Vescent ICE Oem Integration Manual

2019/05/01 00:16
OEM Integration Guide
Overview
The ICE Platform consists of daughter modules that are connected together through a common power
and communications bus. The daughter modules can be controlled by a master controller (ICE-MC1)
that performs power regulation, monitoring, and communications interfacing. All the circuit boards are
designed to the same template so that they can be stacked together to form a board-to-board bus
without the use of an additional backplane. An example of this stacking is shown below in
Fig. 1: ICE daughter modules stacked together.
Each PCB has common locations for mounting holes, board-to-board interconnects, I/O connectors,
and heatsinking tabs. Once the boards are stacked together, each board can be addressed and
communicated with through a serial I
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have a specific I C address set via dip switches on each circuit board and the master controller
MC1) can route commands directly to each board. The master controller also routes and manages the
power bus going to each board. Up to 8 I
boards to be connected to a single master controller (for a total stack of 9 circuit boards). In addition
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to the I C communications bus, there are global event trigger lines that are routed directly to every
circuit board. These global trigger lines form the
pre-defined behavior through TTL without the overhead of USB or serial communications. The block
diagram in figure 2 shows how master-daughter and event system communication is routed.
Product Manuals - http://www.vescent.com/manuals/
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C bus (see this page
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C addresses can be assigned, allowing up to 8 daughter
Event System, which allows high-speed triggering of
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for I C details). Each daughter board can
OEM Integration Guide
figure 1.
(ICE-