Keithley 7172 Instruction Manual page 8

Low current 8x12 matrix card
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7172 8×12 Low Current Matrix Card
MATRIX CONFIGURATION: Single 8 rows×12 columns. Expanding
the columns can be done internally by connecting the rows of mul-
tiple 7172 cards together with coax jumpers.
OFFSET CURRENT SELF TEST: An onboard electrometer circuit
measures offset current when the rear panel switch is pushed.
Pass/fail LEDs indicate if offset is above or below 500fA. The on-
board SMB connector outputs voltage proportional to current
(1mV/10fA).
CROSSPOINT CONFIGURATION: 2-pole Form A (Signal, Guard).
CONNECTOR TYPE: 3-lug triax (Signal, Guard, Chassis).
MAXIMUM SIGNAL LEVEL: Pin to pin or pin to chassis: 200V. 1A
carry/0.5A switched, 10VA.
CONTACT LIFE: Cold Switching: 10
Level: 10
5
closures.
PATH RESISTANCE (Per Conductor): <1.0Ω initial, <1.5Ω at end of
contact life.
CONTACT POTENTIAL: Differential (Signal to Guard): <30µV.
Single ended (Guard to Guard or Signal to Signal): <60µV.
OFFSET CURRENT: <500fA, 150fA typical.
H G C
H G C
H G C
H G C
H G C
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8
closures. At Maximum Signal
Columns
H G C
H G C
H G C
H G C
H G C
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Offset current
self test
ISOLATION:
Ω, 0.4pF typical.
Path (Signal to Signal): >10
13
Differential (Signal to Guard): >10
Common (Signal and Guard to Chassis): >10
CROSSTALK (1MHz, 50Ω Load): <–70dB.
INSERTION LOSS (1MHz, 50Ω Load): 0.22dB typical.
3dB BANDWIDTH (50Ω Load, 50Ω Source): 30MHz typical.
RELAY DRIVE CURRENT (Per Crosspoint): 30mA.
RELAY SETTLING TIME: <2ms.
EMC: Conforms to European Union Directive 89/336/EEC.
SAFETY: Conforms to European Union Directive 73/23/EEC (meets
EN61010-1/IEC 1010).
ENVIRONMENT:
Offset Current and Path Isolation Specifications: 23°C,
<50% R.H.
Operating: 0° to 50°C, up to 35°C at 70% R.H.
Storage: –25° to +65°C.
ACCESSORY SUPPLIED: Instruction manual and eight SMB expan-
sion cables (C99-1A).
H G C
H G C
User
connections
and expansion
2
2
H
2
2
G
C
H
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G
C
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2
H
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G
C
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H
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G
C
Rows
H
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G
C
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H
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G
C
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H
2
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G
C
H
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G
C
Ω, 170pF typical.
9
Ω, 430pF typical.
9

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