Problem analysis, system parts, and locations (174 pages)
Summary of Contents for IBM Power System AC922 Series
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Read all precautions and instructions before you start working on the system and its parts. Use normal electrostatic discharge (ESD) procedures when working on the system and parts. IBM recommends wearing gloves and an ESD wrist strap to avoid possible damage to the equipment.
Rear ports Figure 6. Rear view of the system with ports displayed Table 1. Port descriptions Identifier Description Video Graphics Array (VGA) Intelligent Platform Management Interface (IPMI) serial Ethernet. Use the top Ethernet port for the BMC/IPMI interface (as PHY0) and direct OS usage. Use the bottom Ethernet port for only direct OS usage (as PHY1).
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Figure 7. Removing the power supplies from the system Figure 8. Removing the cover Figure 9. Disk drive lock detail Figure 10. Removing a fan from the system...
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Figure 11. Removing the disk and fan signal cable Figure 12. Removing the fan power cable from the system Figure 14. Screw locations for the disk drive and fan card Figure 13. Removing the front holder...
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Figure 15. Removing the disk drive and fan card Figure 16. Remove eight GPU screws per GPU; do not Figure 17. Replacing the GPU and heat sink into system loosen the four spring-loaded screws backplane...
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Figure 19. Location of the memory modules Figure 18. Removing a memory module Figure 20. Removing the time-of-day battery from the system backplane...
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Figure 21. Removing a PCIe adapter Figure 22. Removing the BMC card Figure 24. Removing the rack installation support Figure 23. Removing the USB cable and the power switch and cable from the system backplane and the disk drive and fan card...
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Figure 25. Remove the top and side screws Figure 26. Pull out the power switch and cable Figure 27. Removing USB cable and connector from the power switch...
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Figure 28. Remove the middle support side screws Figure 29. System backplane screw locations Figure 30. Lifting out the system backplane...
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Figure 31. Removing the heat sink Figure 32. Removing dust and debris from the system processor module area Figure 33. Lowering the removal tool onto the system Figure 34. Locking the system processor module into the processor module tool...
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Figure 36. Inspecting the thermal interface material Figure 35. Placing the tool at an angle on the top cover of the packaging If the thermal interface material is damaged, replace it. Figure 38. Installing the heat sink on the gray-colored TIM Figure 37.
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