I. Maintenance platform/tool/equipment preparation requirements
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1. Platform requirements:
Rubber blanket repair workbench (workbench needs to be grounded), anti-static wristband and grounding.
2. Equipment requirements:
Constant temperature soldering iron (350℃ - 380℃) and pointed soldering iron tip are used for soldering small patches such as chip
resistors and capacitors; heat gun, BGA rework station are used for chip/BGA disassembly and soldering; multimeter with soldering steel
pin and heat-shrinkable T bush is used for easy measurement (Fluke is recommended); Oscilloscope (Agilent recommended), network
cable (requirements: Internet connection, stable network)
3. Requirements for test tools:
APW12 power supply (APW12_12V-15V_V1.2 and power adapter cable (self made: use thick copper wires to connect the power supply
at positive and negative poles and the hashboard. It is recommended to use 4AWG copper wires with a length of 60cm or less) for the
hashboard. Use the test fixture of the V2.2010 control board. The positive and negative poles of the test fixture need to be installed with
discharge resistors. It is recommended to use a cement resistor of 25 ohms and more than 100W.
4. Maintenance auxiliary materials/tool requirements:
Solder paste column M705, flux, board washing water with absolute alcohol; board washing water is used to clean up the solder residue
after repair; thermal gel (specification: Fujipoly SPG-30B) is used to smear the surface of the chip after repair ;
ball-planting steel mesh, solder absorption wire, solder ball (the ball diameter is recommended to be 0.4mm); when replacing a new chip,
you need to tin the chip pins and then solder to the hashboard, and then lock large heat sinks after applying thermal gel evenly on the chip
surface.
1) Barcode scanning gun (purchase reference link: https://item.jd.com/11829261868.html)
2) Port adapter board RS232/TTL adapter board 3.3V
(Purchase reference link: https://detail.tmall.com/item.htm?spm=a230r.1.14.6.751533f7AP9fR8&id=583960428696)
3) Self-made short-circuit probe (use pin wire for welding, require the heat-shrinkable T bush, prevent short circuit between probe and
small heat sink)
5. Common maintenance spare material requirements:
0402 resistance (0R, 51R, 10K, 4.7K,); 0402 capacitor (0.1uf, 1uf)
1. Pay attention to the operation method when replacing the chip. After replacing any accessories, the PCB board shall have no obvious
deformation. Check the replacement parts and the surrounding parts for open circuit and short circuit issues.
2. The maintenance operators must have certain electronic knowledge, more than one year of maintenance experience, and be proficient in
BGA/QFN/LGA package soldering technology.
3. After repairing, the hashboard must be tested for more than two times to be OK before it can pass!
4. Check whether the tools and hashboard testers can work normally, determine the maintenance station to test software parameters, test
fixture versions, etc.
5. In the test of repairing and replacing the chip, the chip needs to be tested first, and then the function test shall be performed after passing.
The function test must ensure that the small heat sink is welded qualified. When installing the large heat sink, the surface of the chip must
be evenly coated with thermal gel and the cooling fan shall be at full speed. When using the chassis to dissipate heat, 2 hashboards should
be placed at the same time to form an air duct.
6. When measuring the signal, use 4 fans as assistance for heat dissipation, and the fans shall maintain full speed.
II. Maintenance requirements
1
S19 Maintenance Guide
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