LG G3100 Service Manual
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1. INTRODUCTION...................................5
1.1 Purpose ................................................
1.2 Regulatory Information ..........................
1.3 Abbreviations .........................................
2. PERFORMANCE ..................................9
2.1 H/W Features ..........................................
2.2 Technical Specification ..........................
3. TECHNICAL BRIEF ............................15
3.1 Transceiver ......................................
3.2 Power Amplifier Module .........................
3.3 13MHz Clock ...................................
3.6 Digital Main Processor ........................
3.7 Analog Main Processor ..........................
3.8 Power Management ..............................
3.9 Memories ...........................................
3.10 Display and Interface ........................... .
3.12 Microphone ........................................ .
3.13 Earpiece ............................................
3.17 Speaker & MIDI IC ..............................

Table Of Contents

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4. TROUBLE SHOOTING ................... 56
4.1 RF Components .................................
4.2 Rx Trouble ..........................................
4.3 Tx Trouble ..........................................
4.4 Power On Trouble ..............................
4.5 Charging Trouble ...............................
4.6 LCD Trouble .......................................
4.7 Receiver Trouble ................................
4.8 Speaker Trouble .................................
4.9 Mic. Trouble .......................................
4.10 Vibrator Trouble ...............................
4.12 SIM Detect Trouble ..........................
4.13 Earphone Trouble ............................
4.14 HFK Trouble ......................................
5.1 Disassembly .......................................
6. SOFTWARE DOWNLOAD ............. 108
6.1 Download Setup .................................
6.2 Download Procedure ............................
7. BLOCK DIAGRAM ........................... 114
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Table of Contents
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Summary of Contents for LG G3100

  • Page 1: Table Of Contents

    Table Of Contents 1. INTRODUCTION........…5 4. TROUBLE SHOOTING ....… 56 1.1 Purpose ..........…. 4.1 RF Components ......…. 1.2 Regulatory Information ......4.2 Rx Trouble .......... 1.3 Abbreviations ......... 4.3 Tx Trouble .......... 4.4 Power On Trouble ......…. 4.5 Charging Trouble ......…. 2.
  • Page 2 8. CIRCUIT DIAGRAM ......115 13. EXPLODED VIEW & REPLACEMENT PART LIST ...…. 137 8.1 Main Chipset and Memory ....….. 13.1 Exploded View ......…… 8.2 Audio Part …………………..………. 13.2 Accessory .......…….. 8.3 PMIC, LCD and I/O Connector …..…. 13.3 Replacement Parts 8.4 RF Part ………........…..
  • Page 3: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of G3100. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your...
  • Page 4 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.
  • Page 5: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Rate CC-CV Constant Current – Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing Electrostatic Discharge FPCB Flexible Printed Circuit Board...
  • Page 6 1. INTRODUCTION Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM...
  • Page 7: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Li-ion, 850 mAh Standard Battery Size: 42.08 × 66.65 × 9.3mm Weight: 29.32g Under the minimum current consumption environment Stand by Current (such as paging period 9), the level of standby current is below 4mA.
  • Page 8: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification Item Description Specification TX: 890 + n × 0.2 MHz RX: 935 + n × 0.2 MHz (n=1~124) EGSM Frequency Band TX: 890 + (n-1024) × 0.2 MHz RX: 935 + (n-1024) × 0.2 MHz (n=975~1024) TX: 1710 + (n-512) ×...
  • Page 9 2. PERFORMANCE Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000 Output RF Spectrum (due to modulation) Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000...
  • Page 10 2. PERFORMANCE Item Description Specification Offset from Carrier (kHz). Max. dBm Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Radiation GSM, EGSM BER (Class II) < 2.439% @-102 dBm Bit Error Rate BER (Class II) < 2.439% @-100 dBm RX Level Report Accuracy ±3 dB 8±3 dB...
  • Page 11 2. PERFORMANCE Item Description Specification Frequency (Hz) Max.(dB) Min.(dB) 1,000 Receiving Response 3,000 3,400 4,000 * Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to be Max. level in the range. STMR 13±5 dB Stability Margin >...
  • Page 12 2. PERFORMANCE Item Description Specification CC Charge : < 500 mA Charge Current Trickle Charge : < 60 mA Antenna Bar Number Power -85 dBm ~ -90 dBm ~ -86 dBm -95 dBm ~ -91 dBm Antenna Display -100 dBm ~ -96 dBm -105 dBm ~ -101 dBm ~ -105 dBm Battery Bar Number...
  • Page 13: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 Transceiver (CX74017, U401) The RF parts consists of a transmitter part,a receiver part,a synthesizer part,a voltage supply part,a VCTCXO part. And the main RF Chipset CX74017[U401]is a single-chip dual-band transceiver for the extended global system for mobile communication[E-GSM900MHz]/ Digital communication system[DCS1800MHz] voice and data transfer applications.
  • Page 14 3. TECHNICAL BRIEF A. RF Front End RF front end consists of Antenna Switch(FL401), dual band LNAs integrated in transceiver(U401). The Received RF signals (GSM 925MHz ∼ 960MHz, DCS 1805MHz ∼ 1880MHz) are fed into the antenna or mobile switch. An antenna matching circuit is between the antenna and the mobile switch. The Antenna Switch (FL401) is used to control the Rx and TX paths.
  • Page 15 3. TECHNICAL BRIEF C. DC offset compensation Three correction loops ensure that DC offsets, generated in the CX74017, do not overload the baseband chain at any point. After compensation, the correction voltages are held on capacitors for the duration of the receive slot(s).
  • Page 16 3. TECHNICAL BRIEF (2) Transmitter Part The Transmitter part contains CX74017 active parts, power amplifier module (PAM) and antenna switch. The CX74017 active part consists of a vector modulator and offset phase-locked loop block (OPLL) including down-converter, phase detector, loop filter and dual band transmit VCO which can operate at either final RF output frequency.
  • Page 17 3. TECHNICAL BRIEF B. OPLL The offset mixer down converts the feedback Tx RF signal using LO to generate a IF modulating signal. The IF signal goes via external passive bandpass filter to one port of the phase detector. The other side of the phase detector input is LO signal. The phase detector generates an error current proportional to the phase difference between the modulated signal from the offset mixer and the reference signal from the LO.
  • Page 18: Power Amplifier Module

    3. TECHNICAL BRIEF The counter and mode settings of the synthesizer are also programmed via 3-wire interface. CX74017 2V7_VTCXO 13MHz vco = (N+3.5+FN/2^22) ref/R 13MHz Fractional-N REFCLK Base Band Block Figure 3-3. Synthesizer Block diagram. 3.2 Power Amplifier Module The RF3110[U402] is a dual band amplifier module for E-GSM(880 to 915MHz) and DCS1800(1710 to 1785MHz).
  • Page 19: 13Mhz Clock

    3. TECHNICAL BRIEF 3.3 13 MHz Clock A VCTCXO (Voltage Controlled Temperature Compensated Crystal Oscillator, X401) is used as a clock and oscillates at a frequency of 13MHz. The output of the clock is fed to the CX74017 RF Main Chip, analog baseband chipset (AD6521, U102), and digital baseband chipset (AD6522, U101) Figure 3-4.
  • Page 20: Testing Set-Up And Checking Signals

    3. TECHNICAL BRIEF 3.5 Testing Set-up and Checking Signals A. Received RF Power Level and Checks This section shows the typical RF power levels expected throughout the receiver path. A block diagram shows the locations of the RF measurement points and levels as shown in Fig. 3-11. Receiver Testing Set-up To check the receiver the test equipment should be set as the following conditions: On a signal generator or a GSM/DCS test box, output amplitude of CW sugnal = -60 dBm at either:...
  • Page 21 3. TECHNICAL BRIEF Testing Transmitter Measure the RF power level of the points which are shown in Fig 3-9. If there are any major difference between your measurement results and the values shown in the figure then further investigation of that particular point will be required.
  • Page 22 3. TECHNICAL BRIEF RF components (Component Side) CN401 FL401 Mobile S/W Ant. S/W FL402 Dual Saw Filter U401 U402 RF Main Power Amp Chipset Module U404 U403 Inverter IC X401 VCTCXO Figure 3-6. RF components (Component Side). Reference Description Reference Description U401 RF Main Chipset...
  • Page 23 3. TECHNICAL BRIEF Test point of Rx Power Levels ② ① ③ ④ Figure 3-7. Test point of Rx Power Levels. (Refer to Figure 3-9) - 25 -...
  • Page 24 3. TECHNICAL BRIEF Test point of Rx Power Levels ⑥ ⑤ ⑨ ⑦ ⑩ ⑧ Figure 3-8. Test point of Rx Power Levels. (Refer to Figure 3-9) - 26 -...
  • Page 25 3. TECHNICAL BRIEF Figure 3-9. Transmitter & Receiver RF Levels - 27 -...
  • Page 26 3. TECHNICAL BRIEF Control signal test points (1) TX_RAMP RF2.85V TX_PA 13MHz Clock VCTCXO2.7V RXIQ TXIQ PLL_LE Figure 3-10. Control signal test points (1). (Refer to Figure 3-12~21) - 28 -...
  • Page 27 3. TECHNICAL BRIEF Control signal test points (2) PLL_CLK PLL_DATA TX_EN RX_EN Figure 3-11. Control signal test points (2). (Refer to Figure 3-18) - 29 -...
  • Page 28 3. TECHNICAL BRIEF 2.85V 2.85V Figure 3-12. Regulator Output (RF2V85) Figure 3-13. VCTCXO Power Supply (2V7_VTCXO). - 30 -...
  • Page 29 3. TECHNICAL BRIEF Figure 3-14. 13MHz Clock. VC1=0V VC2=0V Figure 3-15. Control Signal (VC1,VC2) in Rx mode (GSM, DCS both). - 31 -...
  • Page 30 3. TECHNICAL BRIEF Figure 3-16. Control Signal (VC1,VC2) in DCS TX mode. Figure 3-17. Control Signal (VC1,VC2) in GSM TX mode. - 32 -...
  • Page 31 3. TECHNICAL BRIEF PLL_LE PLL_CLK PLL_DATA Figure 3-18. PLL_LE, PLL_CLK, PLL_DATA. TX_EN TX_RAMP TX_PA Figure 3-19. TX_EN, TX_RAMP, TX_PA. - 33 -...
  • Page 32 3. TECHNICAL BRIEF Figure 3-20. TX IQ Signal. Figure 3-21. RX IQ Signal. - 34 -...
  • Page 33: Digital Main Processor

    3. TECHNICAL BRIEF 3.6 Digital Main Processor The AD6522 is an digital processor made by ADI. AD6522 AD6521 Subsystem (VBC) DSP BUS EBUS PBUS DMA and BUS ARBITRATION SBUS Peripheral SRAM FLASH Subsystem Subsystem (ARM7TDMI) RF-Control Figure 3-22. Top level block diagram of the AD6522 internal architecture. BUS Arbitration Subsystem •...
  • Page 34 3. TECHNICAL BRIEF MCU subsystem • It consists of an ARM7TDMI central processing unit, a boot ROM, a clock generation and access control module. • The maximum clock frequency for the ARM7TDMI is 39MHz at 2.45V. • The main clock is 13MHz and it is provided by VCTCXO. The Clock & BS(Bus Select) generator make internal clock by multiplying the main clock by 1X, 1.5X, 2X and 3X.
  • Page 35 3. TECHNICAL BRIEF AD6522 GSM-PROCESSOR KEYPAD KEYPADCOL[4:0] JTAGEN Matrix JTAG KEYPADROW[4:0] TCK.TMS TDI.TDO BACKLIGHT0 JTAGE.HSL.GPIO Backlight Universal Service light BACKLIGHT1 USCTX/RX/CLK System Generic Serial port A Connector Generic Serial port B (USC) ROMCS Generic Serial port D FLASH ADD[23:0] 16bit DATA[15:0] PWRON Power...
  • Page 36 3. TECHNICAL BRIEF Interconnection with external devices RTC block interface Countered by external X-TAL The X-TAL oscillates 32.768KHz. LCD module interface Mainly controlled by _LCD_MAIN_CS, LCD_RES, LCD_RS, _WR, DATA [00...15] signals. Table 3-3. Description _LCD_MAIN_CS LCD driver chip enable. LCD driver IC has own CS pin LCD_RES This pin resets LCD module.
  • Page 37 3. TECHNICAL BRIEF SIM interface The AD6522 check status periodically in call mode if SIM card is inserted or not, but the AD6522 don't check in deep sleep mode. Interface by SIMDATAOP, SIMCLK, SIM_RST(GPIO_23) Table 3-5. Description This pin receives and sends data to SIM card. This model supports only SIMDATAOP 3.0 volt interface SIM card.
  • Page 38: Analog Main Processor

    3. TECHNICAL BRIEF 3.7 Analog Main Processor AD6521 AD6521 MCLK Dual-Mode Voiceband Baseband Codec JTAG Interface MCLKEN RESET for ICO ITXP I TRANSMIT INTERP FILTER ITXN BSDI QTXP Q TRANSMIT FILTER QTXN BSIFS GMSK MOD BSAEBAND 32 x 10 bit TXON 10 bit SERIAL...
  • Page 39 3. TECHNICAL BRIEF BB Transmit section This section generates in-phase and quadrature BB modulated GMSK signals (BT = 0.3) in accordance with GSM 05.05 Phase 2 specifications. • The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a matched pair of reconstruction filter.
  • Page 40 3. TECHNICAL BRIEF Figure 3-26-1. Voice band circuit diagram (Headset & Hands free kit part 1). - 42 -...
  • Page 41 3. TECHNICAL BRIEF Figure 3-26-2. Voice band circuit diagram (Handset & Hands free kit part 2)). Figure 3-26-3. Voice band circuit diagram (Receiver part). Figure 3-26-4. Voice band circuit diagram(MIC part). - 43 -...
  • Page 42 3. TECHNICAL BRIEF Figure 3-27. AD6521 circuit diagram. - 44 -...
  • Page 43: Power Management

    3. TECHNICAL BRIEF 3.8 Power Management ADP3408 Figure 3-28. ADP3408 (U301) inner block diagram. Table 3-6. Description VSIM 2.86 V (is provided to SIM card) VCORE 2.45 V (is provided to the AD6522 & AD6521’s digital core) VRTC 2.45 V (is provided to the RTC and Backup Battery) 2.45 V (is provided to the AD6521 I/O and used as microphone bias) VTCXO 2.715 V (is provided to VCTCXO)
  • Page 44 3. TECHNICAL BRIEF Power on sequence The ADP3408(U301) controls power on sequence. If a battery is inserted, the battery powers the 6 LDOs. Then if PWRONKEY is detected, the LDOs output turn on. REFOUT is also enabled, Reset signal is generated and send to the AD6522. LDO block There are 6 LDOs in the ADP3408.
  • Page 45: Memories

    3. TECHNICAL BRIEF 3.9 Memories TH50VPF5683CDSB(U103) is a mixed multi-chip package containing a 32Mbit pseudo static RAM and a 64Mbit flash memory. • 64Mbit flash memory + 32Mbit PSRAM • 16 bit parallel data bus • ADD01 ~ ADD22. • 1 Chip enable input for Flash memory select. •...
  • Page 46: Keypad Switches And Scanning

    3. TECHNICAL BRIEF 3.11 Keypad Switches and Scanning The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 19 switches (KB101~KB119), connected in a matrix of 5 rows by 5 columns, as shown in Figure 3-29, except for the power switch (KB101), which is connected independently.
  • Page 47: Microphone

    3. TECHNICAL BRIEF 3.12 Microphone The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to VINNORP (#J10) and VINNORN (#K10) pins of AD6521. The voltage of 2V45_VAN is output from ADP3408, and is a bias voltage for both the VINNORP (through R101) and VINAUX (through R112) lines.
  • Page 48: Earpiece

    3. TECHNICAL BRIEF 3.13 Earpiece The earpiece is driven directly from AD6521 VOUTNORP (#K8) and VOUTNORN (#K7) pins and the gain is controlled by the PGA in an AD6521. The earpiece is placed in the front cover and contacted to main PCB. Figure 3-31.
  • Page 49 3. TECHNICAL BRIEF B. Audio Input Two input audio signals through the hands free kit and one input audio signal through the headset mic are fed to another analog switch (MAX4695EGC(U205)). The analog switch determines using HFK_EAR signal which signal is fed to analog baseband chipset AD6521(U102). Figure 3-33.
  • Page 50: Key Back-Light Illumination

    3. TECHNICAL BRIEF 3.15 Key Back-light Illumination In key back-light illumination, there are 6 yellow-green LEDs in Main Board, which are driven by KEY_BACKLIGHT line from AD6522. The LEDs are also used for precharge indication. Figure 3-34. Key back-light and precharge indication illumination. - 52 -...
  • Page 51: Lcd Back-Light Illumination

    3. TECHNICAL BRIEF 3.16 LCD Back-light Illumination For LCD Back-light illumination, there is a driver in FPCB of LCD module, which is driven by LCD_BACKLIGHT_CTL (GPO_22) through LCD connector (CN402) from AD6522. Figure 3-35. LCD back-light illumination. - 53 -...
  • Page 52: Speaker & Midi Ic

    3. TECHNICAL BRIEF 3.17 Speaker & MIDI IC The phones of this model use the loud speaker and Melody IC which makes the robust joyful melody sounds(40 ploy). • Melody IC control 5 GPIO is assigned to control melody IC. Melody data is transferred to melody IC and played by loud speaker.
  • Page 53 3. TECHNICAL BRIEF Basically, this phone have a melody IC of Yamaha Ltd.MA-2(nickname from Yamaha) is a synthesizer LSI for mobile phones that realize advanced game sounds. This LSI has a built-in speaker amplifier, and thus, is an ideal device for outputting sounds that are used by mobile phones in addition to game sounds and ringing melodies that are replayed by a synthesizer.
  • Page 54: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Components CN401 FL401 Mobile S/W Ant. S/W FL402 Dual Saw Filter U401 U402 RF Main Power Amp Chipset Module U404 U403 Inverter IC X401 VCTCXO RF Components Reference Description Reference Description U401 RF Main Chipset FL402 Dual SAW Filter...
  • Page 55: Rx Trouble

    4. TROUBLE SHOOTING 4.2 RX Trouble START ④ HP8922 : Test mode (PCS band) ⑤ 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting ① ① Check Regulator Circuit ② ② Check ⑥ ③...
  • Page 56 4. TROUBLE SHOOTING 4.2.1 Checking Regulator Circuit U404.1 U404.6 Check Pin 6 Pin 6 High? Change the board Check Pin 1. RF 2.85V OK? Regulator Circuit is OK Replace U404 See next page to check VCTCXO - 58 -...
  • Page 57 4. TROUBLE SHOOTING 4.2.2 Checking VCTCXO Circuit X401.4 X401.3 VCTCXO Circuit is OK Check Pin 3 See next page to check 13MHz OK? Refer to Graph 4-1 ANT SW & Mobile SW Check Pin 4 Change X401 2.7V OK? Refer to Graph 4-2 Check U301,PMIC Graph 4-1.
  • Page 58 4. TROUBLE SHOOTING 4.2.3 Checking PLL Control Signal Data Clock Graph 4-3. RF Control Signal TP404(PLL_CLK) TP406(PLL_DATA) TP402(PLL_LE) Download the S/W Level is High? Check TP 403 Check TP406, 404 402. Check if there is Any major Differencr Download the S/W Similar? Refer to Graph 4-3 major difference...
  • Page 59 4. TROUBLE SHOOTING 4.2.4 Checking Ant SW & Mobile SW C448 CN401.2 FL401 CN401.1 C445 L410 L409 For these 2 test case, No Call connection is needed Check CN401 Pin 1,2 Changing CN401 Open with RF Cable connected. Check CN401 Pin 1,2 Changing CN401 Short with No RF Cable Connected...
  • Page 60 4. TROUBLE SHOOTING Graph 4-4. ANT SW Control GSM, DCS RX Mode High Graph 4-5. ANT SW Control for DCS TX Mode ANT SW EGSM TX High DCS TX EGSM, DCS RX Table 4-1. ANT SW Control Logic Graph 4-6. ANT SW Control for GSM TX Mode - 62 -...
  • Page 61 4. TROUBLE SHOOTING 4.2.5 Checking SAW Filter Circuit FL402.1 FL402.3 FL402.5 FL402.7 Check RF Level of Saw Filter Input Changing Pin1: ~ -61dBm For GSM : FL402.1 L409 for GSM Pin3: ~ -61dBm For DCS : FL402.3 L410 for DCS Check the parts are well Soldered Check RF Level of...
  • Page 62 4. TROUBLE SHOOTING 4.2.6 Checking RX IQ RXQN RXIN RXQP RXIP Graph 4-7. RX IQ Signal Graph 4-8. RX I Signal (Extended) Check C401, 405. Check if there is Similar? Replace U401 Any Major Difference ♦Refer to Graph 4-4 Check C401 or C405. Check if there is Replace U401 Similar?
  • Page 63: Tx Trouble

    4. TROUBLE SHOOTING 4.3 TX Trouble START ⑥ HP8922 : Test mode (PCS band) 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH) Spectrum analyzer setting ⑤ Oscilloscope setting ① ① Check Regulator Circuit ② ④ ② Check ③...
  • Page 64 4. TROUBLE SHOOTING 4-3-1 Checking Regulator Circuit • If you already check this point while checking RX part, you can skip this test. U404.1 U404.6 Check Pin 6. Changing the Board Check Pin 1. RF 2.85V O.K? Pin 6. High ? Regulator Circuit is OK Replace U404 See next Page to check...
  • Page 65 4. TROUBLE SHOOTING 4-3-2 Checking VCTCXO Circuit • If you already check this point while checking RX part, you can skip this test. X401.4 X401.3 VCTCXO Circuit is OK Check Pin 3. 13 MHz O.K? See next Page to check ♦Refer to Graph 4-9 ANT SW &...
  • Page 66 4. TROUBLE SHOOTING 4-3-3 Checking Control Signal TX_EN PLL_LE TX_RAMP PLL_DATA PLL_CLK TX_PA Graph 4-11. RF Control Signal Graph 4-12. RF Control Signal (TX_EN, TX_RAMP, TX_PA) TP404(PLL_CLK) TP406(PLL_DATA) TP402(TX_EN) TP402(PLL_LE) - 68 -...
  • Page 67 4. TROUBLE SHOOTING TX_RAMP (R0401) TX_PA (R404) Check TP402,404,406 . Check if there is Download the S/W Similar? Any Major Difference ♦Refer to Graph 4-11 Check TP 405, R401, R404. Check if there is Download the S/W Similar? Any Major Difference ♦Refer to Graph 4-12 Control Signal is OK See next Page to check...
  • Page 68 4. TROUBLE SHOOTING 4-3-4 Checking TX IQ TXQN, TXQP TXIN,TXIP Graph 4-13. TX IQ Signal Check C449, 453. Check if there is Similar? Download the S/W Any Major Difference ♦Refer to Graph 4-10 TX IQ Signal is OK See next Page to check RF TX Level - 70 -...
  • Page 69 4. TROUBLE SHOOTING 4-3-5 Checking RF TX Level L401 L402 R406 R401 L405 R403 U402 R404 C427 R405 R414 U401 Check L401(For GSM), L402(For DCS) GSM: ~10dBm Changing U401 To Check TXVCO DCS : ~8dBm Output Soldering check Check R406(For GSM), R406, R408, R409, R414(For DCS) GSM: ~8dBm...
  • Page 70 4. TROUBLE SHOOTING 4-3-6 Checking Ant SW & Mobile SW C425 C448 CN401.2 FL401 CN401.1 C445 Check C448, C445 Check whether Ant SW Check VC1, VC2 Changing board Set as TX mode ♦Refer to Graph 4-10,11 ♦Refer to Table 4-1 Check C448, C445 Is Set for TX Mode...
  • Page 71 4. TROUBLE SHOOTING High High Graph 4-14. ANT SW Control Graph 4-15. ANT SW Control DCS TX Mode GSM TX Mode Graph 4-16. ANT SW Control GSM, DCS RX Mode - 73 -...
  • Page 72 4. TROUBLE SHOOTING 4-3-7 Receiver and Transmitter RF Level - 74 -...
  • Page 73 4. TROUBLE SHOOTING 4-3-8 Receiver RF Level ① ② ③ ④ Figure 4-1. Test Points of Rx Level. - 75 -...
  • Page 74 4. TROUBLE SHOOTING 4-3-9 Transmitter RF Level ⑥ ⑤ ⑨ ⑦ ⑩ ⑧ Figure 4-2. Test Points of Tx Level. - 76 -...
  • Page 75: Power On Trouble

    4. TROUBLE SHOOTING 4.4 Power On Trouble SETTING : Connect PIF, and set remote switch off at PIF. START Check Battery Voltage Charge or Change Battery > 3.35V ? Push power-on key Check the contact of power-key and check the level change or dome switch.
  • Page 76 4. TROUBLE SHOOTING Test) U301 (ADP3408) Check!! POWER-ON KEY signal input These powers should be necessary to power on. This signal should go HIGH when the power-on procedure is completed. Pin 22 (2V8_VMEM) Pin 25 (2V7_VTCXO) Pin 21 (2V45_VCORE) U301 Pin 6 (2V45_VRTC) Pin 2 (POWERKEY) Pin 1 (RPWRON)
  • Page 77: Charging Trouble

    4. TROUBLE SHOOTING 4.5 Charging Trouble SETTING : Connect the battery and the charging adaptor(TA) to the phone. START Charging Connector Resolder CN302. (CN302) well-soldered? The charging adaptor(TA) is out of order. Voltage at Pin 10 of U301 Change the charging adaptor. = 5.2V? R347, Q301, D302 well- Resolder R347, Q301, D302 .
  • Page 78 4. TROUBLE SHOOTING Test) Q301 & D302 Check!! The charging current will flow into this direction. PWRONKEY SIMEN CHRIN ISENSE GATEDR BATSNS RESCAP D302 Q301 R347 - 80 -...
  • Page 79: Lcd Trouble

    4. TROUBLE SHOOTING 4.6 LCD Trouble START PIF Power On Is the connection of LCD module with Reassemble LCD module LCD connector on with LCD connector PCB OK? Check the soldering Resolder CN301 of CN301 Does LCD work properly? Replace LCD module LCD working! Test ) CN301 Check!! CN301...
  • Page 80: Receiver Trouble

    4. TROUBLE SHOOTING 4.7 Receiver Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode START Check the signal level of Replace the Main board. ABB is “VOUTNORP” at C206. Is it a few out of order. hundred mVAC? Check the signal level at C207.
  • Page 81 4. TROUBLE SHOOTING • The Receiver part Circuit Diagram C207 C206 C203 - 83 -...
  • Page 82: Speaker Trouble

    4. TROUBLE SHOOTING 4.8 Speaker Trouble SETTING : Connect PIF to the phone, and Power on. Enter The engineering mode, and set “Melody on” at Buzzer of BB test menu. START The power to the analog part of Melody IC Replace U202 Voltage across C222 ( Melody IC LDO)
  • Page 83 4. TROUBLE SHOOTING • Test) Speaker Check!! U202 C207 CN201 The Power for analog part of the melody IC Circuit diagram The Power for analog part of the melody IC The voltage is 3.3V - 85 -...
  • Page 84 4. TROUBLE SHOOTING The Melody IC & Speaker part Circuit Diagram These 4 components make up the analog amplified stage of melody. The Power for digital part of The melody IC. The voltage is 2.8V - 86 -...
  • Page 85: Mic. Trouble

    4. TROUBLE SHOOTING 4.9 Mic. Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode. START MIC Bias voltage Check if the Voltage at pin 24 of Replace the C204 voltage is almost U301 is 2.45V(DC)? U301. 2.2V(DC) Replace the R202 &...
  • Page 86 4. TROUBLE SHOOTING C204 R202 The signal flow of the microphone to R204 U103. R206, R208, C208, C211 MIC activating signal : Mic is activated when this signal The voltage at pin. 3 of Q203 goes to almost 0V goes to high. when the mic is activated.
  • Page 87 4. TROUBLE SHOOTING R202 Q203 R204 C204 C208 R206 R208 C201 MIC201 - 89 -...
  • Page 88: Vibrator Trouble

    4. TROUBLE SHOOTING 4.10 Vibrator Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, Connect PIF to the phone, and Power on. Enter The engineering mode, and set 'Vibrator on' at Vibration of BB test menu. START Check the voltage through Q201 Is the voltage at pin 3 Check the soldering...
  • Page 89 4. TROUBLE SHOOTING CN203 D201 Q201 When the vibrator works, the signal at this point goes to 2.8V When the vibrator works, the current flow this direction. When the vibrator works, the signal at this point goes to 0V - 91 -...
  • Page 90: Key Backlight Led Trouble

    4. TROUBLE SHOOTING 4.11 Key Backlight LED Trouble SETTING : Connect PIF to the phone, and power on. Enter engineering mode, and set “Backlight on” in “at” “BB test-Backlight” menu START PIF Power On Is the voltage Check the soldering of level at Pin1 at O202 about R234,R236...
  • Page 91 4. TROUBLE SHOOTING • Test) LD201~LD206 & Q201 Check!! R234 LD201 LD202 R236 Q202 LD204 LD203 LD206 LD205 A) Check the diode LD201~LD206. B) Check the current through Q202. - 93 -...
  • Page 92: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.12 SIM Detect Trouble SETTING : Insert the SIM into J301. Connect PIF to the phone, and power on. START Change the SIM. Our phone supports 3V SIM only. Does the SIM supports Voltage at pin 1 of Voltage at pin 19 of Replace U301.
  • Page 93 4. TROUBLE SHOOTING • Test) SIM Connector Check!! J301 - 95 -...
  • Page 94: Earphone Trouble

    4. TROUBLE SHOOTING 4.13 Earphone Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode. START Inset the earphone to the phone Earphone detect problem Does the audio profile of the ① phone change to the earphone mode? Audio path problem Set the audio part of the test equipment to echo mode.
  • Page 95 4. TROUBLE SHOOTING ① Earphone detect problem Check if between pin 3 and pin 4 of Voltage at R241 = 0V ? Change the J201. J201 is open ? If open, go to the next step ④ Earphone receiving path ②...
  • Page 96 4. TROUBLE SHOOTING Earphone sending path problem ③ Is the Is the Voltage at pin9 of signal level at pin9, pin11 both signal level at pin9, U205 1.5~1.9V? pin11 of U205 about of U205 about 1.5 to 1.9V? 1.5 to 1.9V? Is the Resolder or replace U205.
  • Page 97 4. TROUBLE SHOOTING J201 L201 R240 R241 C234 U205 U203 U204 - 99 -...
  • Page 98 4. TROUBLE SHOOTING This part makes the mic bias of the ear-mic. The reference voltage for the hook-detect of ear-mic. The direction of the audio Signal from the ear-mic. U203 U204 Ear-mic detection part - 100 -...
  • Page 99: Hfk Trouble

    4. TROUBLE SHOOTING 4.14 HFK Trouble SETTING : After initializing GSM test equipment, Connect PIF to the phone, and power on. START Connect HFK to the phone. HFK detect problem. Does the audio profile of the phone Resolder R337 & CN302. Voltage at R337 is 0V ? change to the car-kit mode?
  • Page 100 4. TROUBLE SHOOTING ② HFK sending path problem. Is the signal level at pin 11 of CN302 a few Resolder CN302. tens or hundreds mV(AC)? Is the signal level at pin1, pin2 of U205 Replace the U205. a few tens or hundreds mV(AC)? Does it work well? Redownload software.
  • Page 101 4. TROUBLE SHOOTING CN302 U203 U204 - 103 -...
  • Page 102 4. TROUBLE SHOOTING U205 - 104 -...
  • Page 103: Disassembly Instruction

    5. DISASSEMBLY INSTRUCTION 5. DISASSEMBLY INSTRUCTION 5.1 Disassembly 1. Remove the Battery and Screws as shown below. Figure 5-1. Removing the Battery. 2. Lift up and remove the Rear cover. Figure 5-2. Removing the Rear cover. - 105 -...
  • Page 104 5. DISASSEMBLY INSTRUCTION 3. Detach the rest components as shown below. Figure 5-3. Detaching the rest components. - 106 -...
  • Page 105 5. DISASSEMBLY INSTRUCTION 4. First, lift up PCB and remove the Antenna holding the hooks of the both end sides. After that, detach the Receiver and Keypad. Figure 5-4. Removing PCB, Antenna, Receiver and Keypad. 5. Use a tweezers to remove the Battery locker and Spring. Figure 5-5.
  • Page 106: Software Download

    6. SOFTWARE DOWNLOAD 6. SOFTWARE DOWNLOAD 6.1 Download Setup Figure 6-1 describes Download setup UART Figure 6-1. Download Setup Condition Disconnect TA to the Datakit and phone have a battery → Check the battery up to two blocks more. - 108 -...
  • Page 107: Download Procedure

    6. SOFTWARE DOWNLOAD 6.2 Download Procedure 1. Access Flash loader program in PC and select Erase. 1. Select Erase 2. Check the Model. (G3100) 2. Check ‘G3100’ - 109 -...
  • Page 108 6. SOFTWARE DOWNLOAD 3. Press Start and Wait until Erase is completed. 1. Press ‘Start’ 2. Confirm completion - 110 -...
  • Page 109 6. SOFTWARE DOWNLOAD 4. Select Write and Select Key to Choose software (Mot. File). … … 1. Select ‘Write’ 2. Select this 5. Press Open after choosing software 3. Choose software file 4. Press ‘Open’ - 111 -...
  • Page 110 6. SOFTWARE DOWNLOAD 6. Wait until converting from MOT to BIF is completed. 1. Wait until completion of converting 7. Press Start and Power on the phone using JIG remote Power on. (switch 1) 2. Press ‘Start’ 3. Turn off and turn on the remote switch Remote - 112 -...
  • Page 111 6. SOFTWARE DOWNLOAD 8. Wait until Sending Block is complete. First, you can see this message Second, you can see this message - 113 -...
  • Page 112: Block Diagram

    7. BLOCK DIAGRAM 7. BLOCK DIAGRAM - 114 -...
  • Page 113: Circuit Diagram

    VBAT Sheets SP105 SP106 SP107 SP108 SP109 MODEL G3100 07/26 SP110 Designer 2003 J_VBAT J_GND KEYCOL0 Checked DRAWING KEYCOL1 NAME KEYCOL2 Approved KEYCOL3 KEYCOL4 DRAWING Iss. Notice No. Date Name LG Electronics Inc. SPFY0060901_1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 115-...
  • Page 114: Audio Part

    J201 G3100 07/28 (2012) Headset jack R240 Designer 2003 C234 HEADSET_SPK_P JACK_DETECT Checked HEADSET_MIC_P L201 DRAWING 100nH C235 C236 C237 R241 NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. SPFY0060901_1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 116 -...
  • Page 115: Pmic, Lcd And I/O Connector

    J_RPWON MODEL G3100 R348 07/28 200K D301 Designer DAN222 TP413 2003 VBAT ONNOFF RPWRON PWRON Checked DRAWING R349 200K NAME Approved TP411 TP412 DRAWING Iss. Notice No. Date Name LG Electronics Inc. SPFY0060901_1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 117 -...
  • Page 116: Rf Part

    VBAT 07/28 Designer 2003 U404 Checked VSYNTHEN DRAWING TEMPSENSE _ERR RF Circuit C457 R430 NAME C458 2.2u Approved ADP3330 2012 2012 C459 470p DRAWING Iss. Notice No. Date Name LG Electronics Inc. SPFY0060901_1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 118 -...
  • Page 117: Pcb Layout

    9. PCB LAYOUT 9.1 Rear Part - 119 -...
  • Page 118: Front Part

    9.2 Front Part - 120-...
  • Page 119: Engineering Mode

    10. ENGINEERING MODE 10. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.
  • Page 120 10. ENGINEERING MODE E. ADC (Analog to Digital Converter) [1-5] This displays the value of each ADC. • MVBAT ADC (Main Voltage Battery ADC) [1-5-1] • AUX ADC (Auxiliary ADC) [1-5-2] • TEMPER ADC (Temperature ADC) [1-5-3] F. BATTERY [1-6] •...
  • Page 121: Rf Test [Menu 2]

    10. ENGINEERING MODE 10.2 RF Test [MENU 2] Radio Frequency Test A. SAR Test [2-1] This menu is to test the Specific Absorption Rate. • SAR Test On [2-1-1] : Phone continuously process TX only. Call-setup equipment is not required. •...
  • Page 122: Trace Option [Menu 4]

    10. ENGINEERING MODE 10.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 10.5 Call Timer [MENU 5] A. All calls [5-1] This displays total conversation time. User cannot reset this value. B.
  • Page 123: Stand Alone Test

    11. STAN ALONE TEST 11. STAND ALONE TEST 11.1 What’s the Standalone Test? Set the Phone to Perform only Tx or Rx mode for monitoring performance of Tx part or Rx part pnly. 1. Normal Call 2. Standalone • During Rx Standalone •...
  • Page 124: Standalone Test Equipment Setup

    11. STAN ALONE TEST 11.2 Standalone Test Equipment Setup GSM Test Equipment Power Supply RS-232 Cable Phone - 126 -...
  • Page 125: H/W Test

    11. STAN ALONE TEST 11.3 HW Test : Software for Standalone Test Setup Rx Standalone Test setting Block Tx Standalone Test setting Block Connect, Test Start Signal Flow window - 127 -...
  • Page 126: Tx Stand Alone Test Setting

    11. STAN ALONE TEST 11.4 Tx Stand alone Test Setting 1. Setting the Test Equipment as ‘Test Mode-BCH’ Example) For HP8960 On the Control Window Operating Mode : Test Test Function : BCH For HP8922 Operating mode : Test Mode 2.
  • Page 127 11. STAN ALONE TEST Tx Stand alone Test Setting 3. Select ‘Tx’ 4. Select ARFCN For GSM : 62CH For DCS : 700CH 5. Select Tx Power Level For GSM : 5 For DCS : 0 7. Press ‘Start’ 6. Press ‘Connect’ - 129 -...
  • Page 128: Rx Stand Alone Test Setting

    11. STAN ALONE TEST 11.5 Rx Stand alone Test Setting 1. Setting the Test Equipment as ‘CW Mode’ Example) For HP8960 On the Control Window Operating Mode : Test Test Function : CW For HP8922 Operating mode : CW Generator 2.
  • Page 129 11. STAN ALONE TEST Rx Stand alone Test Setting 3. Select ‘Rx’ 4. Select Gain Control Index ’17’ for Both Band 5. Press ‘Connect’ 6. Press ‘Start’ - 131 -...
  • Page 130: Auto Calibration

    12. AUTO CALIBRATION 12. AUTO CALIBRATION 12.1 Overview AutoCal (Auto Calibration) is the PC side calibration tool that performs Rx and Tx calibration with Agilent 8960 or other equipment. AutoCal generates calibration data by communicating with phone and measuring equipment and writes it into calibration data block of flash memory in GSM phone. There are three steps for automatic gain control (AGC) for Rx, automatic power control (APC) for Tx, and ADC control for monitoring battery voltage.
  • Page 131: Equipment Setup

    12. AUTO CALIBRATION 12.3 Equipment Setup GSM Test Set(8960) GPIB Cable Mobile Switch Cable Power Supply GPIB Cable Battery Simulator Figure 12-1. Equipment Setup - 133 -...
  • Page 132: Agc For Rx

    12. AUTO CALIBRATION 12.4 AGC for RX Setting the AGC Gain to make same Rx Power fed into the Base Band Part Regardless of Antenna Input Level. Part X(Input Level)+G(Gain)=Y 12.5 APC for TX To make Tx Power Level transmitted properly following the information of Base Station Example) GSM 6 Level Mobile...
  • Page 133: How To Do Calibration

    12. AUTO CALIBRATION 12.7 How to do calibration A. Connect cable between phone and serial port of PC. B. Connect Agilent 8960 equipment, programmable power supply, and phone. C. Press Start button. AutoCal processes all calibration procedure i. AGC EGSM ii.
  • Page 134 13. EXPLODED VIEW & REPLACEMENT PART LIST 13.1 Exploded View - 137 -...
  • Page 135: Exploded View & Replacement Part List

    13.2 Accessory Location Level Description Part Number Specification SVC Color Remark 3.7 V,850 mAh,1 CELL,PRISMATIC ,G3100 SBPL00 BATTERY PACK,LI-ION SBPL0072108 Silver BATTERY(SV) EAR PHONE/EAR SGEY00 SGEY0003401 W3000 ,3Pole Necklace type(CDMA Design) MIKE SET 100-240V ,60 Hz,5.2 V,800 mA,CE,CB,GOST , SSAD00 ADAPTOR,AC-DC...
  • Page 136: Replacement Parts

    G3100 EUASV,SILVER MTAD01 TAPE,WINDOW MTAD0017402 G3100 EUASV,SILVER AWAB00 WINDOW ASSY,LCD AWAB0006901 G3100 WINDOW Silver BFAA00 FILM,INMOLD BFAA0011501 G3100 EUARD INMOLDE FILM MWAC00 WINDOW,LCD MWAC0031601 G3100 EUASV,SILVER MPBG00 PAD,LCD MPBG0015701 G3100 EUASV,SILVER Black MTAB00 TAPE,PROTECTION MTAB0028801 SUMY00 MICROPHONE SUMY0004601 ASSY ,-40 dB,6*1.5 ,W3000 MIC...
  • Page 137: Accessory

    G3100 EUASV,SILVER Silver SBCL00 BATTERY,CELL,LITHIUM SBCL0001302 2 V,1 mAh,COIN ,W3000 Back Up Battery SJMY00 VIBRATOR,MOTOR SJMY0003602 3 V,0.08 A,10*3.4 ,W3000 VIBRATOR SNGF00 ANTENNA,GSM,FIXED SNGF0002401 3.0 ,-2 dBd,WHITE ,GSM+DCS, G3100,INTENNA SVLM00 LCD MODULE SVLM0006701 128 * 96 ,28.3*23.13 ,4096/65K, 26.1*21.11(A/A), TF -141-...
  • Page 138: Replacement Parts

    13.3 Replacement Parts <Main component> Location Level Description Part Number Specification Color Remark SAFY00 PCB ASSY,MAIN SAFY0084901 G3100 EUASV Silver MLAB00 LABEL,A/S MLAB0000601 HUMIDITY STICKER SAFA00 PCB ASSY,MAIN,AUTO SAFA0031101 G3100 EUASV CONN,JACK/PLUG, BAT301 ENJE0003001 2 ,2 PIN,W3000 Back Up Battery Holder...
  • Page 139 Location Level Description Part Number Specification Color Remark C134 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C135 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C136 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C137 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C140 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C201 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C202 CAP,TANTAL,CHIP,MAKER...
  • Page 140 Location Level Description Part Number Specification Color Remark C236 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C237 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C238 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C242 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C243 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C301 CAP,CERAMIC,CHIP ECCH0001811 220000 pF,10V ,Z ,Y5V ,HD ,1005 ,R/TP...
  • Page 141 Location Level Description Part Number Specification Color Remark C409 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C410 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C411 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C412 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C413 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C414 CAP,TANTAL,CHIP,MAKER...
  • Page 142 Location Level Description Part Number Specification Color Remark C449 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C450 CAP,CERAMIC,CHIP ECCH0000101 0.5 pF,50V,C,NP0,TC,1005,R/TP C451 CAP,CERAMIC,CHIP ECCH0000103 1.5 pF,50V,C,NP0,TC,1005,R/TP C453 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C454 CAP,CERAMIC,CHIP ECCH0000379 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP C455 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C456 CAP,CERAMIC,CHIP...
  • Page 143 Location Level Description Part Number Specification Color Remark 1-1E1A ,85 V,1 A,R/TP ,P=200mW, D201 DIODE,SWITCHING EDSY0012301 IFM=200mA D301 DIODE,SWITCHING EDSY0000401 SOT-23,80V,0.3A,R/TP D302 DIODE,SWITCHING EDSY0012101 US-FLAT ,30 V,1 A,R/TP ,2.5*1.25*0.6(t) 880/960 ,1710/1880 ,1.3 dB,1.5 dB,30 dB,25 FL401 FILTER,SEPERATOR SFAY0001901 dB,ETC ,5.4*4.0*1.8 MHz,3.0*2.5*0.9(t) ,SMD ,DUAL SAW FL402 FILTER,SAW...
  • Page 144 Location Level Description Part Number Specification Color Remark R109 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R110 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R111 RES,CHIP ERHY0000278 82K ohm,1/16W,J,1005,R/TP R112 RES,CHIP ERHY0000512 10M ohm,1/16W,J,1608,R/TP R116 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R117 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R201 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R202 RES,CHIP...
  • Page 145 Location Level Description Part Number Specification Color Remark R237 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP R238 RES,CHIP ERHY0000205 15 ohm,1/16W,J,1005,R/TP R240 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP R241 RES,CHIP ERHY0000296 1M ohm,1/16W,J,1005,R/TP R250 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R252 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R254 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R255 RES,CHIP...
  • Page 146 Location Level Description Part Number Specification Color Remark R407 RES,CHIP ERHY0000255 5.6K ohm,1/16W,J,1005,R/TP R408 RES,CHIP ERHY0004301 130 ohm,1/16W ,J ,1005 ,R/TP R409 RES,CHIP ERHY0004301 130 ohm,1/16W ,J ,1005 ,R/TP R410 RES,CHIP ERHY0000234 510 ohm,1/16W,J,1005,R/TP R411 RES,CHIP ERHY0000231 390 ohm,1/16W,J,1005,R/TP R412 RES,CHIP ERHY0000214 51 ohm,1/16W,J,1005,R/TP R413...
  • Page 147 R453 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R454 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP SPFY00 PCB,MAIN SPFY0060901 FR-4 ,1 mm,MULTI-8 ,G3100 Ver. C Silver 160 PIN MINI-BGA ,160 PIN,R/TP ,GSM U101 EUSY0100601 DIGITAL BASEBAND / AD20MSP430 64 BALL LFBGA / MINI-BGA ,64 PIN,R/TP U102...
  • Page 148 Location Level Description Part Number Specification Color Remark ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VA207 RES,VARIABLE,ETC ERVZ0000101 VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VA208 RES,VARIABLE,ETC ERVZ0000101 VARISTOR 0.32768 MHz,20 PPM,12.5 pF,65000 ohm,SMD X101 X-TAL EXXY0004601 ,6.9*1.4*1.3 , X401 VCTCXO EXSK0003501...

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