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Power integrations SCALE-1 Handling Instructions Manual

Gate drivers
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AN-1501
Application Note
Handling Instructions for SCALE™-1 and SCALE™-2 Gate
Drivers

Scope

This Application Note defines the requirements for handling the high-power SCALE™-1 and SCALE™-2
products (gate driver cores, plug-and-play gate drivers) from Power Integrations in terms of:
•
Storage conditions
•
Soldering instructions for gate driver core products
•
Mechanical handling
•
ESD handling
•
Guideline for Return Material Analysis - RMA
The information given here applies to all customers, distributors and suppliers receiving high-power products
from Power Integrations.

Content

Scope .............................................................................................................................................. 1
Content ........................................................................................................................................... 1
Storage Conditions ......................................................................................................................... 2
Soldering Instructions for Driver Core Products............................................................................ 3
Reflow Soldering.................................................................................................................. 3
Wave Soldering ................................................................................................................... 3
Selective Soldering............................................................................................................... 3
Manual Soldering ................................................................................................................. 4
Mechanical Handling ...................................................................................................................... 4
Insertion of Gate Driver Cores into the Carrier PCB ................................................................. 4
ESD Handling .................................................................................................................................. 6
EPA (Electrostatic Protected Area) ......................................................................................... 6
Guideline for Return Material Analysis - RMA ................................................................................ 6
Legal Disclaimer ............................................................................................................................. 7
Manufacturer .................................................................................................................................. 7
www.power.com/igbt-driver
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Summary of Contents for Power integrations SCALE-1

  • Page 1: Table Of Contents

    Handling Instructions for SCALE™-1 and SCALE™-2 Gate Drivers Scope This Application Note defines the requirements for handling the high-power SCALE™-1 and SCALE™-2 products (gate driver cores, plug-and-play gate drivers) from Power Integrations in terms of: • Storage conditions • Soldering instructions for gate driver core products •...

  • Page 2: Storage Conditions

    AN-1501 Application Note Storage Conditions Power Integrations products mentioned in this Application Note must be stored and shipped according to the environmental conditions specified in Table 1. Material Measures Ambient Ambient Conditions Max. Storage Atmosphere [Temp. / RH] Time [Months]...

  • Page 3: Soldering Instructions For Driver Core Products

    AN-1501 Application Note Soldering Instructions for Driver Core Products Power Integrations gate driver cores can be soldered with the following techniques, which are defined for different process conditions. Reflow Soldering Reflow soldering of drivers is not permitted. Wave Soldering Parameter...

  • Page 4: Manual Soldering

    PCB bending or excessive mechanical stress to the solder joints, the force must be shifted directly to the corresponding terminals of the driver PCB. Transformer Transformer Fig. 1 Not recommended (left) and recommended (right) ways of handling Power Integrations gate driver cores during assembly (body plan of a driver) www.power.com/igbt-driver Page 4...
  • Page 5 This will increase the driver’s vibration withstand capability and avoid PCB bending. Fig. 3 illustrates the correct usage of the bolts. Distance bolt IGBT Module Fig. 3 Correct (A) and wrong (B and C) fixing of Power Integrations gate drivers www.power.com/igbt-driver Page 5...

  • Page 6: Esd Handling

    ESD protected area or EPA must be set up and correctly used every time Power Integrations’ high-power SCALE™-1 and SCALE™-2 products are handled or processed. An EPA or ESD PA (ESD Protected Area) is designed to minimize the generation and retention of ESD. It allows the level of failures during production and later in life to be kept to a minimum.

  • Page 7: Legal Disclaimer

    +41 32 344 47 47 +41 32 344 47 40 Email igbt-driver.sales@power.com Website www.power.com/igbt-driver  2015 Power Integrations Switzerland GmbH. All rights reserved. We reserve the right to make any technical modifications without prior notice. Version 1.0 from 2016-04-14 www.power.com/igbt-driver Page 7...

  • Page 8: Power Integrations Worldwide High Power Customer Support Locations

    AN-1501 Application Note Power Integrations Worldwide High Power Customer Support Locations World Headquarters China (Shenzhen) Japan (Kanagawa) 5245 Hellyer Avenue 17/F, Hivac Building, No 2, Kosei Dai-3 Bldg., 2-12-11, Shin- San Jose, CA 95138 | USA Keji South 8th Road,...

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Scale-2

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