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Rigaku MFM65S2RFFFLFL Instruction Manual

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Metal Film Monitor
MFM65
(Model: MFM65S2RFFFLFL)
Instruction Manual
1. Operation Section
Manual No. ME12058B02
Rigaku Corporation

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  • Page 1 Metal Film Monitor MFM65 (Model: MFM65S2RFFFLFL) Instruction Manual 1. Operation Section Manual No. ME12058B02 Rigaku Corporation...
  • Page 2 Rigaku branch office or sales office for a replacement manual. 4. In no event will Rigaku be responsible for the results of the use of this manual. 5. The contents of this manual are subject to change without prior notice.
  • Page 3 (2) Pictographs for Warning Indication. Pictographs prepared according to ISO and ANSI guidelines are attached. For details, see the list of warning labels. When a warning label is damaged, please contact Rigaku to obtain a replacement label. NOTE : Please read the SAFETY chapter in this manual before operating the MFM65 system.

  • Page 4: Table Of Contents

    ME12058B−ii Operation Section Contents 1. OVERVIEW ..............................1 2. SAFETY ..............................2 2.1 Hazards and Risks..........................2 2.2 Hazard Indications ..........................4 2.3 Interlock List............................8 2.4 Lock-out / Tag-out ...........................10 2.5 EMO ..............................11 2.6 Maintenance Keys..........................12 3. CONFIGURATION ..........................13 3.1 MFM65 External Figure ........................13 3.2 MFM65 Configuration Block Diagram ...................16 3.3 Functions............................17 3.4 Software Configuration........................18...
  • Page 5 ME12058B−iii Operation Section 9.9 X-ray Trouble ..........................54 APPENDIX 1 ..............................55 A1.1 Explanation of XRR (X-ray reflectometry method) ..............55 A1.2 Analysis/Measurement Flow......................58 APPENDIX 2 ..............................60 A2.1 Training for Using Equipment ......................60 APPENDIX 3 ..............................61 A3.1 Power Circuit Diagram .........................61 APPENDIX 4 ..............................63 A4.1 List of Material Safety Database Sheet (MSDS) ................63 A4.2 MSDS of Beryllium ........................64 A4.3 MSDS of Lead ..........................75...

  • Page 6: Overview

    NOTE : In the case of modifying the MFM65 system without consulting RIGAKU, the system may not satisfy the specifications of this system, and RIGAKU does not warrant the system. RIGAKU may change the specifications of the MFM65 system and the contents of the...

  • Page 7: Safety

    International Commission on Radiological Protection (ICRP). The dose equivalent limit on the MFM65 is designed to be 2 micro Sv/H, that is based on Rigaku’s design standards. (1.3 mSv / 13 weeks / 6 days / 8 hours = 2 micro Sv/H) NOTE: In fact, the dose of X-ray radiation outside the enclosure is almost zero.
  • Page 8 − 3 − ME12058B Operation Section (4) Mechanical Hazards When squatting down to work, example for turning on the PC, take due care to WARNING avoid injury from hitting your head against the mechanical projections. Pay attention to the warning labels to be affixed on the enclosure of this system.

  • Page 9: Hazard Indications

    − 4 − ME12058B Operation Section 2.2 Hazard Indications (1) Labels for hazard indications The MFM65 system has the following labels for hazard indications. X-ray Hazard X-ray Hazard Mechanical Hazard X-ray Hazard X-ray Hazard Mechanical Hazard Exposure to harmful This radiation can be Moving parts insidemay radiation possible by harmful or fatal.
  • Page 10 − 5 − ME12058B Operation Section Material Hazard Material Hazard (Mercury) Skin contact may be hazardous to your health. Wear safety gloves. Hot Hazard Caution HOT SURFACE INSIDE Contact may result in severe burns. Open only after safe temperature is reached. SF016-2C Fig.
  • Page 11 − 6 − ME12058B Operation Section The location of the hazard indication labels is the following figure. Fig. 2-2-3 Location of Hazard Indication Labels...
  • Page 12 − 7 − ME12058B Operation Section (2) Signal Towers and Buzzers Signal Tower Front View Maintenance Buzzer Maintenance Lamp X-ray ON Lamp 1 X-ray ON Lamp 2 X-ray ON Lamp 3 Left View Maintenance Buzzer Maintenance Lamp X-ray ON Lamp 1 X-ray ON Lamp 2 X-ray ON Lamp 3 Right View...

  • Page 13: Interlock List

    − 8 − ME12058B Operation Section 2.3 Interlock List The interlock list in the following table helps operators and maintenance personnel avoid hazard risks. The working MCs / The stopping parts none Inter Lock Name Inter Lock Name A risk of being protected A risk of being protected Electric shock Upper Door at Power Box & Fire Unexpected danger Electric protection panel Electric shock in the lower right of EFEM Electric protection panel at the Power distribution Electric shock Electric protection panel Electric shock at the Motor driver Box...
  • Page 14 − 9 − ME12058B Operation Section [Interlock location] Interlock Name Upper Door at Power Electric protection panel in the lower right of EFEM Electric protection panel at the Power distribution Electric protection panel at the Motor driver Box Electric protection panel Front View at the Pattern NAVI Box Electric protection panel...

  • Page 15: Lock-Out / Tag-Out

    − 10 − ME12058B Operation Section 2.4 Lock-out / Tag-out When electrical power off and isolating the cooling water of facility, strictly follow WARNING lock-out/tag-out of the instrument as follows. In the daily operation, the lock-out/tag-out of the cooling water is normally unnecessary.

  • Page 16: Emo

    − 11 − ME12058B Operation Section 2.5 EMO When the EMO button is pushed, electric power is OFF immediately. (See “2.3 Interlock List”.) Push this button, when an accidental event occurs, for example loss of mechanical control, water leakage, or fire. The MFM65 system has four EMO buttons, one on each side of the tool.

  • Page 17: Maintenance Keys

    − 12 − ME12058B Operation Section 2.6 Maintenance Keys The MFM65 system has many interlock functions for safety. When the enclosure covers of the equipment are opened, electric power is OFF immediately. The X-ray generations are turned off, and the mechanical systems, for example the goniometer, the robot, and so on, are turned off. But, some items for maintenance need to be powered on with the covers open.

  • Page 18: Configuration

    − 13 − ME12058B Operation Section 3. CONFIGURATION 3.1 MFM65 External Figure [External Figure] Signal Tower Load Port Keyboard/Trackball Front View Maintenance Door Power Box for Main Module Maintenance Door for EFEM Lock-out/Tag-out Handle Main Module Maintenance Panel EFEM for Main Module Keyboard/ Trackball Left View...
  • Page 19 − 14 − ME12058B Operation Section [Goniometer Figure] Fig. 3-1-2 Gonimeter...
  • Page 20 − 15 − ME12058B Operation Section [EFEM Figure] Wafer Aligner Wafer Robot Load Port Top View Fig. 3-1-4 EFEM Figure...

  • Page 21: Mfm65 Configuration Block Diagram

    − 16 − ME12058B Operation Section 3.2 MFM65 Configuration Block Diagram Limit switches, alarm lamps, gates, etc. Motor: RCD3 goniometer, DS, RS, SD Motor Goniometer Driver PHA1 Sample PHA2 X-ray tube1 stage XG Ctrl1 X-ray tube2 (Option) XG Ctrl2 Pattern X-ray tube3 NAVI XG Ctrl3...

  • Page 22: Functions

    − 17 − ME12058B Operation Section 3.3 Functions Units Functions FOUP 2 load ports for 300 mm or 200 mm wafers Load port Set the adapter into the FOUP for 200 mm wafers Carrier ID reader Slot mapping function Sample transport robot Open cassette for 300 mm or 200 mm wafers;...

  • Page 23: Software Configuration

    − 18 − ME12058B Operation Section 3.4 Software Configuration Loadport1 Loadport2 Chart Result Equipment Log Calibration Status Panel System EFEM Optics1 Optics2 Manual Recipes Process Recipe Analysis Recipe Wafer Map Pattern Map Data Log Equipment Log Process Log Alarm Setup EFEM Settings Optics Setup System Setup...

  • Page 24: Hardware Specifications

    − 19 − ME12058B Operation Section 3.5 Hardware Specifications X-ray Generator 1 (XRR, XRD, XRF) 40 W ( 50 kV, 0.8 mA ) Maximum power Cu (Max. 25 W, ( 50 kV, 0.5 mA ) ) Target φ40 µm Focus size on tube target Manual alignment for X-ray tube position.
  • Page 25 − 20 − ME12058B Operation Section Goniometer Theta-Theta goniometer ----- Horizontal Sample Placement Type θs axis (X-ray tube mounted) – 3 to 60 degrees 0.001 degree/step θd axis (Detector mounted) – 3 to 60 degrees 0.001 degree/step θs/θd (2θ/θ)coupled scan Scanning range –...

  • Page 26: Explanation Of Software

    − 21 − ME12058B Operation Section 3.6 Explanation of Software Navigation Buttons Contents Daily operation using recipes Loadport1 Executes recipes for load port 1. Loadport2 Executes recipes for load port 2. Chart Displays graphs on the main window. Enables manual operation for maintenance purposes. System EFEM Loads or unloads a wafer from the carrier to the sample stage.

  • Page 27: Start Up

    − 22 − ME12058B Operation Section 4. START UP This section describes the steps for starting up the equipment from the deactivated state to the standby state for analysis. Follow the startup sequence specified below. (1) Preparation of the water chiller (2) Power on the equipment (3) Start up the control software (4) Initialization and aging...

  • Page 28: Power On The Equipment

    − 23 − ME12058B Operation Section 4.2 Power on the Equipment Power on as the following sequence. (1) Main breaker lock-out handle ON. (2) Push the [POWER ON] button. (Button indicator lamp is ON.) (3) Push the [X-RAY] button. (Button indicator lamp is ON.) (4) Push the [ROBOT] button.

  • Page 29: Start Up The Control Software

    − 24 − ME12058B Operation Section 4.3 Start Up the Control Software The PC is housed in the left below panel of the Main Module. Fig. 4-3-1 PC Power Switch (1) Power on the UPS and the PC.power on the PC. Take care not to hit your head against the keyboard table.
  • Page 30 − 25 − ME12058B Operation Section These four buttons are available for administrator. When login to a general user account, these buttons disappear. Fig. 4-3-2 Main Window of Control Software...

  • Page 31: Equipment Initialization And Aging

    − 26 − ME12058B Operation Section 4.4 Equipment Initialization and Aging (1) Click on [Startup] among the navigator buttons. Fig. 4-4-1 Navigation Button [System], [Recipes] ,[Datalog]and [Setup] buttons are available for administrator. NOTE : When login to a general user account, these buttons disappear. (2) Initialize the equipment.
  • Page 32 − 27 − ME12058B Operation Section (3) When “Goniometer/Sample Stage”is selected, the initialization of the mechanical units of goniometer and wafer transportline are carried out. When “Loadport #1”is selected, the initialization of Loadport #1 is carried out. When “Loadport #2”is selected, the initialization of Loadport #1 is carried out. When “XG for Optics #1”is selected, aging of the X-ray tube #1 is carried out.

  • Page 33: Equipment Diagnosis

    − 28 − ME12058B Operation Section 4.5 Equipment Diagnosis Beam Diagnosis Fig. 4-5-1 Navigation Button Check the position of the X-ray output beam and the intensity of direct X-rays. Fig. 4-5-2 Beam Diagnosis Dialog Upon completion of beam diagnosis, a confirmation dialog box is displayed. When complete message is displayed in the confirmation dialog box, click on [OK] to save the current measurement values.

  • Page 34: Shutdown

    − 29 − ME12058B Operation Section 5. SHUTDOWN The following are the steps for terminating operation and deactivating the equipment. Start Unload the wafer and cassette Initialize the goniometer Deactivate the equipment Controlled by the (Turn the X-ray off/operation for shutdown program deactivation) Cooling the X-ray tube...

  • Page 35: Deactivate The Equipment

    − 30 − ME12058B Operation Section 5.2 Deactivate the Equipment Fig. 5-2-1 Navigation Button [System], [Recipes] ,[Setup] ,[DataLog] and [Setup] buttons are available NOTE : for administrator. When login by a general user account, these buttons disappear. Click on [Jobs] – [Shutdown]; a dialog box is displayed. Fig.
  • Page 36 − 31 − ME12058B Operation Section (1) [Shutdown] moves the mechanical units to their initial positions and turns off the X-ray. (2) Allow 30 minutes for cooling to ensure the long life of the X-ray tube. (3) Click on [Terminate MFM65] to exit the control program. Fig.
  • Page 37 − 32 − ME12058B Operation Section Fig. 5-2-5 Power Switch...

  • Page 38: Sample Unloading In The Event Of Emergency

    − 33 − ME12058B Operation Section 5.3 Sample Unloading in the Event of Emergency If a wafer or carrier is left in the equipment or they cannot be removed in the normal ways, follow the steps specified below. (1) Sample unload Click on the [Sampler Unload] button to remove the wafer from the equipment.
  • Page 39 − 34 − ME12058B Operation Section (2) Carrier Unload Click on the [Carrier Unload] button; the carrier is undocked. Fig. 5-3-3 Carrier Unload Button (3) If the Sample Unload or Carrier Unload button is inoperable, follow the steps specified below to unload it. ①...

  • Page 40: Daily Checks

    − 35 − ME12058B Operation Section 6. DAILY CHECKS Check the following points in daily operation: (1) Initialize the mechanical units using the startup command. (See 6.1) (2) Check the X-ray intensity and angular positions by beam diagnosis. (See 6.2) (3) Measure the check sample.
  • Page 41 − 36 − ME12058B Operation Section Fig. 6-1-1 Startup Display If an error occurred in the startup procedure, see “9.Trouble Shooting”. NOTE : And then, contact to the maintenance personnel.

  • Page 42: Beam Diagnosis

    − 37 − ME12058B Operation Section 6.2 Beam Diagnosis Fig. 6-2-1 Diagnosis Button Execute the [Jobs] – [Diagnosis] command. Fig. 6-2-2 Diagnosis Dialog Upon completion of the beam diagnosis, the beam intensity and the 2θ position are displayed along with the previous values, and the confirmation dialog box appears. Click on [OK];...

  • Page 43: Analysis Of The Check Sample

    − 38 − ME12058B Operation Section 6.3 Analysis of the Check Sample To ensure the accuracy of the analysis values, analyze the predetermined reference sample and check the repeatability of the analysis results. Use the predetermined job and recipe to analyze the sample. (See “7.Daily Analysis”.) Please ask how to check sample to the maintenance personnel.

  • Page 44: Daily Analysis

    − 39 − ME12058B Operation Section 7. DAILY ANALYSIS Setting a carrier, specifying a recipe, and clicking on the [Start Jobs] button can perform daily analysis. Sample setup, measurement, and printout of results can be performed on a continuous-operation basis. CAUTION This equipment can measure wafers of different sizes.

  • Page 45: Set The Wafer Cassette

    − 40 − ME12058B Operation Section 7.2 Set the Wafer Cassette (1) Make sure that the blue LED [Ready] of the status signal tower is on and the green lamp [LOAD] of the loadport is on. Green [LOAD] Blue LED Fig.

  • Page 46: Set Thecreate Jobs List

    − 41 − ME12058B Operation Section 7.3 Set theCreate Jobs List Fig. 7-3-1 Job List (1) Select [Jobs] –[Create Jobs] to display the job list.
  • Page 47 − 42 − ME12058B Operation Section (2) Functions of the Edit buttons. Names Functions Multi Slot Sync Slot Creates a new measurement condition and adds it to the end of the list. Changes the content of the selected (blue) Process Recipe. Modify Copies the selected (blue) job and adds it to the next line.

  • Page 48: Start Measurement

    − 43 − ME12058B Operation Section 7.4 Start Measurement Click on [Start Job]. The steps are executed from the create job list sequentially for measurement purposes. The status lamp of the signal tower turns green during the measurement. Fig. 7-4-1 START Button 7.5 End Analysis Upon completion of measurement, all of the job-list lines turn light yellow and [Control Job is finished.] is displayed in the title screen.

  • Page 49: Routine Checkup List

    − 44 − ME12058B Operation Section 8. ROUTINE CHECKUP LIST Cycle Items Week Month 6months Year Others Cooling water: Checking and adjusting the flow rate of secondary-water flow rate Compressed dry air: Checking and adjusting of the pressure of compressed dry air Vacuum: Checking and adjusting the suction pressure of...

  • Page 50: Trouble Shooting

    − 45 − ME12058B Operation Section 9. TROUBLE SHOOTING 9.1 Electric Power Troubles Causes and remedies Check to make sure that the circuit breaker of the power box The Start button does not on the facility side is turned on, and power is supplied to the operate.

  • Page 51: Startup

    − 46 − ME12058B Operation Section Startup Troubles Causes and remedies Check to make sure that the side doors of the main module or The goniometer cannot be EFEM are not open. (See “2.3 Interlock List”.) initialized. Check to make sure that the load port panels or rear panels are not open.
  • Page 52 − 47 − ME12058B Operation Section Troubles Causes and remedies Check to make sure that the water chiller is turned on. The equipment does not If the software screen shows a CW alarm, cooling water may generate X-rays. not be supplied to the X-ray tube. Turn on the water chiller, and check that cooling water is circulated properly.

  • Page 53: Beam Diagnosis

    − 48 − ME12058B Operation Section 9.3 Beam Diagnosis Troubles Causes and remedies If the intensity is low, the X-ray optics may be out of The direct beam intensity and adjustment. position are not as specified. Contact our service personnel in charge for NOTE: readjustment of the X-ray optics.

  • Page 54: Loadport

    − 49 − ME12058B Operation Section 9.4 Loadport Troubles Causes and remedies Conduct the startup procedure with the software. The door of the load port does not open. Conduct the following steps, and also refer to “5.3 Sample The carrier cannot be taken out. Unloading in the Event Emergency”.

  • Page 55: Wafer Transfer

    − 50 − ME12058B Operation Section 9.5 Wafer Transfer Troubles Causes and remedies If the vacuum pipe is connected to the factory facility, check The robot hand cannot perform the pressure in the vacuum line. the adsorbing function. The aligner cannot perform the Contact the maintenance personnel for NOTE: adsorbing function.

  • Page 56: Sample Alignment

    − 51 − ME12058B Operation Section 9.6 Sample Alignment Troubles Causes and remedies Check to make sure that the alignment condition. Sample alignment fails. Contact the maintenance personnel for NOTE: checking the alignment condition in the recipe. Check to make sure that the curvature of the sample is not too large.

  • Page 57: Xrr/Xrd Measurement

    − 52 − ME12058B Operation Section 9.7 XRR/XRD Measurement Troubles Causes and remedies Check to make sure that the slit setting in the recipe. measurement profile intensity is extremely high. Contact the maintenance personnel for NOTE: checking the slit condition in the recipe. Check to make sure that the sample alignment is conducted The measurement profile properly.

  • Page 58: Xrf Measurement

    − 53 − ME12058B Operation Section 9.8 XRF Measurement Troubles Causes and remedies Check the selection of the recipe. Analysis result is abnormal. The constants of calibration curve are not registered. The measurement result (thickness) is not calculated Contact the maintenance personnel for NOTE: after the measurement.

  • Page 59: X-Ray Trouble

    − 54 − ME12058B Operation Section 9.9 X-ray Trouble Troubles Causes and remedies Check to make sure that the side door of the equipment, load The X-ray generation turns off. port panel or rear panel is not open. Opening the side door or panel turns off the power of the X-ray generator.

  • Page 60: A1.1 Explanation Of Xrr (X-Ray Reflectometry Method)

    − 55 − ME12058B Operation Section APPENDIX 1 A1.1 Explanation of XRR (X-ray reflectometry method) It is well known that the refractivity of materials against X-rays is slightly smaller than 1. Thus, if an X-ray comes in at a very shallow angle, total reflection occurs. In XRR, the intensity of a reflected X-ray is measured in an angle range close to that for total reflection.
  • Page 61 − 56 − ME12058B Operation Section (2) When reflection occurs only on the surface θ/ θ (d eg ree) Fig. A1-1-3 Surface Reflection (3) When the reflected waves from the surface and interface interfere with each other − θ ∆ ⋅...
  • Page 62 − 57 − ME12058B Operation Section Degree of difficulty Analysis contents Target of analysis/ in analysis Film structure Oscillation interval → Film thickness Easy Single layer (roughly estimated from the FFT results) Critical angle → Density (roughly estimated from the critical angle) The accuracy of film thickness, density, and roughness can be Two layers improved through fitting analysis.

  • Page 63: A1.2 Analysis/Measurement Flow

    − 58 − ME12058B Operation Section A1.2 Analysis/Measurement Flow Ready Blue lamp ON LOAD READY Lamp ON Move to the measurement point Load Unload Press a button Alignment of sample height Measurement of the position Open of the reflection beam Angle alignment load port door Angle alignment...
  • Page 64 − 59 − ME12058B Operation Section Move to the wafer pickup position Open lid Unload wafer Return to the load port Analysis for all samples is complete Operator call Yellow lamp blinks Load Unload Press a button Open load port door Unload carrier Close load port door...

  • Page 65: A2.1 Training For Using Equipment

    − 60 − ME12058B Operation Section APPENDIX 2 A2.1 Training for Using Equipment (1) Training for Operation We provide the explanation of equipment operating procedures shown in the table below at the time of equipment delivery. Please discuss the schedule and contents of this training with our service personnel in charge. We can also provide additional explanation of equipment operation, if necessary.

  • Page 66: A3.1 Power Circuit Diagram

    − 61 − ME12058B Operation Section APPENDIX 3 A3.1 Power Circuit Diagram Fig. A3-1-1 Power Circuit Diagram 1...
  • Page 67 − 62 − ME12058B Operation Section Fig. A3-1-2 Power Circuit Diagram 2...

  • Page 68: A4.1 List Of Material Safety Database Sheet (Msds)

    − 63 − ME12058B Operation Section APPENDIX 4 A4.1 List of Material Safety Database Sheet (MSDS) List of Attached MSDSs Materials CAS No. Purposes Parts/Assemblies 7440-41-7 Vacuum seal for X-ray window X-ray tube Beryllium Air seal for detector window X-ray detector (APD) X-ray detector (SDD) 12190-79-3 Built-in Battery...

  • Page 69: A4.2 Msds Of Beryllium

    − 64 − ME12058B Operation Section A4.2 MSDS of Beryllium...
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  • Page 80: A4.3 Msds Of Lead

    − 75 − ME12058B Operation Section A4.3 MSDS of Lead...

  • Page 81: A4.4 Msds Of Lithium

    − 76 − ME12058B Operation Section A4.4 MSDS of Lithium...
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  • Page 84: A4.5 Msds Of Mercury

    − 79 − ME12058B Operation Section A4.5 MSDS of Mercury...
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  • Page 90: A4.6 Msds Of Mechanical Lubricating Grease

    − 85 − ME12058B Operation Section A4.6 MSDS of Mechanical Lubricating Grease...
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  • Page 97: A4.7 Msds Of Ethanol

    − 92 − ME12058B Operation Section A4.7 MSDS of Ethanol...
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  • Page 102 Differential Scanning Calorimeters Specifications Subject to Change without Notice Rigaku Corporation Tokyo Branch 4-14-4, Sendagaya, Shibuya-ku, Tokyo 151-0051, Japan Phone: 81-3-3479-0618 Fax: 81-3-3479-6112 e-mail: rinttyo@rigaku.co.jp Rigaku Corporation Rigaku Industrial Corporation Rigaku Americas Corporation 14-8, Akaoji-cho, Takatsuki-shi, 9009 New Trails Drive...

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