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NodeMCU-BU01Specification V 1.0
NodeMCU-BU01 SPECIFICATION
Version V1.0
Copyright ©2020
1
Copyrigh t © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020

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Summary of Contents for Ai-Thinker NodeMCU-BU01

  • Page 1 NodeMCU-BU01Specification V 1.0 NodeMCU-BU01 SPECIFICATION Version V1.0 Copyright ©2020 Copyrigh t © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020...
  • Page 2 Shenzhen An Xin Ke Technology Co., Ltd. does not ensure that the content of the manual is completely error-free. All statements and information in this manual And recommendations do not constitute any express or implied warranty. Copyrigh t © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020...
  • Page 3 NodeMCU-BU01Specification V 1.0 Documentation/revision/ revocation resume Developme Version Date Development/revision Approval V1.0 2020.05.20 Initial development Xie Yiji Copyrigh t © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020...
  • Page 4: Table Of Contents

    NodeMCU-BU01Specification V 1.0 Content 1.Product Overview............................5 2.Electrical parameters..........................7 3.Appearance dimensions..........................8 4.Definition of pins............................9 5.Schematic diagrams............................12 6.Design guidance............................12 7.ROLLING OF Reflow soldering......................... 14 8.Packaging information..........................15 9.Contact us..............................15 Copyrigh t © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020...
  • Page 5: Product Overview

    NodeMCU-BU01Specification V 1.0 1.Product Overview NodeMCU-BU01 is designed as a development board for the BU01 module, equipped with STM32F103C8T6MCU, peripherals to add temperature and humidity sensors and three-dimensional acceleration sensor, for customers to develop debugging to provide convenience.BU01 is an ultra-wideband (UWB) transceiver module based on Decawave DW1000 design.
  • Page 6 The all IO of PWM/I2C/GPIO 、MCU Operating -40℃~85℃ temperature Storage -40 ℃ ~ 125 ℃ , < 90%RH environment Power supply 5V or 3.3V range Power Development board :160 mA (with MCU, sensors) consumption C opyright © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020...
  • Page 7: Electrical Parameters

    Any more than the following absolute maximum ratings can cause chip damage Name of name Minimum value Typical values Maximum value Units Micro USB supply voltage Pin header 3.3 V supply voltage ℃ Operating temperature +125 ℃ Storage temperature C opyright © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020...
  • Page 8: Appearance Dimensions

    NodeMCU-BU01Specification V 1.0 3.Appearance dimensions C opyright © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020...
  • Page 9: Definition Of Pins

    NodeMCU-BU01Specification V 1.0 4.Definition of pins NodeMCU-BU01 module has a total of 50 interfaces, such as the pin diagram, the pin function definition table is the interface definition. NodeMCU-BU01 Foot Schemes Foot function definition table Pin No. Item Functional Description default value is used as SYNC input.
  • Page 10 PA1, connection LED2 on the MCU LED2 PA0, connection BTN keys on the MCU Reset pin on MCU, connect reset button RESET Ground Ground 3.3 V Power supply V3.3 5V power supply C opyright © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020...
  • Page 11 UART1-TX on the MCU U1TX PA8 on the MCU PB15 on the MCU PB15 SWDIO feet on MCU, default flash pin Swdio SWDIO feet on MCU, default flash pin Swclk C opyright © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020...
  • Page 12: Schematic Diagrams

    SRAM 5.Schematic diagrams 6.Design guidance 1. Antenna layout requirements It is forbidden to place metal parts around the antenna, and to put away from high frequency devices. 2、Power supply C opyright © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020...
  • Page 13 (3)、DC-DC power supply circuit is suggested to reserve the position of dynamic response capacitance, which can optimize the output ripple when the load changes greatly. (4),3.3 V The proposed addition of ESD devices. C opyright © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020...
  • Page 14: Rolling Of Reflow Soldering

    NodeMCU-BU01Specification V 1.0 7.ROLLING OF Reflow soldering C opyright © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020...
  • Page 15: Packaging Information

    NodeMCU-BU01Specification V 1.0 8.Packaging information as shown below, the NodeMCU-BU01 packing is electrostatic bag packing. 9.Contact us Official website: https://www.ai-thinker.com Development DOCS:https://docs.ai-thinker.com Official Forum: http://bbs.ai-thinker.com Sample purchase: https://anxinke.taobao.com Business cooperation: sales@aithinker.com Technical support: support@aithinker.com Company Address: Room410, Building C, Huafeng Intelligence Innovation Port,...

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