Main Microphone - Xiaomi Redmi note3 Schematic Diagrams

6
D
Earphone Audio
Note: 60-1
R6005 0R
[6] CODEC_HPH_R 0201
R6003 0R
[6] CODEC_HPH_L 0201
Note: 60-2
C
Schematic design notice of "60_PERI_AUDIO_IO" page.
Note 60-1: Part # of BEAD6002, BEAD6003, BEAD6004 and BEAD6005
needs changed to "BLM18BD102SN1" for high THD
performance (-90dB) but this BOM change will results in FM
RSSI 10dB degraded .
Note 60-2: optimize headphone pop noise. The recommended value of this resistor is 33R.
To reserve a resistor in HPL and HPR in series connection both in order to
Note 60-3: TO Reduce cross talk, Please route the Earhpone_GND between L/R chanel
Note 60-3: To eliminate Plug in and out Recognize issue C6049 should be 100nF
Earphone MICPHONE
[6] MICBIAS1
Close to BB Close to MIC
[6] AU_VIN1_N
AU_VIN1_N1
C6019
0201
C6020
33pF
GND
0201
100pF
C6021
0201
33pF
[6] AU_VIN1_P
R6011 1K
[6] ACCDET 0201
B
Secondary MIC
CE ÈÏ֤ʱ,Èç¹ûÓöµ½¹¤Æµ¸ÉÈÅÍƼö0B4015R-423G-XD9RAC-BD-0MIC
D101
MICBIAS2 [6]
SILICON MIC
Route as differential pair
HFJ100505T-102Y-N
GND_MIC
HFJ100505T-102Y-N
ESD6013 ESD6007
C6012 ESD6010
100nF
GND
GND GND
together then single via to main GND
A
5
nokia,L-R-MIC-GND
default Iphone,L-R-GND-MIC
[2,3,5,6,7,9,10,11,14,15,16,19,20,21,23] VIO18_PMU
Note: 60-4 100nF
C6049
CON6001
close to IC GND AJ010-20342A01D
Route the GND between L/R chanel
close to connector
Note: 60-3 AJ01356326-R
R6002 47K
[5] EINT13_HS_DET 0201
B6007 2
GND
[6] EARPHONE_GND
SBJ100505T-182Y-N
B6005 3
HPH_R
SBJ100505T-182Y-N
5
B6013
GPIO93_SPK_EN 6
PBY160808T-181Y-N HS_DET
0201
R6031 1K
B6003 4
HPH_L
[18]
B6001 HFJ100505T-102Y-N 1
MIC_IN
HP_MIC
HFJ100505T-102Y-N B6014
C6009 C6010 PBY160808T-181Y-N
ESD6003
ESD6004 C <= 1pF
0201 0201 C6002
33pF 33pF
0201
1nF
Single via to
GND
GND plane
C <= 1pF
GND GND
GND GND
L6001 0R
0201
FM_ANT
FM_RX_N_6630
R6007 0R
0201
GND

Main microphone

Analog MIC
Close to CON6001
Close to BB
MAIN_MIC_P
C6016 4.7uF [22]
GND GND of C6018(10uF) and
C6024
headset should tie
J1809
0201
100pF
together and single via to
MAIN_MIC_N
[22]
GND plane
C6028 C6029
tie together and single via to
0201 0201
GND plane 33pF 33pF
HP_MIC [18]
GND
REC
Close to MIC
Close to BB
B6011
2
AU_VIN2_P [6] N
1
P
C6013
U2001 REC6001
0201
B6006 100pF
AU_VIN2_N [6]
ESD6012 ESD6011
2
N
C6017 C6018 1
P
REC6002
0201 0201
33pF 33pF
GND GND
GND
4 3
SPEAKER
[16]
[16]
AU_VIN0_P
[6]
U2001
AU_VIN0_N
[6]
B6008
AU_HSN [6]
C6033
PBY160808T-181Y-N
B6009
0201 AU_HSP [6]
100pF
PBY160808T-181Y-N
C6034 C6032
0201 0201
33pF 33pF
GND GND
2
SPEAKER OPTION2
0R
CODEC_SPKP R6013 1 2 SPKR_OUT_P_R
[7] 0402
0R
R6014 1 2 SPKR_OUT_M_R
0402
CODEC_SPKN
[7]
R/0402/0/R/5%-MI
[6,7,8,9,15,19,20,21,22]
VSYS
C6048 C6007
4.7uF
100nF
2.2uF
C6003
VSYS
D1
C2P
A4
GPIO93_SPK_EN SHDN
[5] B1
GPIO93_SPK_EN C2N
B2
C2N
C6004 R6025 3K
[6] AU_LORP_EXPA 0201
U6001 B4 L6022 0R
VOP
A2 AW8738 0603
AU_LORP_EXPA INN SPKR_OUT_P
C6030
L6023 0R
D4
VON 0603
0201 SPKR_OUT_M
A1
INP
C6008 R6026 3K C6039
[6] AU_LORN_EXPA 0201 D3
PVDD
AU_LORN_EXPA 0201
1nF
C836£ºwhen use AW8145 please use 1uF CAP;when use AW8155 or AW8155A please use 0 ohm res
1
REVISION RECORD
LTR ECO NO: APPROVED: DATE:
[22]
SPKR_OUT_P
[22]
SPKR_OUT_M
C6040
0201
1nF
COMPANY:
<Company Name>
TITLE:
<Title>
DRAWN: DATED:
<Drawn By> <Drawn Date>
CHECKED: DATED:
CODE: SIZE: DRAWING NO: REV:
<Checked By> <Checked Date>
QUALITY CONTROL: DATED: <Code> A0 <Drawing Number> <Revision>
<QC By> <QC Date>
RELEASED: DATED:
<Released By> <Release Date> <Scale> 18 23
SCALE: SHEET: OF
D
C
B
A