Related Manuals for CIS DCC-HD1
Summary of Contents for CIS DCC-HD1
- Page 1 DCC-HD1 Rev.900-785-30-00 English FULL HD Color MOS Assembly Unit DCC-HD1 Product Specification & Operational Manual CIS Corporation ©2013 CIS Corporation. All rights reserved.
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Page 2: Table Of Contents
Operating temperature of main parts ......................8 8.2. Temperature measurement of the surface of the device................8 8.3. Reference> surface temperature of each device in a CIS chassis(29mm×29mm×77mm) ........ 8 Factory Settings ..............................9 Dimensions ..............................10 Case for Indemnity (Limited Warranty) ......................11 MOS Pixel Defect .............................. -
Page 3: Scope Of Application
DCC-HD1 is an assembly unit for camera modules. It is designed based on the premise of embedding in a camera. Therefore, the appropriate heat dissipation needs to be considered when embedding the board unit. -
Page 4: Product Outline
DCC-HD1 Rev.900-785-30-00 Product Outline DCC-HD1 is provided as an assembly unit that is a part of CIS full HD color camera module, VCC-HD1, utilizing a 1/3 type MOS image sensor. 1080 60p/59.94p/50p (3G-SDI), 1080 60i/59.94i/50i (HD-SDI), 720 60p/59.94p/50p (HD-SDI) is corresponded. -
Page 5: Specifications
DCC-HD1 Rev.900-785-30-00 5. Specifications 5.1. General Specifications Note: The specification below is based on a chassis typed camera of CIS VCC-HD1. (1) Pick up device Device Type 1/3 type MOS sensor (color) 1944(H) × 1092(V) Effective Pixel Numbers Unit Cell Size 2.75μm(H) ×2.75μm(V) - Page 6 Some 3G-SDI receivers correspond to either Level A or B, whereas other receivers correspond to both Levels, so please set the camera mode to match your 3G-SDI receiver. ©2013 CIS Corporation. All rights reserved.
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Page 7: Part Names And Functions
Connnect to the DC IRIS LENS using the attached 4 pins cable. No connection is needed when DC IRIS is not in use. RS-232C I/F connector (3 pins) Signal for RS-232C Connect to the RS-232C using the attached 3 pins cable. No connection is needed when RS-232C is not in use. ©2013 CIS Corporation. All rights reserved. -
Page 8: External Connector
BCJ-BPLHA (CANARE) Pin No. 3G-SDI/HD-SDI output 7.3 PD-VC01 CN4 (4 pins) Model Name： BM4B-SRSS-TB (JST) Pin No. IRIS_DUMP+ IRIS_DUMP- IRIS_DRIVE- IRIS_DRIVE+ 7.4 PD-VC01 CN4 (4 pins) Model Name BM4B-SRSS-TB (JST) Pin No. RS-232C_TXD RS-232C_RXD ©2013 CIS Corporation. All rights reserved. -
Page 9: Guideline For Thermal Design
Measure temperature by fixing a thermocouple to the device surface with tape, making a slit in the heat conduction sheet, and adhering a heat-sink tightly onto it. (E.g.： Temperature measurement of the surface of FPGA) 8.3. Reference> surface temperature of each device in a CIS chassis(29mm×29mm×77mm) Ambient 25℃ 40℃... -
Page 10: Factory Settings
OFF, 1, 2, 3, 4, 5 Color Saturation 0(%)～200(%) 100(%) -100～100 Color Balance Blue/Red Color Balance Green/Magenta -100～100 Pedestal OFF/ON 0～127 Pedestal Level Contrast -2, -1, 0, 1, 2 Auto Gamma OFF, ON, ON[Strong] ©2013 CIS Corporation. All rights reserved. -
Page 11: Dimensions
DCC-HD1 Rev.900-785-30-00 10. Dimensions ©2013 CIS Corporation. All rights reserved. -
Page 12: Case For Indemnity (Limited Warranty)
MOS Pixel Defect MOS pixel defects might be noted with time of usage of the products. The cause of the MOS pixel defects is the characteristic phenomenon of MOS itself and CIS is exempted from taking any responsibilities for them.
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