Cree XLamp ML Series Handling

Cree XLamp
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IntroDuCtIon
This application note applies to XLamp
have order codes in the following fomat:
MLxxxx-xx-xxxx-xxxxxx
This application note explains how XLamp ML family LeDs and
assemblies containing these LeDs should be handled during
manufacturing. Please read the entire document to understand
how to properly handle XLamp ML family LeDs.
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
XLamp are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do
®
not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is
not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please
contact Cree Sales at sales@cree.com.
ML Family LEDs
ML family LeDs, which
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soldering & handling

tabLE oF ContEnts

Handling XLamp ML Family LeDs ............................................. 2
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Circuit Board Preparation & Layouts ........................................... 3
Case Temperature (T ) Measurement Point ............................... 4
s
Notes on Soldering XLamp ML family LeDs............................. 4
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Low Temperature Operation ........................................................ 7
XLamp ML Family LED Reflow Soldering Characteristics ....... 8
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Chemicals & Conformal Coatings ............................................... 9
Assembly Storage & Handling ................................................... 10
Tape and Reel ............................................................................. 11
Packaging & Labels ................................................................... 12
, the Cree logo and
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Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
1 1
USA Tel: +1.919.313.5300