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Trenz Electronic TE0300 User Manual

Spartan-3e fpga industrial micromodule
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Chipsmall Limited consists of a professional team with an average of over 10 year of expertise in the distribution
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  • Page 1 Chipsmall Limited consists of a professional team with an average of over 10 year of expertise in the distribution of electronic components. Based in Hongkong, we have already established firm and mutual-benefit business relationships with customers from,Europe,America and south Asia,supplying obsolete and hard-to-find components to meet their specific needs.

  • Page 2: Features

    ■ Most I/O's on the B2B connectors are ■ Small size (only 40.5 mm x 47.5 mm) routed as LVDS pairs ■ Evenly spread supply pins for good signal integrity Figure 2: TE0300: top view. Figure 1: TE0300: bottom view. Trenz Electronic GmbH...

  • Page 3: Table Of Contents

    Features........................1 Specifications........................1 Applications........................3 Description........................3 Physical Features......................3 Power Supply.........................5 FPGA User I/Os......................6 User Button and LED.......................7 Configuration Switches....................7 JTAG and SPI.........................8 Clock Networks......................9 On-board Memories......................10 Module Configuration....................11 Changes from TE0300-00 to TE0300-01................24 Ordering Information....................24 Revision History......................24 Legal Notices.......................25 Environmental protection....................26 Appendix........................27...

  • Page 4: Applications

    USB are included. Figure 5: micromodule receptacle. Physical Features Board Dimensions The ordering numbers of the connector re- The module measures 40.50 mm by 47.50 ceptacles are given in Table 1. Board-to-Board Connectors Trenz Electronic GmbH...

  • Page 5: Power Supply

    Table 1: equivalent part numbers of the receptacle connectors J4 and J5. Figure 7: stacking height (h). The stacking height of the TE0300 B2B The on-board receptacles mate with their connectors is 7 (seven) mm. The stacking corresponding headers on the carrier board height does not include the solder paste (Figure 6).
  • Page 6 10 nF - 100 nF capacitors. Figure 10 shows how to short-circuit VccIO to internal 2.5 V power rail. I/O Banks Power Supply The Spartan-3E architecture organizes I/Os into four I/O banks (see Table 3). Trenz Electronic GmbH...

  • Page 7: Fpga User I/Os

    2 The push button is connected to the PB in- independent digital inputs; put (pin V16). as detailed in the following ■ 21 single-ended digital I/Os; table. ■ 5 single-ended inputs. Trenz Electronic GmbH...

  • Page 8: User Button And Led

    B2B connector) resets the USB micro- supplied down-converting the 5 V power controller and the FPGA. supply provided by either the USB-bus or the B2B receptacle connector. In this case, signals that are applied to the 3.3 V I/O Trenz Electronic GmbH...

  • Page 9: Jtag And Spi

    Programming terminated. DONE did not go high." Try setting DIP switch S4 to JTAG-only. A bug in certain Xilinx iMPACT versions can cause this. DIP Switches Overview Figure 11 summarizes functions and loca- tion of the four DIP switches. Trenz Electronic GmbH...

  • Page 10: Clock Networks

    24 MHz Clock Oscillator Table 12: SPI signal details (bank 2). The module has a 24 MHz SMD clock oscil- lator providing a clock source for both the USB microcontroller and the FPGA as de- tailed in Table 14. Trenz Electronic GmbH...

  • Page 11: On-Board Memories

    Main Clock Oscillator The module has a main SMD clock oscillat- On-board Memories or providing a clock source for the FPGA as detailed in Table 15. The TE0300 has three on-board memories: ■ DDR SDRAM Signal FPGA pin FPGA ball ■...

  • Page 12: Module Configuration

    (right) Module Configuration switch This section describes how to configure the EEPROM TE0300 module and access some of its re- sources. The JTAG interface allows a fast, frequent but volatile configuration of the TE0300 module. However, only through the JTAG...
  • Page 13 ■ wait until the operating system detects new hardware and starts the hardware assistant; ■ if S1 is not already switched to EEP- ROM, do it now; ■ answer the hardware assistant ques- tions as shown in the following ex- ample. Trenz Electronic GmbH...
  • Page 14 PROM (256 bytes) whereas the “Lg EEP- sole.exe” file in the “1st_program\CyCon- ROM” refers to the large EEPROM (64 KB). sole” folder). Press the “Lg_EEPROM” button, select the “USB.iic” file and press the “Open” button to start writing to EEPROM. Trenz Electronic GmbH...
  • Page 15 Upgrade progress is displayed in status window and is completed when “Download Successful” text is displayed. Disconnect the USB cable. Dedicated USB Firmware Driver Installation Check the configuration switches against the following table: Trenz Electronic GmbH...
  • Page 16 “USB-Controller” “DEWESoft Device 0” has been added. FWU File Generation The TE0300 micromodule can be con- figured by means of a firmware-upgrade (FWU) file (see next section “Micromodule Configuration” for further reference). The first step in generating the FWU file is to generate the fpga.bin file corresponding to...
  • Page 17 Select “prepare PROM file”. Set “PROM File Name” to “fpga” and change “Location” to a suitable name and location. Select “BIN” as output. Check “Auto Select PROM”. Navigate to your project’s IMPLEMENTA- TION folder and select “download.bit”. Trenz Electronic GmbH...
  • Page 18 Spartan-3E FPGA Industrial Micromodule User Manual Click GENERATE FILE or select from menu Operations / Generate file. The following warning is a normal situ- ation. This is probably the one and only file with your design. You are done. Congratulations! Trenz Electronic GmbH...
  • Page 19 ■ replace existing USBFWUTool\FWUs\fpga.bin with latest fpga.bin (Bootload.ini and usb.bin are always unchanged) ■ zip the 3 files ■ change the “zip” file extension to “fwu” ■ upload the file as explained in the next section (Micromodule Configuration). Trenz Electronic GmbH...
  • Page 20 SPI flying leads cable and the USB cable. Start Xilinx ISE iMPACT. The following ex- ample shows the case of iMPACT 9.2. If the “iMPACT Project” window pops up, press the “Cancel” button. Trenz Electronic GmbH...
  • Page 21 In the following example, we will show how to select the micromod- ule reference device “blinking.mcs” in the “TE0300” folder. Right click the SPI PROM device and select the “Program” operation. Select the part name corresponding to the...
  • Page 22 “iMPACT Project” window pops up, After successful programming, you should press the “Cancel” button. read the message “Program Succeeded” popping up for a few seconds in the “Direct SPI Configuration” panel. Double click the “Boundary Scan” option in the “Modes” panel. Trenz Electronic GmbH...
  • Page 23 “blinking.bit” Select now the SPI Flash corresponding to “TE0300” folder. Do not forget to select the one present on the module (STMicro- the “Enable Programming of SPI Flash electronics M25P32 in the example, a 32 Device Attached to this FPGA” option in the Mbit (4M x 8) Serial Flash memory).
  • Page 24 After successful programming, you should read the message “Program Succeeded” In the “Device Programming Properties” popping up for a few seconds in the window, just leave the default settings and “Boundary Scan” panel. press the “OK” button. Trenz Electronic GmbH...

  • Page 25: Changes From Te0300-00 To Te0300-01

    Spartan-3E FPGA Industrial Micromodule User Manual B2B Connectors Contact 14 of connector J5 has been ex- tended from an input in TE0300-00 to an I/O in TE0300-01. Therefore hardware designs developed for the TE0300-00 are compatible with the TE0300-01 whereas...

  • Page 26: Legal Notices

    1.13 2009-09-01 improved “On- board Memories” Limitation of Liability chapter In no event will Trenz Electronic, its sup- 1.14 2009-09-03 improved clock, pliers, or other third parties mentioned in memory and con- this document be liable for any damages...

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