Cree XB-D Series Manual

Cree Xlamp
®
inTroduCTion
This application note applies to XLamp XB-D LeDs
which have order codes in the following format.
XBDxxx-xx-xxxx-xxxxxxxxx
This application note explains how XLamp XB-D LeDs
and assemblies containing these LeDs should be
handled during manufacturing. Please read the entire
document to understand how to properly handle
XLamp XB-D LeDs.
Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
Cree logo and XLamp are registered trademarks of Cree, Inc. This document is provided for informational purposes only and is not
®
a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
XB-d leds
®
Soldering & handling

TaBle of ConTenTS

Handling XLamp XB-D LeDs .................................2
Circuit Board Preparation & Layouts ......................4
Case Temperature (T ) Measurement Point .............4
s
Notes on Soldering XLamp XB-D LeDs ...................5
Moisture Sensitivity ............................................6
XLamp XB-D LED Reflow Soldering Characteristics ..7
Chemicals & Conformal Coatings ..........................8
Assembly Storage & Handling ...............................9
Tape and Reel - XB-D LeDs ................................ 10
Packaging & Labels ........................................... 11
, the
®
Cree, Inc. Cree, Inc.
4600 Silicon Drive 4600 Silicon Drive
Durham, NC 27703 Durham, NC 27703
USA Tel: +1.919.313.5300 USA Tel: +1.919.313.5300
www.cree.com/xlamp