials, and structures as of June 2021. The contents are subject to change without notice for specification changes or other reason. When using a product listed in this Instruction be sure to obtain the latest specifications. The application examples in this note show the typical examples of using Fuji products and this note shall neither assure to enforce the industrial property including some other rights nor grant the license.
- Page 3 Chapter 6 Mounting Guideline and Thermal Design 1. Soldering to PCB 2. Mounting to Heat sink 3. Heat Sink Selection MT6M08855 a © Fuji Electric Co., Ltd. All rights reserved.
- Page 4 1. Soldering to PCB • The product’s temperature during soldering might exceed the maximum storage temperature. To prevent damage to the product and to ensure reliability, please use the following soldering temperature. Table 6.1 Soldering temperature and duration Methods Soldering Temp. & Time Dip soldering 260±5 C, 10±1sec...
- Page 5 External Heat sink 100mm Fig.6-2 The measurement point of heat sink flatness In order to achieve good heat dissipation, thermal grease with high thermal conductivity should be applied evenly to the contact surface between the product and the heat sink. The stencil mask method (Fig.
- Page 6 3. Heat Sink Selection • Please make sure that the junction temperature T should not exceed the maximum junction temperature rating for safe operation. Heat sink should be designed to ensures that T is always below the maximum junction temperature rating even during abnormal conditions such as overload operation as well as during rated load.