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Digital Equipment AXPpci 33 Design Manual

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Digital AXPpci 33
Alpha PC Motherboard
OEM Design Guide
Order Number: EK–AXPCI–DG. C01
This guide supplies reference, configuration, and installation information for
the Digital AXPpci 33 Alpha PC motherboard.
Revision/Update Information:
Digital Equipment Corporation
Maynard, Massachusetts
This manual supersedes the Digital AXPpci
33 Alpha PC Motherboard OEM Design
Guide , EK–AXPCI–DG. B01.

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Summary of Contents for Digital Equipment AXPpci 33

  • Page 1 Alpha PC Motherboard OEM Design Guide Order Number: EK–AXPCI–DG. C01 This guide supplies reference, configuration, and installation information for the Digital AXPpci 33 Alpha PC motherboard. Revision/Update Information: This manual supersedes the Digital AXPpci 33 Alpha PC Motherboard OEM Design Guide , EK–AXPCI–DG.
  • Page 2 While Digital believes the information in this publication is correct as of the date of publication, it is subject to change without notice. Digital Equipment Corporation makes no representations that the use of its products in the manner described in this publication will not infringe on existing or future...

  • Page 3: Table Of Contents

    SIMM Interconnect (J2–J5) • 2–17 2.2.2.18 Speaker Connector (J10) • 2–18 2.2.3 Device Sockets 2–19 2.2.3.1 AXPpci 33 Processor Socket (XE15) • 2–19 2.2.3.2 Cache Sockets (XE100–XE110) • 2–19 2.2.4 MLB Jumpers 2–20 2.2.4.1 Cache Speed Select (J17) • 2–20 2.2.4.2...
  • Page 4 Contents SINGLE INLINE MEMORY MODULES 2–24 2.3.1 Connector 2–24 2.3.2 Physical Mounting 2–25 ISA OPTION MODULES 2–25 PCI OPTION MODULES 2–26 CHAPTER 3 ENVIRONMENTAL DATA 3–1 COOLING REQUIREMENTS 3–1 3.1.1 Air Flow 3–1 3.1.2 DECchip 21066 Heatsink Selection 3–1 3.1.2.1 DECchip 21066 (166 MHz) Cooling Requirements •...
  • Page 5 Contents ACCESSORIES AND SUPPLIERS A–4 APPENDIX B CONNECTOR SUMMARY B–1 APPENDIX C TESTED OPTIONS C–1 APPENDIX D INSTALLATION AND HANDLING INSTRUCTIONS D–1 ANTISTATIC PRECAUTIONS D–1 INSTALLATION INSTRUCTIONS D–1 D.2.1 Heatsink Labeling D–1 D.2.2 Grafoil Thermal Pad — Pick and Place D–1 D.2.3 Heatsink Attachment...
  • Page 6 Contents SRM CONSOLE E–3 E.3.1 Conventions E–4 E.3.2 Special Characters E–4 E.3.3 boot Command E–5 E.3.3.1 Syntax • E–5 E.3.3.2 Options • E–5 E.3.3.3 Examples • E–6 E.3.4 set Command E–6 E.3.4.1 Syntax • E–6 E.3.4.2 Options • E–6 E.3.4.3 Examples •...
  • Page 7 POWER GOOD Timing Diagram 3–10 D–1 Heatsink Assembly D–2 D–2 Fan/Heatsink Assembly D–3 D–3 SIMM Installation D–5 TABLES Conventions 1–1 Digital AXPpci 33 System Summary 1–1 1–2 SPECint92, SPECfp92, Dhrystone VI, and Whetstone Performance Metrics 1–3 1–3 Rhealstone Performance Metrics 1–3...
  • Page 8 Contents 2–1 DC Power Connector (±5 V/±12 V) Pin-Out (J33) 2–6 2–2 DC Power Connector (+3.3 V) Pin-Out (J34) 2–6 2–3 Fan Connector Pin-Out (J1) 2–7 2–4 Floppy Disk Connector Pin-Out (J12) 2–7 2–5 Halt/Reset Switch Connector Pin-Out (J11) 2–8 2–6 IDE Disk Connector Pin-Out (J18) 2–8...
  • Page 9 System DC Power Requirements (Using 21068A at 100 MHz) 3–9 3–18 POWER GOOD — Undervoltage Threshold 3–11 3–19 POWER GOOD — Electrical Characteristics 3–11 3–20 MTBF Data for the AXPpci 33 MLB 3–12 A–1 MLB and Bundled Kit Configurations A–1 A–2 MLB Options A–3 A–3 Accessories and Suppliers A–4...

  • Page 11: Preface

    Preface This guide supplies reference, configuration, and installation information for the Digital AXPpci 33 Alpha PC motherboard. Included are details on physical, electrical, environmental, and operational characteristics. The guide furnishes system integration customers with design details of the motherboard so they can integrate this subsystem component into a standard or custom application.
  • Page 12 Preface Table 1 (Cont.) Conventions Convention Meaning italic type The following items appear in italic type: • Variable information, such as user-supplied information in commands. For example: >>> set envar value [-default] [-integer] [-string] • Directory and file specifications when these appear in text.
  • Page 13 Preface Reference Documents The next sections list associated documents to which you may want to refer. Digital Documents • Digital AXPpci 33 Data Sheet (EC–F2938–56) • Alpha AXP Architecture Reference Manual (EY–L520E–DP) • Alpha AXP Architecture Handbook (EC–H1689–10) • AlphaServer 2000/2100 Firmware Guide (EK–AXPFW–RM) •...

  • Page 15: Chapter 1 System Summary

    Digital AXPpci 33 motherboard. Table 1–1 includes features of the DECchip 21066 processor used for the Digital AXPpci 33. Features are common across all versions of the motherboard unless specifically differentiated. Table 1–1 Digital AXPpci 33 System Summary...
  • Page 16 System Summary Table 1–1 (Cont.) Digital AXPpci 33 System Summary Input/Output Input device interfaces AT or PS/2 style keyboard and mouse. Serial Two RS–423 (9-position) compatible serial communications ports. Parallel One parallel (Centronics compatible) communications port. Bus options Total of seven option slots.

  • Page 17: Specint92, Specfp92, Dhrystone Vi, And Whetstone Performance Metrics

    System Summary Tables 1–2 and 1–3 show the configuration performance metrics for the Alpha processor type, clock frequency, and cache. All benchmarks were performed using the Digital UNIX operating system. Table 1–2 SPECint92, SPECfp92, Dhrystone VI, and Whetstone Performance Metrics Alpha Clock Processor...
  • Page 18 System Summary Figure 1–1 Main Logic Board MR-6391-AI 1–4...

  • Page 19: Chapter 2 Physical Description

    Physical Description This chapter describes the following physical features of the Digital AXPpci 33: • Core module assembly • Main logic board (MLB) • Single inline memory modules (SIMMs) • ISA option modules • PCI option modules Core Module Assembly Figure 2–1 depicts a typical core module assembly consisting of:...

  • Page 20: Physical Mounting

    2.2.1 Physical Mounting The AXPpci 33 MLB is a standard Baby–AT form factor with the addition of three 0.157 inch diameter ‘‘B’’ holes. The ‘‘B’’ holes are module tooling holes used during manufacturing. As shown in Figure 2–2, nine 0.157 inch diameter holes and one 0.157 inch x 0.256 inch slot are available for...

  • Page 21: Connectors

    WARNING: The system integrator must provide ground continuity between the power supply output ground and the safety ground. Failure to do so can damage the AXPpci 33 motherboard and attached equipment. Connection can be supplied using grounding screws as just described.
  • Page 22 Physical Description Figure 2–2 MLB Mechanical Drawing MR-6414-AI 2–4...
  • Page 23 Physical Description Figure 2–3 MLB Component Outline Drawing MR-6401-AI 2–5...

  • Page 24: Engineering And Manufacturing Test Connector (J32)

    Physical Description Table 2–1 DC Power Connector (±5 V/±12 V) Pin-Out (J33) Pin Number Function POWER GOOD +5 V +12 V -12 V Ground Ground Ground Ground -5 V +5 V +5 V +5 V Table 2–2 lists the pins and functions of the dc power connector (J34). Table 2–2 DC Power Connector (+3.3 V) Pin-Out (J34) Pin Number Function...

  • Page 25: Fan Connector (J1)

    No connection Ground 2.2.2.4 Floppy Disk Connector (J12) The AXPpci 33 supports one floppy disk controller interface (J12). This is a 34-position (2 x 17) male-shrouded keyed connector. Table 2–4 lists the pin numbers and functions for the floppy disk connector.

  • Page 26: Halt/Reset Switch Connector (J11)

    MR-6413-AI 2.2.2.6 IDE Disk Connector (J18) The AXPpci 33 supports one IDE compatible interface (J18) for the Windows NT operating system. This is a 40-position (2 x 20) male- shrouded keyed connector. The IDE interface does not currently support the Digital UNIX operating system.

  • Page 27: Isa Slot Connectors (J20-J24)

    Preface. 2.2.2.8 Keyboard Connectors (J39 and J38) The AXPpci 33 is orderable with either the AT style (J39) 5-position DIN keyboard connector or with a 6-position mini-DIN PS/2 style (J38) keyboard connector. These connectors are mutually exclusive. The PS/2 style MLB also includes a PS/2 style mouse connector (see J40).

  • Page 28: Keylock And Power Led Connector (J9)

    Physical Description Table 2–7 Keyboard Connector — AT Style Pin-Out (J39) Number Function Number Function Clock Ground Data +5 V No connection Table 2–8 lists the pin numbers and functions of the PS/2 keyboard connector. Table 2–8 Keyboard Connector — PS/2 Style Pin-Out (J38) Number Function Number...

  • Page 29: Led Display Connector (J6)

    Physical Description Figure 2–5 Keylock and Power LED Circuit MR-6408-AI 2.2.2.10 LED Display Connector (J6) The 16-position (2 x 8) LED display connector (J6) supplies power and signals to an optional circuit board (system integrator provided) with 8 LEDs. The LEDs light with various codes to show the state of the boot and power-up-self-test (POST) diagnostic firmware.
  • Page 30 Physical Description Table 2–10 LED Display Connector Pin-Out (J6) Number Function Number Function +5 V LED 7 No connection LED 6 No connection LED 5 LED ENABLE L LED 4 LEDCLK LED 3 No connection LED 2 No connection LED 1 Ground LED 0 Figure 2–6 shows the LED display circuit.

  • Page 31: Mouse Connector - Ps/2 Compatible (J40)

    Physical Description Table 2–11 lists LED codes and the related states. Table 2–11 LED Display Codes LED Code Data Bits [7:0] (1=On; 0=Off) Test Condition 1111 1110 Size memory Empty bank 1111 1101 " " Sizing complete 1111 1011 Configure memory Configuration complete 1111 1010 Test memory...

  • Page 32: Parallel Port Connector (J36)

    2.2.2.13 PCI Slot Connectors (J25–J27) The AXPpci 33 supports three PCI option slots (5 V/32 bit). Connector J34 connects 3.3 V to 3.3 V capable PCI cards. One slot supports a short PCI module; two support long PCI modules. The PCI option components in PCI slot 3 (J25) occupy the same space the ISA option in ISA slot 1 (J24) would occupy, making the slots mutually exclusive.

  • Page 33: Scsi-2 Cable Connector (J19)

    MR-6407-AI 2.2.2.15 SCSI–2 Cable Connector (J19) The AXPpci 33 supports one SCSI–2 bus using the NCR 53C810 SCSI controller chip. The internal SCSI is a 50-position (2 x 25) male-shrouded keyed connector. CAUTION: SCSI terminator power (TERM POWER) is always supplied.

  • Page 34: Serial Ports Com1 (J35) And Com2 (J37)

    Physical Description Table 2–15 (Cont.) SCSI–2 Connector Pin-Out (J19) Number Function Number Function Ground DB 7 L Ground PB L Ground Ground Ground Ground No connection No connection No connection TERM POWER No connection No connection Ground Ground Ground ATN L Ground Ground Ground...

  • Page 35: Simm Interconnect (J2-J5)

    2.2.2.17 SIMM Interconnect (J2–J5) The AXPpci 33 MLB supports up to 256 MB of DRAM memory. On power up, the CPU automatically determines memory size. The memory SIMM devices are socketed to allow easy installation by the system integrator or end user.

  • Page 36: Speaker Connector (J10)

    Physical Description Table 2–17 (Cont.) SIMM Connector Pin-Outs (J2–J5) Number Function Number Function Data Data Data Data Data +5 V Data Data Data Data Data Data Data Data Data Data +5 V No connection No connection No connection No connection No connection Data No connection...

  • Page 37: Device Sockets

    2.2.3.2 Cache Sockets (XE100–XE110) The AXPpci 33 MLB can operate without cache or with an optional 256 KB or 1 MB of cache using either 11 32K x 8 or 11 128K x 8 SRAM devices. On power up, the CPU automatically determines the cache size.

  • Page 38: Mlb Jumpers

    Physical Description Figure 2–9 Cache Socket MR-6398-AI 2.2.4 MLB Jumpers The MLB has numerous sets of jumpers, which are described in Sections 2.2.4.1–2.2.4.6. The jumpers are installed onto unshrouded headers that consist of 0.025 inch square posts on 0.1 inch centers. When jumper plugs are not used for shorting two pins, they may be stored by pushing them onto a single post.

  • Page 39: Halt/Reset Select Jumper (J8)

    Physical Description Table 2–20 shows the select frequencies supported for each processor. Table 2–20 CPU Clock Frequency Select Jumper (J7) Alpha Pin 1–2 Pin 3–4 Pin 5–6 Frequency Processor Jumper Jumper Jumper 66 MHz DECchip 21068 100 MHz DECchip 21068A 166 MHz DECchip 21066 233 MHz...

  • Page 40: Ide Dma Request And Grant Jumpers (J15 And J16)

    Physical Description 2.2.4.4 IDE DMA Request and Grant Jumpers (J15 and J16) The IDE DMA Request jumper (J15) and IDE DMA Grant jumper (J16) are 3-position (1 x 3) headers. These jumpers must be set to the same DMA request/grant level; otherwise operation is unpredictable. Notes:  The Digital UNIX operating system does not currently support the IDE interface.

  • Page 41: Scsi Terminator Jumper (J13)

    Physical Description Figure 2–10 shows a jumper positioned to select bit 0, the factory setting. Figure 2–10 SROM Select Jumper Positions (J28 and J29) MR-6412-AI 2.2.4.6 SCSI Terminator Jumper (J13) J13 is a 2-position (1 x 2) header. When installed, the SCSI terminator jumper enables SCSI–2 termination.

  • Page 42: Single Inline Memory Modules

    Single Inline Memory Modules Each single inline memory module (SIMM) provides a 36-bit-wide data path. Like SIMMs must be installed in pairs. The AXPpci 33 uses industry-standard 70 ns SIMMs and supports 4, 8, 16, 32, and 64 SIMMs for a maximum of 256 MB of memory. The first SIMM pair may be installed in either of the two banks.

  • Page 43: Physical Mounting

    Physical Description 2.3.2 Physical Mounting SIMM modules are inserted into edge connectors on the MLB and held in place with metal locking clips. Refer to Appendix D for installation instructions. Table 2–27 lists SIMM options and associated dimensions available from Digital.

  • Page 44: Pci Option Modules

    Physical Description Table 2–28 Variable Lengths of ISA Options ISA Slot Number Maximum Length Notes 13.415 inches — 13.415 inches — 8.250 inches 11.400 inches 11.400 inches Notes: 1 Maximum length is limited by the +3.3 V regulator heatsink. 2 Maximum length is limited by the DECchip 21066 processor heatsink. PCI Option Modules Figure 2–14 shows a typical PCI option module and is for reference only.
  • Page 45 Physical Description Table 2–29 Variable Lengths of PCI Options PCI Slot Number Maximum Length Notes 7.000 inches 13.415 inches 13.415 inches Notes: 1 Maximum length is limited by the SIMM in J2. 2 The maximum length of 13.415 inches is accomplished by adding an extender. This allows a PCI module to be of equal length to an ISA module and to be supported by the card guides.

  • Page 47: Chapter 3 Environmental Data

    Environmental Data This chapter gives environmental data for: • Cooling requirements • DC power inputs • Electrostatic discharge (ESD) considerations • Telecommunication regulatory standards • Electromagnetic compatibility (EMC) considerations • Reliability data Cooling Requirements Maintaining proper component case or junction temperatures is important in maintaining system reliability.

  • Page 48: Decchip 21066 (166 Mhz) Cooling Requirements

    Tables 3–2 through 3–4 list the DECchip 21066 (166 MHz) cooling requirements using a low-profile heatsink, high-profile heatsink, and fan/heatsink, respectively. Table 3–2 DECchip 21066 (166 MHz) Cooling Using Low-Profile Heatsink Maximum Velocity AXPpci 33 Ambient T c Max CPU Power Theta jc Theta ja...
  • Page 49 Environmental Data Table 3–3 DECchip 21066 (166 MHz) Cooling Using High-Profile Heatsink Maximum Velocity AXPpci 33 Ambient T c Max CPU Power Theta jc Theta ja Theta ca Temperature Notes 85°C 0.70°C/W 3.50°C/W 2.80°C/W 26°C 85°C 0.70°C/W 2.55°C/W 1.85°C/W 46°C 1, 2 85°C...

  • Page 50: Decchip 21066A (233 Mhz) Cooling Requirements

    Tables 3–5 through 3–7 list the DECchip 21066A (233 MHz) cooling requirements using a low-profile heatsink, high-profile heatsink, and fan/heatsink, respectively. Table 3–5 DECchip 21066A (233 MHz) Cooling Using Low-Profile Heatsink Maximum Velocity AXPpci 33 Ambient T c Max CPU Power Theta jc Theta ja...

  • Page 51: Decchip 21068 (66 Mhz) Cooling Requirements

    Environmental Data Table 3–7 DECchip 21066A (233 MHz) Cooling Using Fan/Heatsink Maximum AXPpci 33 Ambient T c Max Voltage CPU Power Theta jc Theta ja Theta ca Temperature Notes 12 V 23 W 84°C 0.70°C/W 2.10°C/W 1.30°C/W 54°C 1, 2 Using part number 12–35739–34 for heatsink and specified fan.

  • Page 52: Decchip 21068A (100 Mhz) Cooling Requirements

    Environmental Data Table 3–9 DECchip 21068 (66 MHz) Cooling Using High-Profile Heatsink Maximum Velocity AXPpci 33 Ambient T c Max CPU Power Theta jc Theta ja Theta ca Temperature Notes 93°C 0.70°C/W 4.60°C/W 3.90°C/W 58°C 93°C 0.70°C/W 3.50°C/W 2.80°C/W 68°C 1, 2 93°C...
  • Page 53 Environmental Data Table 3–11 DECchip 21068A (100 MHz) Cooling Using Low-Profile Heatsink Maximum Velocity AXPpci 33 Ambient T c Max CPU Power Theta jc Theta ja Theta ca Temperature Notes 93°C 0.70°C/W 7.25°C/W 6.55°C/W 28°C 93°C 0.70°C/W 5.70°C/W 5.00°C/W 43°C 93°C...

  • Page 54: Custom Heatsink Design

    Environmental Data Table 3–13 DECchip 21068A (100 MHz) Cooling Using Fan/Heatsink Maximum AXPpci 33 Ambient T c Max Voltage CPU Power Theta jc Theta ja Theta ca Temperature Notes 12 V 10 W 93°C 0.70°C/W 2.10°C/W 1.30°C/W 80°C 1, 2 Using part number 12–35739–34 for heatsink and specified fan.

  • Page 55: Dc Power Inputs

    Environmental Data • If the custom heatsink footprint is larger than the DECchip 21066 PGA chip, the retaining clip may not fit. DC Power Inputs This section describes the DECchip 21066 power requirements, power sequencing, and signals. 3.2.1 System Power Requirements Tables 3–14 through 3–17 list the power requirements for the MLB DECchip 21066 processor.

  • Page 56: Power Sequencing

    On power up, the AXPpci 33 power supply asserts the POWER GOOD signal 100–500 ms after the dc power is within the operating range. On...

  • Page 57: Electrostatic Discharge Considerations

    Formal certification is the responsibility of the system integrator. Electromagnetic Compatibility Considerations The AXPpci 33 board was evaluated in typical production quality and commercially available enclosures. The board proved to be adequately designed to allow system integrators to pass electromagnetic compatibility (EMC) compliance testing.

  • Page 58: Reliability Data

    Reliability Data Table 3–20 lists the mean time between failure (MTBF) data for the AXPpci 33 system components. The MTBF data is calculated for 25°C and 40°C environments and assumes that airflow of at least 200 LFM is always available to cool the CPU. Items not listed, such as the power supply and PCI or ISA options, are explicitly excluded from these calculations.

  • Page 59: Main Logic Board

    Suppliers and Part Numbers This appendix contains part numbers for orderable: • Main logic boards (MLBs) • MLB bundled kit configurations • MLB options • Accessories Main Logic Board Configurations Table A–1 provides MLB and bundled kit configurations and part numbers. Table A–2 lists orderable MLB options and associated part numbers.

  • Page 60: Appendix A Suppliers And Part Numbers

    Suppliers and Part Numbers Table A–1 (Cont.) MLB and Bundled Kit Configurations Console Operating Keyboard Alpha Digital Firmware System Interface Processor Part Number Notes MLB and Processor Digital UNIX (SRM) 3 Digital UNIX PS/2 style DECchip EBP20–BX 2, 3, 4 licenses: 21066–166 —...
  • Page 61 Suppliers and Part Numbers Table A–1 (Cont.) MLB and Bundled Kit Configurations Console Operating Keyboard Alpha Digital Firmware System Interface Processor Part Number Notes MLB, Processor, Enclosure, and Peripherals Windows NT (ARC) Windows NT PS/2 style DECchip ETN42–CA 2, 3, 4 21066A–233 Digital UNIX (SRM) 3 Digital UNIX...
  • Page 62 Suppliers and Part Numbers Accessories and Suppliers Table A–3 lists accessory part numbers and associated suppliers. Table A–3 Accessories and Suppliers Quantity Suggested Part Description Per MLB Supplier Part Number Alpha Processor (Choose One) DECchip 21066–166 Digital 21066–AA DECchip 21066A–233 Digital 21066–CB DECchip 21068–66...
  • Page 63 Suppliers and Part Numbers Table A–3 (Cont.) Accessories and Suppliers Quantity Suggested Part Description Per MLB Supplier Part Number Memory SIMM 8 MB (2 x 4 MB) 70 ns 1–2 Digital EBPXM–AA SIMM 16 MB (2 x 8 MB) 70 ns 1–2 Digital EBPXM–AB...
  • Page 65 Connector Summary Table B–1 lists all connectors and jumpers used on the MLB. Table B–1 MLB Connectors and Jumpers Vendor Part Number Designation Description or Equivalent Fan power (connector) Molex 22–27–2031 J2–J5 SIMMs (connector) AMP 822021–4 LED display interface DUPONT 68602–416 (connector) CPU clock frequency AMP 531220–3...
  • Page 66 Connector Summary Table B–1 (Cont.) MLB Connectors and Jumpers Vendor Part Number Designation Description or Equivalent J35 and J37 Serial COM ports 1 and 2 DUPONT 65611–110 (connector) Parallel port interface AMP 1–103186–3 (connector) PS/2 keyboard port HON HAI PRECS MH11067–H1 (connector) AT keyboard port (connector) PREH ELEKTRO 71222–152...

  • Page 67: Appendix C Tested Options

    Tested Options Table C–1 lists tested options, associated option numbers, and the operating systems under which they were tested. Table C–1 Tested Options Option Digital Windows Description Number UNIX Mass Storage: Disk 3.5 inch LP 340 MB SCSI HD RZ24M PCXAR–AM 3.5 inch LP 535 MB SCSI HD RZ25L PCXAR–AH...
  • Page 68 Tested Options Table C–1 (Cont.) Tested Options Option Digital Windows Description Number UNIX Video Adapters PCI: #9 GXE64 PCI: ATI Mach 64 CX PB2GA–FA/FN PCI: Diamond Stealth 64 PCI: Digital PCXAG–AL PCXAG–AL PCI: MiroCrystal 10SD VGA PCI: MiroCrystal 32S VGA PCI: Orchid Fahrenheit 64 PCI: TGA 8 Plane PBXGA–AA...
  • Page 69 Tested Options Table C–1 (Cont.) Tested Options Option Digital Windows Description Number UNIX Keyboards Belgian PCXAL–GB Danish PCXAL–FD Finland/Sweden PCXAL–FF French PCXAL–FP German PCXAL–FG Italian PCXAL–FI North American PCXAL–FA Norwegian PCXAL–FN Portuguese PCXAL–FV Russian PCXAL–QT Spanish PCXAL–FS Switzerland/French PCXAL–FK United Kingdom PCXAL–FE U.S.

  • Page 71: Appendix D Installation And Handling Instructions

    Antistatic Precautions Due to electronic component sensitivity to static electricity, anyone handling the AXPpci 33 MLB or accessory components should wear a properly grounded antistatic wrist strap. Use of antistatic mats, an ESD approved workstation, and exercising other good ESD practices is recommended wherever possible (manufacturing or assembly areas).

  • Page 72: Heatsink Removal/Replacement

    Installation and Handling Instructions • Place the heatsink by lowering it onto the component (handle it by the edges). • Insert a nut into the nut driver or placement tool and place it on the stud until the nut separates from the tool. The nut material is 2011–T3 aluminum (this grade is critical).

  • Page 73: Heatsink/Fan Assembly Instructions

    Installation and Handling Instructions D.2.6 Heatsink/Fan Assembly Instructions Figure D–2 shows the DECchip 21066 integrated fan/heatsink assembly. Use of the thermal pad with the heatsink is recommended. Install the heatsink assembly onto the DECchip 21066 processor before you install the processor into the ZIF socket. This prevents ZIF damage due to torque forces placed on the ZIF by installation of the nuts.

  • Page 74: Simm Installation And Removal Instructions

    SIMM Installation and Removal Instructions Observe antistatic handling precautions. Five types of SIMMs are supported on the AXPpci 33. SIMMs must be installed in pairs consisting of identical devices. It is recommended that all SIMMs be purchased from the same vendor. See Table A–3 for supported SIMM sizes.

  • Page 75: Cache Installation Instructions

    Installation and Handling Instructions Figure D–3 SIMM Installation MR-6411-AI Cache Installation Instructions The AXPpci 33 cache is made up of 11 static random access memory (SRAM) devices. Observe antistatic handling precautions. Two sizes of cache SRAMs are supported on the AXPpci 33. If installed, SRAMs of the same size and speed must be installed in all 11 sockets.
  • Page 76 Installation and Handling Instructions To remove: a. A chip extraction tool is recommended. If you use a small flat- blade screwdriver to pry out the SRAM chips, take care not to damage the SRAM bodies, pins, or the sockets. b. Temporarily place SRAMs on antistatic material or store them on antistatic foam or in an antistatic bag.

  • Page 77: Appendix E Console Commands

    The ARC console supports use of the Windows NT operating system. This console uses a menu interface. Example E–1 shows a typical console menu displayed when an AXPpci 33 system with Windows NT is powered on. Example E–1 Typical Windows NT Console Menu ARC Multiboot Alpha AXP Version n.n...

  • Page 78: Menu Option: Supplementary Menu

    Example E–2 shows a sample Supplementary menu. Example E–2 Sample Supplementary Menu ARC Multiboot Alpha AXP Version n.n Copyright (c) 1993 Microsoft Corporation Copyright (c) 1993 Digital Equipment Corporation Supplementary menu: Install new firmware Install Windows NT from CD-ROM Set up the system...

  • Page 79: Menu Option: Display Hardware Configuration

    The SRM console supports the Digital UNIX operating system. These commands are part of the SRM console: • boot • • show • examine • deposit • isacfg The AXPpci 33 MLB currently supports the Windows NT and Digital UNIX operating systems. E–3...

  • Page 80: Conventions

    Console Commands E.3.1 Conventions Table E–1 lists the SRM console conventions. Table E–1 SRM Console Conventions Item Convention Console prompt >>> Continuation line prompt _> Maximum command length 255 characters. Multiple contiguous spaces or tabs Treated as a single space. Command abbreviations Allowed, if not ambiguous.

  • Page 81: Boot Command

    Console Commands E.3.3 boot Command The boot command performs these functions: • Initializes the processor • Loads a program image from the specified boot device • Transfers control to the loaded image E.3.3.1 Syntax Here is the syntax of the boot command (broken across multiple lines for display purposes): >>>...

  • Page 82: Examples

    Console Commands E.3.3.3 Examples Table E–4 shows boot command examples and their descriptions. Table E–4 boot Command Examples Command Description >>> boot Boots the system from the default boot device. >>> boot era0 Boots the system from Ethernet port era0. >>>...

  • Page 83: Show Command

    Console Commands Table E–6 set Command Examples Command Description >>> set bootdef_dev era0 The default boot device is set to era0. >>> set auto_action boot The console will attempt to boot following an error, halt, or power up. >>> set boot_osflags 0,1 The default boot flags are set to 0,1.

  • Page 84: Examples

    Console Commands E.3.5.3 Examples Table E–8 lists show command examples and their descriptions. Table E–8 show Command Examples Command Description >>> show device Lists device information, such as system designation, drive model, or Ethernet address. >>> show memory Lists system RAM, bank sizes, starting addresses, and versions of SROM and DROM used.

  • Page 85: Options

    Console Commands E.3.7.2 Options Table E–10 describes the examine command options. Table E–10 examine Command Options Command Option Description –b A byte of data. –w A word of data. –l A longword of data. –q A quadword of data. –o An octaword of data.

  • Page 86: Deposit Command

    Console Commands Table E–11 (Cont.) examine Command Examples Command Description >>> examine –n 5 r7 Examine R7 and the next 5 registers. gpr:00000007 (R7) 00000000 gpr:00000008 (R8) 00000000 gpr:00000009 (R9) 00000000 gpr:0000000A(R10) 00000000 gpr:0000000B(R11) 00000000 gpr:0000000C(R12) 00000000 >>> examine ipr:11 Examine internal processor register 11.

  • Page 87: Examples

    ISA devices are not capable of being probed for configuration information. Consequently, the ISA configuration utility is used to enter ISA option information manually. The isacfg command is used when a new ISA option module is installed on the AXPpci 33 system running the Digital UNIX operating system. E–11...

  • Page 88: Syntax

    Console Commands At first power-on, the configuration table is initialized to a default condition. This setup contains entries for the CPU devices MOUSE, KBD, COM1, COM2, LPT1, and FLOPPY. They are all slot 0 devices and are alloted their default architected resources. E.3.9.1 Syntax Here is the syntax of the isacfg command (broken across multiple lines...

  • Page 89: Examples

    Console Commands Table E–14 (Cont.) isacfg Command Options Command Option Description –irq{0–3} {#} Allows you to assign up to four IRQ channels to the device. –dmachan{0–3} {#} Allows you to specify up to four DMA channels for the device. –dmamode{0–3} {#} Allows you to specify the DMA type for –dmachan{0–3}.

  • Page 90: Add_De205 Command

    Console Commands E.3.9.4 add_de205 Command The add_de205 command is used to configure DE204 and DE205 Ethernet cards. This command assumes that the option has been pre-configured to use the resources assigned and makes no effort to perform any device configuration. It adds the first instance of a DE204 or DE205 Ethernet card to the configuration table.

  • Page 91: Appendix F Operating System Installation Notes

    ARC or SRM console, it may not be the correct version for your operating system. There is 512 KB of flash memory onboard the AXPpci 33 MLB. This memory can be loaded with either the ARC console (to run Microsoft Windows NT) or the SRM console (to run Digital UNIX or another SRM console-compliant operating system).

  • Page 92: How To Plan And Create Your Disk Partitions

    Intel x86 setup utility to configure parameters on an x86 compatible card. In some instances, you must do this before the card functions properly in the Digital AXPpci 33. Digital UNIX Installation Notes For information about installing the Digital UNIX operating system on the AXPpci 33 board, consult the Digital UNIX Installation Guide.
  • Page 93 • What sort of main memory should be used? Sections 2.2.2.17 and A.2 provide information about main memory. The AXPpci 33 accepts industry-standard 70 ns, 36-bit SIMMs. 32- or 33-bit SIMMs will not work. • What build devices are available for Windows NT? At this time, the only available build device for Windows NT is a SCSI CD–ROM drive.
  • Page 94 Frequently Asked Questions • What are the available ISA interrupts, DMA channels, and I/O address spaces? The following applies to ISA interrupts, DMA channels, and I/O address space: — 16 ISA interrupts: 0–15. PCI options are automatically assigned IRQs after ISA options are configured.
  • Page 95 Frequently Asked Questions Options with onboard configuration memory may need to be configured in a x86 system until device suppliers provide AXPpci 33 compliant configuration routines. • What happens during system startup? During system startup: The system loads an initial bootstrap from SROM, which transfers control to the flash ROM.
  • Page 96 Frequently Asked Questions Sections 2.2.2.17 and A.2 provide information about main memory. The AXPpci 33 accepts industry-standard 70 ns, 36-bit SIMMs. 32- or 33-bit SIMMs will not work. • What is the proper disk size? A 1 GB disk drive (minimum) is recommended for the Digital UNIX operating system.
  • Page 97 Frequently Asked Questions • Do I need to use a graphics adapter? No. If a graphics adapter and keyboard are not present, the SRM console will transfer I/O to the terminal. Attach a terminal to the COM1 port and use these settings: •...

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