Table of Contents
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1.Cover
Figure6
Figure4
Preheat plate disassembly diagram
Hot air gun disassembly diagram
Glovelike
Handle cover
BOARD
HEATER
Voyage seat
12
Figure5
Soldering Iron disassembly diagram
5.Preheating place
3.Preheating place bracket
4.Fasten
2.Screws
Spool
handle line
Preheating Station&Hot air reworks
&soldering staiong combinationg
853serise
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Table of Contents
Summary of Contents for PowerSafe 853 Serises
- Page 1 853serise 1.Cover Preheating station&Hot air reworks 5.Preheating place 3.Preheating place bracket &soldering staiong combinationg 4.Fasten 2.Screws Figure6 Figure4 Preheat plate disassembly diagram Hot air gun disassembly diagram Spool Glovelike Handle cover handle line BOARD HEATER Voyage seat Figure5 Soldering iron disassembly diagram...
- Page 2 The do’s and don’t s General Usage 1.DO NOT install/De-install Nozzles with excessive force.DO NOT use pliers to pull the nozzle 1.Suitable for de-soldering and soldering BGA,SOIC,CHIP,QFP,PLCC package SMD IC, edge out,DO NOT tight the nozzle’s bolt exessively. Particularly suitable for de-soldering BGA module ,computer motherboard north and south 2.Only install nozzles when the unit is cool(room temperature) bridge, all kind of mobile phone motherboard SMT IC and LED lights.
- Page 3 Preheating station air gun temperature up button air gun temperature up button Temperature Range Temperature Stability Display Type Area preheating station temperature up button Hot Air Reworks preheating station temperature up button Figure3 Airflow type WARNING Air Flow Temperature Range In view of could cause serious injuries of fire accidents,please strictly observe the following 1.Must be confirmed well-connected handle and the machine, after that open the power supply Temperature Stability...
- Page 4 Motherboard heating can be used three methods, namely conduction, convection, and thermaleffe 3).Turn on thee heating switch,the preheat plate heating set the appropriate temperature can be preheated -rma effects. Conduction heating when the heat source with the motherboard contacts(for example, B.853AA/853AAA using a hot plate),which on the rear components of the circuit board not applicable(NA);The thermal 1).Preheating station laid out...
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