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Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Lay the monitor on a flat, soft and clean surface.
2.
Open the latches of stand cover with tool.
3.
Remove the screws to separate stand ass'y.
4.
Remove the rear cover via open latches by tool.
5.
Remove the hinge.
6.
Remove the screws to remove the speakers
7.
Remove the screws and tear off all tapes.
8.
Disconnect the Pins and white tape to remove the mainframe.
9.
Remove the screws to separate middle frame and panel.
10. Remove the main boards and USB board.
11. Open all latches of base by tool.
12. Remove the screws, disconnect the cables to remove wireless charging module.
13.
14.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
0
Tool Size (if
applicable)
Page 2
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