Samsung LE32A676A Service Manual page 146

5. Exploded View & Part List
Level Location No.
....4 T0568
....4 T0568
....4 T0568
....4 T0568
....4 T0568
....4 T0568
....4 T0568
....4 T0568
....4 T0568
....4 T0568
....4 T0568
....4 T0568
....4 T0568
....4 T0568
....4 T0568
....4 JA3003
....4 JA3004_4HD
....4 JA3005
....4 CN7777_TES
....4 CN330
....4 CN330
....4 M0018
.....5 IC520
....4 M0018
.....5 IC115
....4 M0018
.....5 IC115
....4 R110
....4 R110
....4 R110
....4 T0077
...3 T0066
...3 HDCP
....4
...3 T0066
...3 JA333
...3 JA333
...3 JA333
..2 M0596
...3 T0245
...3
....4 SUB05
....4 D105
....4 D0254
....4 Q101
....4 Q409
....4 IC112
....4 IC113
....4 IC113
....4 IC012
....4 T0170
5-90
Code No.
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001569 BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
3301-001594 BEAD-SMD;90ohm,2.0*1.2*1.3mm,-,TP,-,-,-
3701-001367 CONNECTOR-HDMI;19P,2R,FEMALE,SMD,AU
3701-001367 CONNECTOR-HDMI;19P,2R,FEMALE,SMD,AU
3701-001367 CONNECTOR-HDMI;19P,2R,FEMALE,SMD,AU
3710-002111 SOCKET-BOARD TO BOARD;60P,2R,0.5MM,SMD-S
3711-005925 HEADER-BOARD TO CABLE;BOX,51P,1R,0.5mm,S
3711-006374 HEADER-BOARD TO CABLE;BOX,41P,2R,1.25mm,
BN97-02200A ASSY MICOM;T-AMBDEUS,N59A,2008.01.31,090
0903-001552 IC-MICROCONTROLLER;WT61P8-RG480WT,LQFP,4
BN97-02200B ASSY MICOM;T-AMBDEUM,N59A,2008.01.31,110
1107-001415 IC-FLASH MEMORY;29W320D,4Mx8/2Mx16Bit,TS
BN97-02200C ASSY MICOM;T-AMBDFRC,N59A,2008.01.31,110
1107-001699 IC-FLASH MEMORY;KFG1216U2B,512Mbit,32Mx1
2007-007141
2007-007141
2007-000869
BN41-01022B PCB MAIN;AMBER FRANCE,FR-4,4,1.0,192*240
BN62-00003A HEAT SINK-ES;NK,SUN,A6063S,T2.5,W28,L28,
BN97-00688B
BN46-00018A KEY CODE-CERTIFICATE;(HDCP KEY)PPM42M5S,
BP62-00030A HEAT SINK-ES;PDP,A6063S,T2.5,18,18,,,TAP
3722-002781 JACK-PIN;2P(Shield),Ni,WHT/RED,straight
3722-002781 JACK-PIN;2P(Shield),Ni,WHT/RED,straight
3722-002781 JACK-PIN;2P(Shield),Ni,WHT/RED,straight
BN94-01866A ASSY PCB MISC-FRC;LE37A656A1CXXE
0202-001608 SOLDER-WIRE FLUX;LFC7-107,D0.8,99.3Sn/0.
BN97-02263A
0202-001477 SOLDER-CREAM;LST309-M,-,D20~45##,96.5Sn/
0402-001098 DIODE-RECTIFIER;SK34,40V,3A,SMC,TP
0404-001307 DIODE-SCHOTTKY;SSC54,20V,5000mA,DO-214AB
0501-002080 TR-SMALL SIGNAL;2SC2412K,NPN,200mW,SC-59
0505-002169 FET-SILICON;Si4435BDY-T1-E3,P,-30V,-9.1A
1103-001406 IC-EEPROM;AT24C512BN-SH25-T,512Kbit,64Kx
1105-001839 IC-DRAM;HYB18TC256160BF-3S,DDR2,256Mbit,
1105-001839 IC-DRAM;HYB18TC256160BF-3S,DDR2,256Mbit,
1203-003038 IC-POSI.ADJUST REG.;LP2995,SO,8P,4.9x3.9
1203-003059 IC-SWITCH VOL. REG.;MP1583,SOIC,8P,4.9x3
Description & Specifi cation
R-CHIP;240ohm,5%,1/16W,TP,1005
R-CHIP;240ohm,5%,1/16W,TP,1005
R-CHIP;4.7Kohm,1%,1/10W,TP,1608
ASSY HDCP;MT8202 IC HDCP Key'
ASSY SMD-FRC;LE37A656A1CXXE
Q'ty SA/SNA Remark
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.N.A
1 S.A
1 S.N.A
1 S.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.A
1 S.N.A
1 S.N.A
1 S.A
1 S.N.A
2 S.N.A
1 S.N.A
1 S.N.A
3 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
0.025 S.N.A
1 S.N.A
1.564 S.N.A
1 S.A
1 S.A
1 S.A
1 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A