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EMC2 TAE Disassembly Instructions Manual

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WEEE DISASSEMBLY
INSTRUCTIONS
for the TAE and TAE-DC Disk Array Enclosure
Abstract
This document provides clear guidance for end-of-life recyclers
on how to identify and disassemble reportable materials in
compliance with the Waste Electrical and Electronic Equipment
(WEEE) directive. The document does not replace disposal

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  • Page 1 WEEE DISASSEMBLY INSTRUCTIONS for the TAE and TAE-DC Disk Array Enclosure Abstract This document provides clear guidance for end-of-life recyclers on how to identify and disassemble reportable materials in compliance with the Waste Electrical and Electronic Equipment (WEEE) directive. The document does not replace disposal...
  • Page 2 Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be the property of their respective owners. Published in the USA. WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...
  • Page 3 Part Number: 300-015-574 WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 4: Table Of Contents

    8.0 Product Photos ........................11 9.0 Locating Materials—TAE and TAE-DC Disk Array Enclosure..........12 9.0.1 Locating Materials on the TAE Power/Cooling Module (AC Type) ......14 9.0.2 Locating Materials on the TAE-DC Power/Cooling Module ........16 9.0.3 Locating Materials in the Midplane Assembly .............. 18 9.0.4 TAE and TAE-DC Accessories and Optional Equipment ..........
  • Page 5 13.0.4.3 Removing materials in the DC Power/Cooling Module ........41 13.0.5 Disassembling the Chassis for Recycling and Retrieving the Midplane PCB..43 14.0 RoHS Restricted Materials ....................45 WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 6: Document Purpose

    3. Review 12.0.2 Safety Precautions and Battery Warnings prior to disassembling the product. 4. Review 13.0 Disassembling the TAE and TAE-DC Disk Array Enclosure for removal procedures. 5. 4.0 Related Documentation EMC provides separate WEEE disassembly instructions per product platform. Contact EMC WEEE administrator at ewaste@emc.com...
  • Page 7 WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 8: Acronyms

    Global Warming Potential Hydrocarbons HCFC Hydrochlorofluorocarbons HDPE High-Density Polyethylene Mercury Link Control Card LDPE Low-Density Polyethylene Lead Polybrominated Biphenyls PBDE Polybrominated Diphenyl Ethers Polycarbonate Printed Circuit Board Polychlorinated Terphenyl WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...
  • Page 9 Polyethylene Terephthalate Polypropylene Polystyrene Platinum Polyvinyl Chloride RoHS Restriction of Hazardous Substances Serial Attached SCSI Storage Processor Storage Processor Enclosure Solid State Disk Volt WEEE Waste Electrical and Electronic Equipment WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 10: Product Identification

    7.0 Product Identification 7.0.1 TAE and TAE-DC Disk Array Enclosure Note: EMC uses the Product Regulatory Model Name (usually represented by letters, see the first item in Table 2) as the main identifier throughout this document. Locate the product regulatory model name on the Device Rating Label (DRL) affixed to a rectangular recess on the top of the product chassis.

  • Page 11: Product Photos

    8.0 Product Photos Figure 1. TAE or TAE-DC front view (fully populated with twenty five hard disk drives) Figure 2. TAE or TAE-DC rear view (TAE shown) WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 12: Locating Materials-Tae And Tae-Dc Disk Array Enclosure

    9.0 Locating Materials—TAE and TAE-DC Disk Array Enclosure Figure 3 and Figure 4 identify TAE and TAE-DC Disk Array Enclosure components. Table 3 and Table 4 provide the disassembly sequence with links to disassembly procedures. Item numbers below correspond with reportable materials listed in Table 10 through Table 12.
  • Page 13 Table 4 Decoder and Disassembly Sequence Item Component Item Component Connector Fence (non-ferrous) SAS Connector Cage (not visible, under air dam) Plastic LCC Guide (ABS plastic) Heat Sink (aluminum) Air Dam (ferrous) LCC PCB WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 14: Locating Materials On The Tae Power/Cooling Module (Ac Type)

    9.0.1 Locating Materials on the TAE Power/Cooling Module (AC Type) Figure 5 and Figure 6 identify power/cooling module components. Table 5 also provides the disassembly sequence with links to disassembly procedures. Item numbers below correspond with reportable materials listed in materials listed in Table 10 through Table Figure 5.
  • Page 15 Component Item Component Top Cover (sheet metal) Wiring (cable sheathing, copper) Top PCB Bottom PCB Coils (copper) Fan Pack Assembly (ABS Plastic) Large Capacitor Power/Cooling Module Carrier (sheet metal) WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 16: Locating Materials On The Tae-Dc Power/Cooling Module

    9.0.2 Locating Materials on the TAE-DC Power/Cooling Module Figure 7 and Figure 8Figure 6 identify TAE-DC power/cooling module components. Table 6 also provides the disassembly sequence with links to disassembly procedures. Item numbers below correspond with reportable materials listed in Table 10 through Table 12.
  • Page 17 Figure 8. Materials located on the TAE DC Power/Cooling Module PCB Table 6. Decoder and Disassembly Sequence Item Component Item Component Top Cover (sheet metal) Coils (copper) Fan Pack Assembly (ABS Plastic) Large Capacitor Top PCB Bottom PCB Heat Fins...

  • Page 18: Locating Materials In The Midplane Assembly

    Figure 9. Locating midplane air flappers (ABS plastic) Figure 10. Midplane PCB Table 7 Decoder and Disassembly Sequence Item Component Two Power/Cooling Module Air Flappers (ABS plastic) Two LCC Assembly Air Flappers (ABS plastic) Midplane PCB WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 19: Tae And Tae-Dc Accessories And Optional Equipment

    9.0.4 TAE and TAE-DC Accessories and Optional Equipment Table 8 lists accessories and optional hard disk drives. Table 8 TAE and TAE-DC Accessories and Options Component Photo Disassembly Required? AC Power Cord See Table 10 Complete list of Reportable Materials on TAE and TAE-...

  • Page 20: Locating Materials On A 2.5-Inch Hard Disk Drive

    Table 10 through Table 12. Also see Removing and Disassembling a Hard Disk Drive. Figure 11. TAE and TAE-DC 2.5-inch hard disk drive Table 9 Decoder and Disassembly Sequence Item Component SAS PCB...

  • Page 21: Tae And Tae-Dc Disk Array Enclosure Pcbs

    10.0 TAE and TAE-DC Disk Array Enclosure PCBs 2.5-inch Hard Disk Drive PCB (SAS) LCC PCB Midplane PCB WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 22: Reportable Materials On Tae And Tae-Dc Common Components

    11.0 Reportable Materials on TAE and TAE-DC Common Components Table 10 lists components that require selective treatment. Refer to Figure 3 through Figure 11 to locate the item numbers listed. Table 10 Complete list of Reportable Materials on TAE and TAE-DC Components Material Item Location...
  • Page 23 (Hexavalent Chromium) in the case of absorption refrigerators Any other liquid, such as oils and acids in Absent particular Components containing refractory ceramic fibers Absent Photo-conducting drums containing cadmium or Absent selenium WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 24: Materials Of Interest To Recyclers (Tae And Tae-Dc)

    11.1 Materials of Interest to Recyclers (TAE and TAE-DC) Table 11 lists materials for recycling. Refer to Figure 3 through Figure 11 to locate the item numbers listed. Table 11 Complete list of Recyclable Materials on TAE and TAE-DC Components Material Item...

  • Page 25: Precious Metals (Tae And Tae-Dc)

    11.2 Precious Metals (TAE and TAE-DC) Table 12 lists precious metals for recovery. Refer to Figure 3 through Figure 11 to locate the item numbers listed. Table 12 Plastic Part Markings on TAE and TAE-DC Components Material Item Location Power/Cooling Module...

  • Page 26: Disassembly Details

    - Replace only with the battery type recommended by the equipment manufacturer. - Discard used batteries according to manufacturer’s instructions. - Do not attempt to reuse or install batteries in any other system, for any other purpose. WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 27: Disassembling The Tae And Tae-Dc Disk Array Enclosure

    2. Press on the disk's latch button to release the latch. 3. Pull the latch and slowly pull the disk from its slot. Figure 13. Removing a Hard Disk Drive from a TAE or TAE-DC 4. To disassemble: a. Remove the five screws that attach the larger PCB to the assembly, and lift off.

  • Page 28: Removing An Lcc

    13.0.2 Removing an LCC 1. Press the orange handle buttons to release the LCC, pull the latches outward. 2. Remove the LCC from its slot. Figure 15. Removing an LCC WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 29: Removing Lcc Components

    3. Drill the four rivets that attach the air dam to the LCC assembly, and remove the air dam. 4. Remove the four screws attach the SAS connector cage (highlighted), and remove. Connector Figure 16. Removing the connector fence, LCC guide, air dam, and SAS connector WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 30: Removing The Lcc Pcb Heat Sink And Lcc Pcb

    Remove all components in 13.0.2.1 Removing LCC Components. b. Flip the LCC PCB over and remove the two screws that attach the black insulator. The LCC PCB is now ready to recycle. WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 31: Removing And Disassembling The Power/Cooling Module (Ac Type)

    13.0.3 Removing and disassembling the power/cooling module (AC type) 1. Press the orange handle button to release the module. 2. Pull the latch outward and remove the power/cooling module from its slot. WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...
  • Page 32 Figure 19. Removing a power/cooling module WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 33: Dc Power/Cooling Module Top Cover

    Figure 20. Removing two power/cooling module top cover screws b. Turn the power/cooling around to the opposite end and remove the third screw (circled), and lift off the top cover. WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 34: Power/Cooling Module Top Pcb

    2. Separate the insulator from the PCB, and lift off it off. Figure 22. Removing four top PCB screws 3. Disconnect the power/cooling module wiring from the bottom PCB and remove the top PCB. WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 35: Removing Materials On The Power/Cooling Module Top Pcb

    Use a solder iron to unsolder the leads that attach the capacitor to the PCB. b. Remove the large capacitor. The top PCB is ready to recycle after all components are removed. WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...
  • Page 36 Large Figure 24. Removing top PCB materials WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 37: Removing Materials On The Power/Cooling Module Bottom Pcb

    Use wire cutters to cut the remaining end, and remove the cable. The bottom PCB is ready to recycle when all components are removed. Two Transformers with Figure 25. Removing bottom PCB materials WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 38: Removing The Power/Cooling Module Fan Pack Assembly, Attached Wiring, Carrier

    Once each individual fan is removed from the assembly, disconnect the wiring. The power/cooling module carrier is ready to recycle when the last item (fan pack assembly) is removed. WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 39: Removing And Disassembling The Power/Cooling Module (Dc Type)

    1. Press the orange handle button to release the module. 2. Pull the latch outward and remove the power/cooling module from its slot. Figure 28. Removing a power/cooling module WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

  • Page 40: Dc Power/Cooling Module Top Cover

    Top PCB 1. Push the tabs on the fan pack assembly towards the middle, and pull up to remove. 2. Remove four screws (circled) that attach the top PCB. WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...
  • Page 41 3. Disconnect the power/cooling module wiring from the bottom PCB and remove the top PCB. Figure 31. Removing the top PCB 13.0.4.3 Removing materials in the DC Power/Cooling Module 1. Detach the heat fins. 2. To remove the wiring: WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...
  • Page 42 Use a solder iron to unsolder the leads that attach the capacitor to the PCB. b. Remove the large capacitor. The PCBs and power/cooling module carrier are ready to recycle after all components are removed. WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...
  • Page 43 13.0.5 Disassembling the Chassis for Recycling and Retrieving the Midplane PCB To disassemble the 25-slot chassis: 1. Remove all components listed in 13.0 Disassembling the TAE and TAE-DC Disk Array Enclosure. Note: All materials that make up the chassis are ready for recycling after all components are removed.
  • Page 44 WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...
  • Page 45 RoHS Exemption 24: Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...
  • Page 46 WEEE Disassembly Instructions for the TAE and TAE-DC Disk Array Enclosure...

This manual is also suitable for:

Tae-dc

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