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HP dx5150 Series Disassembly Instructions Manual
HP dx5150 Series Disassembly Instructions Manual

HP dx5150 Series Disassembly Instructions Manual

Small form factor, atx board
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HP-00007-01, Appendix 3
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model
HP Business Desktop dx5150 Series
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0
Items Requiring Selective Treatment
1.1
Items listed below are classified as requiring selective treatment.
1.2
Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
Batteries
Mercury containing components
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardants
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Components and waste containing
asbestos
Components, parts and materials
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances
Description
Small Form Factor, ATX board
Notes
With a surface greater than 10
square cm
All types including standard
alkaline and lithium coin or button
style batteries
For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
Includes background illuminated
displays with gas discharge lamps
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
HP Restricted
02-Jun-2005
Qty items in
product.
2 (sys board &
P/S board)
1
0
0
0
0
3 (3 in P/S)
0
0
0
0
0
0
0
Page 1

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Summary of Contents for HP dx5150 Series

  • Page 1 Small Form Factor, ATX board Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment. Items Requiring Selective Treatment Items listed below are classified as requiring selective treatment.
  • Page 2: System Board

    HP-00007-01, Appendix 3 02-Jun-2005 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable)
  • Page 3 HP-00007-01, Appendix 3 02-Jun-2005 POWER SUPPLY PCA ( continued ) Remove the cover from the power supply by removing the screws from the power supply surface, and then lifting the cover off of the power supply (see Figure 12 below).
  • Page 4 HP-00007-01, Appendix 3 02-Jun-2005 Illustrations FIGURE 1: Removing the access panel FIGURE 2: Removing the front bezel FIGURE 3: Rotating the drive cage FIGURE 4: System board HP Restricted Page 4...
  • Page 5 HP-00007-01, Appendix 3 02-Jun-2005 FIGURE 5: Removing the heatsink FIGURE 6: Removing the heatsink assembly FIGURE 7: Removing the processor FIGURE 8: System board screw locations FIGURE 9: Removing the system board FIGURE 10: Removing the power supply HP Restricted...
  • Page 6 HP-00007-01, Appendix 3 02-Jun-2005 FIGURE 11: Tie wrap FIGURE 12: Power supply with cover removed FIGURE 13: Switch cables FIGURE 14: Inlet cables FIGURE 15: Power supply PCA FIGURE 16: C4 and C5 capacitors HP Restricted Page 6...
  • Page 7 HP-00007-01, Appendix 3 02-Jun-2005 FIGURE 17: Dikes FIGURE 18: C11 capacitor FIGURE 19: Type 1 battery holder FIGURE 20: Type 2 battery holder HP Restricted Page 7...