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Rigaku MFM65 Instruction Manual

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Metal Film Monitor
MFM65
(Model : MFM65S2RFFFTFT)
Instruction Manual
2. Maintenance Section
Manual No. ME12058B02
Rigaku Corporation

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Summary of Contents for Rigaku MFM65

  • Page 1 Metal Film Monitor MFM65 (Model : MFM65S2RFFFTFT) Instruction Manual 2. Maintenance Section Manual No. ME12058B02 Rigaku Corporation...
  • Page 2 Rigaku branch office or sales office for a replacement manual. 4. In no event will Rigaku be responsible for the results of the use of this manual. 5. The contents of this manual are subject to change without prior notice.
  • Page 3 WARNING In the case of mishandling, an operator may be killed or suffer a serious injury. It is also used to denote an action that could cause serious damage to system components of the MFM65. c) CAUTION In the case of mishandling, an operator may suffer a slight or medium injury or material damage alone is expected.

  • Page 4: Table Of Contents

    2.4 Lock-out / Tag-out ...........................11 2.5 EMO ..............................12 2.6 Maintenance Keys..........................12 3. CONFIGURATION ..........................13 3.1 MFM65 External Figure ........................13 3.2 MFM65 Configuration Block Diagram ...................16 3.3 Functions............................17 3.4 Software Configuration........................18 3.5 Hardware Specifications ........................19 3.6 Explanation of Software ........................21 3.7 Utility Specifications ........................22 4.
  • Page 5 ME12058B−iii Maintenance Section 14. MAINTENANCE ..........................71 14.1 Power Box............................71 14.2 Using the handy light........................72 14.3 Utility Adjustment .........................73 14.4 Exchanging Parts ...........................74 14.4.1 Cooling Water ........................74 14.4.2 UPS Battery.........................75 14.4.3 Accessories of PC .......................76 15. TROUBLE SHOOTING........................77 15.1 Electric Power..........................77 15.2 Startup............................78 15.3 Beam Diagnosis ..........................80 15.4 Loadport............................81...

  • Page 6: Overview

    This manual describes the user’s maintenance of the MFM65 system (model RRMWSFT Model). Maintenance items except for descriptions in this manual should be performed by RIGAKU service personnel in charge. General information about the MFM65 system and its operation is found in a separate Operations Manual. NOTE : If the MFM65 system is modified without consulting RIGAKU, the system may not satisfy the systems specifications, and RIGAKU does not warrant the modified system.

  • Page 7: Safety

    International Commission on Radiological Protection (ICRP). The dose equivalent limit on the MFM65 is designed to be 2 micro Sv/H, that is based on Rigaku’s design standards. (1.3 mSv / 13 weeks / 6 days / 8 hours = 2 micro Sv/H) NOTE : In fact, the dose of X-ray radiation outside the enclosure is almost zero.
  • Page 8 This instrument uses a wafer aligner which is an FDA Class 1 laser product (λ: NOTE 780 nm, Pmax. : 1.7 mW, Mode : Continuous). The MFM65 system has no risk of laser exposure during normal operation because this system has a complete enclosure shield for laser light and interlock to avoid laser exposure.
  • Page 9 (Refer to the attached MSDS.) (6) Fire Hazards WARNING Plastics and electric cables used in the MFM65 are class V0 or V1. If smoke occurs from the equipment, push an EMO Switch. (7) Hot Surface Hazards CAUTION A halogen lamp is used in the light unit for pattern recognition.

  • Page 10: Hazard Indications

    − 5 − ME12058B Maintenance Section 2.2 Hazard Indications (1) Labels for hazard indications The MFM65 system has the following labels for hazard indications. X-ray Hazard X-ray Hazard Mechanical Hazard X-ray Hazard X-ray Hazard Mechanical Hazard Exposure to harmful This radiation can be...
  • Page 11 − 6 − ME12058B Maintenance Section Material Hazard Material Hazard (Mercury) Skin contact may be hazardous to your health. Wear safety gloves. Hot Hazard Caution HOT SURFACE INSIDE Contact may result in severe burns. Open only after safe temperature is reached. SF016-2C Fig.
  • Page 12 − 7 − ME12058B Maintenance Section The locations of the hazard indication labels are shown in the following figure. Fig. 2-2-3 Locations of Hazard Indication Labels...
  • Page 13 − 8 − ME12058B Maintenance Section (2) Signal Towers and Buzzers Signal Tower Front View Maintenance Buzzer Maintenance Lamp X-ray ON Lamp 1 X-ray ON Lamp 2 X-ray ON Lamp 3 Left View Maintenance Buzzer Maintenance Lamp X-ray ON Lamp 1 X-ray ON Lamp 2 X-ray ON Lamp 3 Right View...

  • Page 14: Interlock List

    − 9 − ME12058B Maintenance Section 2.3 Interlock List The interlock list in the following table helps operators and maintenance personnel avoid hazard risks. The working MCs / The stopping parts none Inter Lock Name Inter Lock Name A risk of being protected A risk of being protected Electric shock Upper Door at Power Box & Fire Unexpected danger Electric protection panel Electric shock in the lower right of EFEM Electric protection panel at the Power distribution Electric shock Electric protection panel Electric shock at the Motor driver Box...
  • Page 15 − 10 − ME12058B Maintenance Section [Interlock location] Interlock Name Upper Door at Power Electric protection panel in the lower right of EFEM Electric protection panel at the Power distribution Electric protection panel at the Motor driver Box Electric protection panel at the Pattern NAVI Box Front View Electric protection panel...

  • Page 16: Lock-Out / Tag-Out

    − 11 − ME12058B Maintenance Section 2.4 Lock-out / Tag-out WARNING When electrical power off and isolating the cooling water of facility, strictly follow lock-out/tag-out of the instrument as follows. In the daily operation, the lock-out/tag-out of the cooling water is normally unnecessary.

  • Page 17: Emo

    Push this button, when an accidental event occurs, for example loss of mechanical control, water leakage, or fire. The MFM65 system has four EMO buttons, one on each side of the tool. (See “2.3 Interlock List”.) 2.6 Maintenance Keys The MFM65 system has many interlock functions for safety. When the enclosure covers of the equipment are opened, electric power is OFF immediately.

  • Page 18: Configuration

    − 13 − ME12058B Maintenance Section 3. CONFIGURATION 3.1 MFM65 External Figure [External Figure] Signal Tower Load Port Keyboard/Trackball Front View Maintenance Door Power Box for Main Module Maintenance Door for EFEM Lock-out/Tag-out Handle Main Module Maintenance Panel EFEM for Main Module...
  • Page 19 − 14 − ME12058B Maintenance Section [Goniometer Figure] Fig. 3-1-2 Gonimeter...
  • Page 20 − 15 − ME12058B Maintenance Section [EFEM Figure] Wafer Aligner Wafer Robot Load Port Top View Fig. 3-1-3 EFEM Figure...

  • Page 21: Mfm65 Configuration Block Diagram

    − 16 − ME12058B Maintenance Section 3.2 MFM65 Configuration Block Diagram Limit switches, alarm lamps, gates, etc. Motor: RCD3 goniometer, DS, RS, SD Motor Goniometer Driver PHA1 Sample PHA2 X-ray tube1 stage XG Ctrl1 X-ray tube2 XG Ctrl2 Pattern X-ray tube3...

  • Page 22: Functions

    − 17 − ME12058B Maintenance Section 3.3 Functions Units Functions Load port FOUP 2 load ports for 300 mm or 200 mm wafers Set the adapter into the FOUP for 200 mm wafers Carrier ID reader Slot mapping function EFEM Sample transport robot Open cassette for 300 mm or 200 mm wafers;...

  • Page 23: Software Configuration

    − 18 − ME12058B Maintenance Section 3.4 Software Configuration Loadport1 Loadport2 Chart System EFEM Optics1 Optics2 Optics3 Manual Sequence Test MFM Status Recipes Process Recipe Analysis Recipe Wafer Map Pattern Map Data Log Equipment Log Process Log Alarm Setup EFEM Settings Optics Setup System Setup Startup...

  • Page 24: Hardware Specifications

    − 19 − ME12058B Maintenance Section 3.5 Hardware Specifications X-ray Generator 1 (XRF) Maximum power 40 W ( 50 kV, 0.8 mA ) Target Cr (Max. 125 W, ( 40 kV, 0.3 mA ) ) φ40 µm Focus size on tube target Alignment mechanism Manual alignment for X-ray tube position.
  • Page 25 − 20 − ME12058B Maintenance Section Goniometer Type Theta-Theta goniometer ----- Horizontal Sample Placement θs axis (X-ray tube mounted) – 5 to 60 degrees 0.001 degree/step θd axis (Detector mounted) – 5 to 60 degrees 0.001 degree/step θs/θd (2θ/θ)coupled scan Scanning range –...

  • Page 26: Explanation Of Software

    Process Log Displays the current process log on the main window. Alarm Displays the current alarms and the history log of past alarms. Sets the equipment parameters for the MFM65 system. Setup EFEM setting Sets the equipment parameters for EFEM.

  • Page 27: Utility Specifications

    − 22 − ME12058B Maintenance Section 3.7 Utility Specifications Power Supply Volt. Phase Frequency Amp. Remarks Main module 208 V 60 Hz 20 A Water chiller 208 V 60 Hz CPU, Controller Supplied through main module after stepping down. Power for CPU is supplied by means of a UPS. Grounding Less than 10 ohm.
  • Page 28 − 23 − ME12058B Maintenance Section Fig. 3-7-1 Utility Figure...
  • Page 29 − 24 − ME12058B Maintenance Section To the Main Breaker Cable Inlet AC208V : 3 lines Ground : 1 line Back side of Power Box Fig. 3-7-2 Cable Inlet Lower Left rear Cooling Water Inlet Cooling Water Outlet Compressed Dry Air Vacuum Inlet 1 Vacuum Inlet 2 Air Exhaust...
  • Page 30 − 25 − ME12058B Maintenance Section                   Fig. 3-7-4 Layout Figure...

  • Page 31: Start Up

    − 26 − ME12058B Maintenance Section 4. START UP This section describes the steps for starting up the equipment from the deactivated state to the standby state for analysis. Follow the startup sequence specified below. (1) Preparation of the water chiller (2) Power on the equipment (3) Start up the control software (4) Initialization and aging...

  • Page 32: Shutdown

    − 27 − ME12058B Maintenance Section 5. SHUTDOWN The following are the steps for terminating operation and deactivating the equipment. Start Unload the wafer and cassette Initialize the goniometer Deactivate the equipment Controlled by the (Turn the X-ray off/operation for shutdown program deactivation) Cooling the X-ray tube...

  • Page 33: Daily Checks

    − 28 − ME12058B Maintenance Section 6. DAILY CHECKS Check the following points in daily operation: (1) Initialize the mechanical units using the startup command. (2) Check the X-ray intensity and angular positions by beam diagnosis. (3) Measure the check sample. Others, (4) Check for unusual noise or odor.

  • Page 34: Daily Analysis

    − 29 − ME12058B Maintenance Section 7. DAILY ANALYSIS The [Jobs]-[job] sub navigation button is available for the daily analysis in the measurement software. About the daily analysis, see the operation manual.

  • Page 35: Edit Recipe

    − 30 − ME12058B Maintenance Section 8. EDIT RECIPE In this equipment, measurement conditions and data analysis conditions can be selected by selecting a recipe. This function enables measurement conditions and mapping conditions to be selected and edited. Use the off-line utility software program “XRR: GXRR software”, “XRF: XRFbatch software” or “XRD: XRDbatch software”, when creating each data process condition.

  • Page 36: Edit Recipe

    − 31 − ME12058B Maintenance Section 8.2 Edit Recipe There are four kinds of recipes in this software as below. (1) Process recipe This recipe is specified and executed in Jobs. This recipe consists of an existing analysis recipe and an existing map recipe which is a wafer map recipe or pattern map recipe.

  • Page 37: Process Recipe

    − 32 − ME12058B Maintenance Section 8.2.1 Process Recipe Click [Process Recipe] among the sub-navigation buttons. Fig. 8-2-1 Process Recipe Button Items Contents Notes Create a new recipe. See the following dialog box. Edit Edit an existing recipe. See the following dialog box. Copy Copy the specified recipe in the table.
  • Page 38 − 33 − ME12058B Maintenance Section Fig. 8-2-2 Create Process Recipe dialog box Items Contents Notes Process Recipe Enter the name of process recipe. Generate Name Analysis Recipe Choose an analysis recipe in the list box. Map Recipe Choose a map recipe in the list box. Wafer Map Wafer map recipes are displayed into the list box.

  • Page 39: Analysis Recipe

    − 34 − ME12058B Maintenance Section 8.2.2 Analysis recipe Click [Analysis Recipe] among the sub-navigation buttons. Fig. 8-2-3 Analysis Recipe Button Items Contents Notes Create a new recipe. See the following dialog box. Edit Edit an existing recipe. See the following dialog box. Copy Copy the specified recipe in the table.
  • Page 40 − 35 − ME12058B Maintenance Section (1) XRR Recipe Fig. 8-2-4 Create Analysis Recipe (XRR) dialog box Items Contents Notes Analysis Recipe Enter the name of analysis recipe. Recipe Choose [XRR] to create XRR analysis recipe. Optics Choose [Optics2] for XRR measurements. Approx.
  • Page 41 − 36 − ME12058B Maintenance Section Items Contents Notes Off angle Enter 0.0 for XRR measurements. Analysis When performing auto analysis of XRR profile, check this box. Condition Specify an existing recipe file by creating GXRR […] button is software. available to specify.
  • Page 42 − 37 − ME12058B Maintenance Section (2) XRF Recipe Fig. 8-2-5 Create Analysis Recipe (XRF) dialog box Items Contents Notes Analysis Recipe Enter the name of analysis recipe. Choose [XRF] to create XRF analysis recipe. Recipe Optics Choose [Optics1] or [Optics2] for XRR measurements.
  • Page 43 − 38 − ME12058B Maintenance Section (3) XRD Recipe Fig. 8-2-6 Create Analysis Recipe (XRD) dialog box Items Contents Notes Analysis Recipe Enter the name of analysis recipe. Recipe Choose [XRD] to create XRD analysis recipe. Optics Choose [Optics2] for XRD measurements. Approx.
  • Page 44 − 39 − ME12058B Maintenance Section Items Contents Notes #1 ~ #4 Enter scan conditions of [Scan Type]. All [Step] are same value. ([Start], [End], [Step], [Speed]) [Start] and [End] are relative positions from the adjustment position. If dividing scan region, check and enter [#2] ~ [#4]. Off angle Enter 0.0 for XRR measurements.

  • Page 45: Wafer Map Recipe

    − 40 − ME12058B Maintenance Section 8.2.3 Wafer map recipe Click [Wafer Map] among the sub-navigation buttons. Fig. 8-2-7 Wafer Map Button Items Contents Notes Create a new recipe. See the following dialog box. Edit Edit an existing recipe. See the following dialog box. Copy Copy the specified recipe in the table.
  • Page 46 − 41 − ME12058B Maintenance Section Mapping List Fig. 8-2-8 Edit Wafer Map dialog box Items Contents Notes Wafer Map Enter the name of wafer map recipe. Choose an axis type, X-Y or R-θ . Map Type Choose wafer size, 300mm or 200mm. Sample Type Edge Cut Enter the edge cut of the wafer.

  • Page 47: Pattern Map Recipe

    − 42 − ME12058B Maintenance Section 8.2.4 Pattern map recipe Click [Wafer Map] among the sub-navigation buttons. Fig. 8-2-9 Pattern Map Button Items Contents Notes Edit Edits a recipe without moving sample stage. See the following dialog box. It is available to edit recipes which are saved already.
  • Page 48 − 43 − ME12058B Maintenance Section (1) [Patterned Wafer Map] dialog box The property, [Edit] or [Teach], is displayed as below according to click [Edit] or [Teaching] button in the main window. This dialog box has five tabs. Choose each tab from the left to the right, and set conditions in each tab.
  • Page 49 − 44 − ME12058B Maintenance Section (2) [Map] tab Fig. 8-2-11 [Map] tab This tab is available to set the pattern information of wafer. Items Contents Notes Wafer size Chooses wafer size in inches. 6 inches is not used. Shot count Enters the number of maximum shot counts.
  • Page 50 − 45 − ME12058B Maintenance Section (3) [Calibration] tab Fig. 8-2-12 [Calibration] tab This tab is available to set the brightness conditions on the wafer for the pattern recognition. Items Contents Notes Light control Sets the light power of the lamp. 1 –...
  • Page 51 − 46 − ME12058B Maintenance Section (4) [Alignment] tab Fig. 8-2-13 [Alignment] tab This tab is available to set the orientation alignment conditions of the wafer. The points to be used for alignment are specified on the map figure and image. Items Contents Notes...
  • Page 52 − 47 − ME12058B Maintenance Section (5) [Origin] tab Fig. 8-2-14 [Origin] tab This tab is available to specify the origin of the wafer. The rectangle region for pattern recognition and the origin point can be set. Items Contents Notes Light Changes the light power of the lamp.
  • Page 53 − 48 − ME12058B Maintenance Section (6) [Target] tab – [Display = Wafer] Fig. 8-2-15 [Origin] tab - [Display = Wafer] This tab is available to specify the measurement position and order on the wafer. When [Display] = [Wafer], the wafer map is displayed. Items Contents Notes...
  • Page 54 − 49 − ME12058B Maintenance Section (7) [Target] tab – [Display = Shot] Fig. 8-2-16 [Origin] tab - [Display = Shot] This tab is available to specify the measurement points in a shot. When [Display] = [Shot], the shot map is displayed. Measurement points in a shot are set in the shot map by the joy stick.

  • Page 55: Manual Operation

    − 50 − ME12058B Maintenance Section 9. MANUAL OPERATION This function enables manual operation individually for the setting of measurement conditions, and for maintenance. Fig. 9-1 Manual Main Window Select [System] among the navigation buttons, and Select each sub-navigation button. (1) [EFEM] Control (2) [Optics1] ~ [Optics3] Control (3) [Manual] Control...

  • Page 56: Operation In The Chart Screen

    − 51 − ME12058B Maintenance Section 9.1 Operation in the Chart Screen Fig. 9-1-1 Chart Screen Groups Items Functions Screen Zoom Enlarges a part of a figure Enlarges the part near the cursor Reset Restores the original size Display of the Linear Linear display of X-ray intensity vertical axis...

  • Page 57: Efem] Control

    − 52 − ME12058B Maintenance Section 9.2 [EFEM] Control Fig. 9-2-1 [EFEM] Control button The sample wafer can be removed from the cassette and mounted on the sample stage. The wafer on the stage can be returned to the cassette. Click [Sample Changer] button to open [Sample Changer Control] dialog box for operation.
  • Page 58 − 53 − ME12058B Maintenance Section Items Contents Choose the load port number, 1 or 2, to load/unload a wafer. Load port # Slot # Choose the slot number, 1 to 25, in the FOUP on the specified load port. Load The specified wafer is removed from the FOUP and the aligner sets the notch position.

  • Page 59: Optics1] ~ [Optics3]Control

    − 54 − ME12058B Maintenance Section 9.3 [Optics1] ∼ [Optics3]Control Fig. 9-3-1 [Optics1] ∼ [Optics3] Control button For the Optics1, Optics2 and Optics3 tubes, the followings can be performed. Items Contents X-ray Generator On/Off of the X-ray generator. X-ray On/Off of the X-ray. Shutter Open/Close of the shutter.

  • Page 60: Manual] Control

    − 55 − ME12058B Maintenance Section 9.4 [Manual] Control Fig. 9-4-1 [Manual] Control button Manual control of actuators in the main module, example for positioning, scanning, XG operation and so on, can be performed. Click [Execute] button to open [Manual Command Control] dialog box for operation. Fig.
  • Page 61 − 56 − ME12058B Maintenance Section Items Contents Group Choose the operation group. Command Choose the operation command in the specified groupe. The specified command is executed. Abort Abort operation. Repeat # Repeat number of operations.

  • Page 62: Sequence Test] Control

    − 57 − ME12058B Maintenance Section 9.5 [Sequence Test] Control Fig. 9-5-1 [Sequence Test] Control button Sequences, which are related to a control job, a process job and so on, can be tested. Items Contents Initialize.tcl Execute the sequence of initializing machine. Startup.tcl Execute the sequence of the startup.

  • Page 63: Mfm Status] Control

    − 58 − ME12058B Maintenance Section 9.6 [MFM Status] Control Fig. 9-6-1 [MFM Status] Control button The status figure of this equipment is displayed on the main window visually.

  • Page 64: Setup

    − 59 − ME12058B Maintenance Section 10. SETUP Input operational constants specific to the equipment. Fig. 10-1 Setup Main Window (1) EFEM Settings (2) Optics Setup (3) System Setup These commands can be performed as the following pages.

  • Page 65: Efem Settings

    − 60 − ME12058B Maintenance Section 10.1 EFEM Settings Fig. 10-1-1 [EFEM Settings] button Click [Carrier], and open the [EFEM Setup] dialog box. Fig. 10-1-2 [EFEM Setup] dialog box Items Contents Load Port 1 Carrier Chooses the type of carriers to use on the load port 1. Load Port 2 Carrier Chooses the type of carriers to use on the load port 2.

  • Page 66: Optics Setup

    − 61 − ME12058B Maintenance Section 10.2 Optics Setup Fig. 10-2-1 [Optics Setup] button [Optics Setup] has four setup functions (buttons) as below. See the following pages about each function. (1) Optics 1 (2) Optics 2 (3) Optics 3 (4) MCA...
  • Page 67 − 62 − ME12058B Maintenance Section Click [Optics1], [Optics2] or [Optics3] to setup the parameters of each optics unit, and open [Optics Setup 1/2/3] dialog box. Fig. 10-2-2 [Optics Setup 1] – [Optics Setup 3] dialog box Item1 Item2 Contents Goniometer 2Theta Offset The angular offset of 2theta axis.
  • Page 68 − 63 − ME12058B Maintenance Section Click [MCA] to setup the parameters of MCA, and open [MCA Setup] dialog box. Fig. 10-2-3 [MCA Setup] dialog box Item1 Item2 Contents Channel Energy Step The energy step by channel. The channel calibration coefficient “a”. (Y = a X + b X + c) The channel calibration coefficient “b”.

  • Page 69: Data Log

    − 64 − ME12058B Maintenance Section 11. DATA LOG It is available to display the equipment, process and alarm log on the main window. Fig. 11-1 [Equipment Log] button Fig. 11-2 [Process Log] button...
  • Page 70 − 65 − ME12058B Maintenance Section Fig. 11-3 [Alarm] button...

  • Page 71: Alarms

    − 66 − ME12058B Maintenance Section 12. ALARMS It is available to display the current alarm status and the history log of past alarms. Fig. 12-1 [Alarm] button Fig. 12-2 [Alarm Log] button...

  • Page 72: Routine Checkup List

    − 67 − ME12058B Maintenance Section 13. ROUTINE CHECKUP LIST Cycle Items Week Month 6months Year Others Cooling water: Checking and adjusting the flow rate of secondary-water flow rate Compressed dry air: Checking and adjusting of the pressure of compressed dry air Vacuum: Checking and adjusting the suction pressure of...
  • Page 73 − 68 − ME12058B Maintenance Section Items Contents Cooling water: Check the water flow rate meter at the left side of the equipment. Checking and adjusting Water flow rate meter reading of about 1.3 – 1.7 L/min. the flow rate of When adjusting, refer to chapter 13.1.

  • Page 74: Checking Cooling Water, Cda And Vacuum

    − 69 − ME12058B Maintenance Section 13.1 Checking cooling water, CDA and vacuum Open the lower panel on the left side of the Main Module. Check the flow rate of cooling water, the pressure of the CDA and the suction pressure of vacuum as the following figure.

  • Page 75: Cleaning Of The Transport Line

    − 70 − ME12058B Maintenance Section 13.2 Cleaning of the transport line Wipe as below figure, after opening the right side doors of the EFEM and the main module. WARNING Do not use the maintenance key, when cleaning. Take care to avoid injury from catching your finger in the side doors. Also, take care to avoid injury from hitting your head against any mechanical projections.

  • Page 76: Maintenance

    − 71 − ME12058B Maintenance Section 14. MAINTENANCE 14.1 Power Box WARNING When performing maintenance inside the Power Box where electrical hazard has any potential of causing personal injury or damage to the system, strictly follow lock-out/tag-out of the instrument before starting the maintenance work. (Refer to “2.4 Lock-out/Tag-out”.) There are protection panels in the Power Box, don’t remove these panels during power ON.

  • Page 77: Using The Handy Light

    − 72 − ME12058B Maintenance Section 14.2 Using the handy light It is available to use the handy light, when maintaining inside the EFEM or the main module. There are three sockets for the handy light as below. If necessary, connect it to a socket after shutdown.

  • Page 78: Utility Adjustment

    − 73 − ME12058B Maintenance Section 14.3 Utility Adjustment The adjustments of cooling water, compressed dry air and vacuum are as following figures. In general, the flow rate of cooling water is adjusted in the water chiller side, and the pressure of compressed air is adjusted by using the bulb of the facility side.

  • Page 79: Exchanging Parts

    − 74 − ME12058B Maintenance Section 14.4 Exchanging Parts The Consumables and Maintenance parts are made a list in APPENDIX 1. How to exchange old parts to new parts is described in this section. 14.4.1 Cooling Water The cooling water for X-ray tube (secondary cooling water) is pure water. When exchanging cooling water, refer to the manual of the water chiller.

  • Page 80: Ups Battery

    − 75 − ME12058B Maintenance Section 14.4.2 UPS Battery The UPS is used to protect the PC from the loss of electric power. (See the below figure.) When exchanging the built-in battery in the UPS, refer to the manual of the UPS. CAUTION When exchanging the built-in battery in the UPS, strictly follow lock-out/tag-out of the instrument before exchanging.

  • Page 81: Accessories Of Pc

    − 76 − ME12058B Maintenance Section 14.4.3 Accessories of PC The PC has some exchangeable accessories, which are the LCD, keyboard, trackball and joystick. NOTE Shutdown PC and turn off the instrument with the POWER OFF button on the Power Box of the rear side before exchanging them. CAUTION Take care to avoid injury from catching your fingers in the slider of PC panel.

  • Page 82: Trouble Shooting

    − 77 − ME12058B Maintenance Section 15. TROUBLE SHOOTING 15.1 Electric Power Troubles Causes and remedies The Start button does not Check to make sure that the circuit breaker of the power box operate. on the facility side is turned on, and power is supplied to the equipment.

  • Page 83: Startup

    − 78 − ME12058B Maintenance Section 15.2 Startup Troubles Causes and remedies The goniometer cannot be Check to make sure that the side doors of the main module or initialized. EFEM are not open. (See “2.3 Interlock List”.) Check to make sure that the load port panels or rear panels are not open.
  • Page 84 − 79 − ME12058B Maintenance Section Troubles Causes and remedies Check to make sure that the software screen does not show an FCL alarm. Shut down the PC, turn off the main breaker lockout handle of the equipment, and restart the equipment. (Refer to “2.4 Lock-out/Tag-out”.) If this alarm is generated again, the filament in the X-ray tube may be disconnected.

  • Page 85: Beam Diagnosis

    − 80 − ME12058B Maintenance Section 15.3 Beam Diagnosis Troubles Causes and remedies The direct beam intensity and If the intensity is low, the X-ray optics may be out of position are not as specified. adjustment. NOTE: Contact our service personnel in charge for readjustment of the X-ray optics.

  • Page 86: Loadport

    − 81 − ME12058B Maintenance Section 15.4 Loadport Troubles Causes and remedies The door of the load port does Conduct the startup procedure with the software. not open. The carrier cannot be taken out. Conduct the following steps, and also refer to “5.3 Sample The Load/Unload button of the Unloading in the Event Emergency”...

  • Page 87: Wafer Transfer

    − 82 − ME12058B Maintenance Section 15.5 Wafer Transfer Troubles Causes and remedies The robot hand cannot perform If the vacuum pipe is connected to the factory facility, check the adsorbing function. the pressure in the vacuum line. The aligner cannot perform the (Refer to “14.3 Utility Adjustment”...

  • Page 88: Sample Alignment

    − 83 − ME12058B Maintenance Section 15.6 Sample Alignment Troubles Causes and remedies Sample alignment fails. Check to make sure that the alignment condition (scanning range) is appropriate. Observe the scan profile of ω-axis during the sample alignment. Widen the scanning range so that the above-mentioned profiles can be obtained.

  • Page 89: Xrr/Xrd Measurement

    − 84 − ME12058B Maintenance Section 15.7 XRR/XRD Measurement Troubles Causes and remedies measurement profile Check to make sure that the slit setting in the recipe. intensity is extremely high. The measurement profile Check to make sure that the sample alignment is conducted intensity is extremely low.

  • Page 90: Xrf Measurement

    − 85 − ME12058B Maintenance Section 15.8 XRF Measurement Troubles Causes and remedies Analysis result is abnormal. Check the selection of the recipe. The measurement result The constants of calibration curve are not registered. (thickness) is not calculated Refer to the manual of the XRF analysis software. after the measurement.

  • Page 91: X-Ray Trouble

    − 86 − ME12058B Maintenance Section 15.9 X-ray Trouble Troubles Causes and remedies The X-ray generation turns off. Check to make sure that the side door of the equipment, load port panel or rear panel is not open. Opening the side door or panel turns off the power of the X-ray generator.

  • Page 92: A1.1 Consumables And Maintenance Parts

    (Pure water) Six months Secondary cooling water NOTE: X-ray tubes, filters of FFU and the halogen lamp should be exchanged by Rigaku service personnel. Contact to Rigaku service center for exchange. WARNING Metal Beryllium foil is used for the X-ray tube window. Solid Beryllium usually has no influence on human health, but evidence exists that the personnel who inhales the beryllium powder or vapor risks a possibility of serious injury or death.
  • Page 93 FNQ-R-15 Rigaku NOTE: Items of mark should be exchanged by Rigaku service personnel. Contact to Rigaku service center for exchange. WARNING Metal Beryllium foil is used for the windows of X-ray detector APD and SDD. Solid Beryllium usually has no influence on human health, but evidence exists that the personnel who inhales the beryllium powder or vapor risks a possibility of serious injury or death.

  • Page 94: A1.2 Disposing The Equipment And Parts

    A1.2 Disposing the Equipment and parts The MFM65 system can be used for a long time by exchanging broken parts and consumable parts. When disposing the MFM65 system, units of this system or parts of this system, please pay attention of the hazard materials and recyclable materials.

  • Page 95: A2.1 Explanation Of Xrr (X-Ray Reflectometry Method)

    − 90 − ME12058B Maintenance Section APPENDIX 2 A2.1 Explanation of XRR (X-ray reflectometry method) It is well known that the refractivity of materials against X-rays is slightly smaller than 1. Thus, if an X-ray comes in at a very shallow angle, total reflection occurs. In XRR, the intensity of a reflected X-ray is measured in an angle range close to that for total reflection.
  • Page 96 − 91 − ME12058B Maintenance Section (2) When reflection occurs only on the surface θ/ θ (degree) Fig. A2-1-3 Surface Reflection (3) When the reflected waves from the surface and interface interfere with each other − θ ∆ ⋅ θ θ...
  • Page 97 − 92 − ME12058B Maintenance Section Degree of difficulty Analysis contents Target of analysis/ in analysis Film structure Oscillation interval → Film thickness Easy Single layer (roughly estimated from the FFT results) Critical angle → Density (roughly estimated from the critical angle) The accuracy of film thickness, density, and roughness can be Two layers improved through fitting analysis.

  • Page 98: A2.2 Analysis/Measurement Flow

    − 93 − ME12058B Maintenance Section A2.2 Analysis/Measurement Flow Ready Blue lamp ON LOAD READY Lamp ON Move to the measurement point Load Unload Alignment of sample height Press a button Measurement of the position Open of the reflection beam Angle alignment load port door Angle alignment...
  • Page 99 − 94 − ME12058B Maintenance Section Move to the wafer pickup position Open lid Unload wafer Return to the load port Analysis for all samples is complete Operator call Yellow lamp blinks Load Unload Press a button Open load port door Unload carrier Close load port door...

  • Page 100: A3.1 Training For Using Equipment

    − 95 − ME12058B Maintenance Section APPENDIX 3 A3.1 Training for Using Equipment (1) Training for Operation We provide the explanation of equipment operating procedures shown in the table below at the time of equipment delivery. Please discuss the schedule and contents of this training with our service personnel in charge. We can also provide additional explanation of equipment operation, if necessary.

  • Page 101: A4.1 Power Circuit Diagram

    − 96 − ME12058B Maintenance Section APPENDIX 4 A4.1 Power Circuit Diagram Fig. A4-1-1 Power Circuit Diagram 1...
  • Page 102 − 97 − ME12058B Maintenance Section Fig. A4-1-2 Power Circuit Diagram 2...

  • Page 103: A4.2 Emo Circuit

    − 98 − ME12058B Maintenance Section A4.2 EMO Circuit Fig. A4-2-1 EMO Circuit...

  • Page 104: A5.1 List Of Material Safety Database Sheet (Msds)

    − 99 − ME12058B Maintenance Section APPENDIX 5 A5.1 List of Material Safety Database Sheet (MSDS) List of Attached MSDSs Materials CAS No. Purposes Parts/Assemblies Beryllium 7440-41-7 Vacuum seal for X-ray window X-ray tube Air seal for detector window X-ray detector (APD) X-ray detector (SDD) Lithium 12190-79-3...

  • Page 105: A5.2 Msds Of Beryllium

    − 100 − ME12058B Maintenance Section A5.2 MSDS of Beryllium...
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  • Page 116: A5.3 Msds Of Lead

    − 111 − ME12058B Maintenance Section A5.3 MSDS of Lead...

  • Page 117: A5.4 Msds Of Lithium

    − 112 − ME12058B Maintenance Section A5.4 MSDS of Lithium...
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  • Page 120: A5.5 Msds Of Mercury

    − 115 − ME12058B Maintenance Section A5.5 MSDS of Mercury...
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  • Page 126: A5.6 Msds Of Mechanical Lubricating Grease

    − 121 − ME12058B Maintenance Section A5.6 MSDS of Mechanical Lubricating Grease...
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  • Page 133: A5.7 Msds Of Ethanol

    − 128 − ME12058B Maintenance Section A5.7 MSDS of Ethanol...
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  • Page 138 Thermomechanical Analyzers Differential Scanning Calorimeters Specifications Subject to Change without Notice Rigaku Corporation Tokyo Branch 4-14-4, Sendagaya, Shibuya-ku, Tokyo 151-0051, Japan Phone: 81-3-3479-0618 Fax: 81-3-3479-6112 e-mail: rinttyo@rigaku.co.jp Rigaku Corporation Rigaku Industrial Corporation Rigaku Americas Corporation Head Office 14-8, Akaoji-cho, Takatsuki-shi,...

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