LB-Link BL-M8821CS1 Quick Start Manual

LB-Link BL-M8821CS1 Quick Start Manual

Ieee 802.11 a/b/g/n/ac 1t1r wlan with bluetooth2.1/4.2 with sdio and hs-uart mixed interface

Advertisement

Quick Links

IEEE 802.11 a/b/g/n/ac 1T1R WLAN with Bluetooth2.1/4.2 with SDIO and
Customer
Date
Model Name
Part NO.
ENGINEER
ENGINEER
BL-M8821CS1
SPECIFICATION
HS-UART MIXED INTERFACE
Version: 1.0
Blink Approve Field
QC
Customer Approve Field
QC
BL-M8821CS1
MANUFACTORY
0
SALES
PURCHASING

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the BL-M8821CS1 and is the answer not in the manual?

Questions and answers

Summary of Contents for LB-Link BL-M8821CS1

  • Page 1 BL-M8821CS1 SPECIFICATION IEEE 802.11 a/b/g/n/ac 1T1R WLAN with Bluetooth2.1/4.2 with SDIO and HS-UART MIXED INTERFACE Version: 1.0 Customer Date Model Name BL-M8821CS1 Part NO. Blink Approve Field ENGINEER SALES Customer Approve Field ENGINEER MANUFACTORY PURCHASING...
  • Page 2: Table Of Contents

    B-LINK ELECTRONIC CO., LTD in shenzhen Contents 1. General Description ..........................2 2. The range of applying ........................... 2 3. Product Specification ..........................2 3.1 Function Block diagram ..........................2 3.2 Electrical and Performance Specification ....................3 3.3Power Supply DC Characteristics ........................ 4 3.4 Product Photo ............................
  • Page 3: General Description

    B-LINK ELECTRONIC CO., LTD in shenzhen 1. General Description BL-M8821CS1 is a small size and low profile of WiFi+BT combo module with LGA (Land-Grid Array) footprint, board size is 12mm*12mm with module height of 2.35mm. It can beeasily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products.
  • Page 4: Electrical And Performance Specification

    B-LINK ELECTRONIC CO., LTD in shenzhen 3.2 Electrical and Performance Specification Item Description Product Name BL-M8821CS1 Major Chipset RTL8821CS Host Interface SDIO 1.1/ 2.0/ 3.0 WiFi: IEEE802.11a, IEEE802.11b, IEEE802.11g, IEEE802.11n, IEEE802.11ac, BT: BT V2.1 BR+EDR, BT V3.0+HS, BT V4.0 LE+ BR/EDR , BT V4.1, BT V4.2 Standard BT:2.402~2.48GHz(BT)
  • Page 5: Power Supply Dc Characteristics

    B-LINK ELECTRONIC CO., LTD in shenzhen Working Temperature -10°C to +50°C Storage temperature -40°C to +85°C 3.3Power Supply DC Characteristics unit: mA Vcc=3.3V,T = 25 °C, Supply current Typ. Standby (RF disabled) 802.11b 1Mbps 11Mbps Supply current Typ. Max. Typ. Max.
  • Page 6: Product Photo

    B-LINK ELECTRONIC CO., LTD in shenzhen 3.4 Product Photo Bottom 3.5 Mechanical Specification Tolerance: +-0.15mm...
  • Page 7: Product Pin Definition

    B-LINK ELECTRONIC CO., LTD in shenzhen 3.6 Product Pin Definition Pin No: Function Description Grond WIFI/BT_ANT WIFI/BT_ANT Grond BT_WAKE HOST wake-up Bluetooth device BT_HOST_WAKE Bluetooth device to wake-up HOST VABT Battery LDO input,5.5V-2.8V 10,11 Shared with GPIO9 This Pin Can Externally Shutdown the RTL8821CS WL_DSI# WLAN function when WL_DIS# is Pulled Low.
  • Page 8: Supported Platform

    B-LINK ELECTRONIC CO., LTD in shenzhen SUSCLK_IN Shared with EECS. External 32K or RTC clock input PCM_DOUT PCM Data output PCM_CLK PCM Clock PCM_DIN PCM data input PCM_SYNC PCM sync signal 29,30 Grond Grond Shared with GPIO11 This Pin Can Externally Shutdown the RTL8821CS BT_DIS# WLAN function when BT_DIS#is Pulled Low.
  • Page 9: Peripheral Schematic Reference Design

    B-LINK ELECTRONIC CO., LTD in shenzhen 5. Peripheral Schematic Reference Design 6. Package Information...
  • Page 10: Typical Solder Reflowprofile

    B-LINK ELECTRONIC CO., LTD in shenzhen 7. Typical Solder ReflowProfile 8. Precautions for use 1. Pls handle the module under ESD protection. 2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature 245℃. 3. Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity <...
  • Page 11 FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’...
  • Page 12 Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.

Table of Contents