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Summary of Contents for Ublox LEA-M8S
- Page 1 LEA-M8S / LEA-M8T u-blox M8 concurrent GNSS modules Hardware Integration Manual Abstract This document describes the features and specifications of u-blox LEA-M8S and LEA-M8T modules. www.u-blox.com UBX-15030060 - R04...
- Page 1 LEA-M8S / LEA-M8T u-blox M8 concurrent GNSS modules Hardware integration manual Abstract This document describes the features and specifications of u-blox LEA-M8S and LEA-M8T modules. www.u-blox.com UBX-15030060 - R06...
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Page 2: Document Information
Document contains the final product specification. European Union regulatory compliance LEA-M8S-M8T complies with all relevant requirements for RED 2014/53/EU. The LEA-M8S-M8T Declaration of Conformity (DoC) is available at www.u-blox.com within Support > Product resources > Conformity Declaration. This document applies to the following products:... -
Page 2: Document Information
LEA-M8S / LEA-M8T - Hardware integration manual Document information Title LEA-M8S / LEA-M8T Subtitle u-blox M8 concurrent GNSS modules Document type Hardware integration manual Document number UBX-15030060 Revision and date 5-May-2020 Document status Production information Product status Corresponding content status... -
Page 3: Preface
Contact details are at the end of the document. Helpful Information when Contacting Technical Support When contacting Technical Support please have the following information ready: Receiver type (e.g. LEA-M8S-0-10), Datacode (e.g. 180800.0700) and firmware version (e.g. ROM SPG 3.01) Receiver/module configuration ... -
Page 3: Preface
LEA-M8S / LEA-M8T - Hardware integration manual Contents Document information ..........................2 Contents ................................3 Hardware description ........................... 5 1.1 Overview ................................ 5 1.2 Configuration ............................... 5 1.3 Connecting power ............................5 1.3.1 VCC: Main supply voltage ......................... 5 1.3.2 V_BCKP: Backup supply voltage ...................... 5 1.3.3 VDD_USB: USB interface power supply .................. -
Page 4: Table Of Contents
LEA-M8S / LEA-M8T - Hardware Integration Manual Contents Preface ..........................3 Contents ..........................4 Hardware description ....................6 Overview ....................................6 Configuration ..................................6 Connecting power ................................... 6 1.3.1 VCC: Main Supply Voltage ..............................6 1.3.2 V_BCKP: Backup Supply Voltage ............................6 1.3.3... -
Page 4: Table Of Contents
LEA-M8S / LEA-M8T - Hardware integration manual 3.3 Hardware migration LEA-6T -> LEA-M8T ...................21 3.4 Software migration ...........................21 Product handling ..........................22 4.1 Packaging, shipping, storage and moisture preconditioning ............22 4.2 Soldering ..............................22 4.3 EOS/ESD/EMI precautions ........................25 4.4 Applications with cellular modules ......................28 Appendix ............................... - Page 5 LEA-M8S / LEA-M8T - Hardware Integration Manual Appendix .......................... 30 A Glossary ........................30 Recommended parts ....................30 Related documents......................32 Revision history ........................ 32 Contact ..........................33 UBX-15030060 - R04 Production Information Contents Page 5 of 33...
- Page 5 For this reason, it is important that the supply circuitry is able to support the peak power for a short time (see the LEA-M8S Data sheet [1] and the NEO / LEA-M8T Data sheet Error! Reference source not found. for etailed specifications).
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Page 6: Hardware Description
For this reason, it is important that the supply circuitry is able to support the peak power for a short time (see the LEA-M8S Data Sheet [1] and the NEO / LEA-M8T Data Sheet [2] for detail specification). -
Page 6: Hardware Description
RTC and the BBR to avoid unnecessary battery drain (see Figure 1). In this case, VCC supplies power to the RTC and BBR. Figure 1: Backup battery and voltage (for exact pin orientation, see the LEA-M8S Data sheet [1] and the NEO/LEA-M8T Data sheet [2] 1.3.3... -
Page 7: Vdd_Usb: Usb Interface Power Supply
RXD/TXD, which supports configurable baud rates. The baud rates supported are specified in the LEA-M8S Data Sheet [1] and the NEO / LEA-M8T Data Sheet [2]. The signal output and input levels are 0 V to VCC. An interface based on RS232 standard levels (+/- 12 V) can be implemented using level shifters such as Maxim MAX3232. -
Page 7: Vdd_Usb: Usb Interface Power Supply
For more information about the DDC implementation, see the u-blox 8 / u-blox M8 Receiver Description Including Protocol Specification [3]. For bandwidth information, see the LEA-M8S Data sheet [1] and the NEO / LEA-M8T Data sheet [2]. For timing parameters, consult the I2C-bus specification [6]. -
Page 8: Display Data Channel (Ddc)
EXTINT0 and EXTINT1 are external interrupt pins with fixed input voltage thresholds with respect to VCC (see the LEA-M8S Data sheet [1] and the NEO / LEA-M8T Data sheet [2] for more information). They can be used for wake-up functions in power save mode and for aiding. Leave open if unused. -
Page 8: Display Data Channel (Ddc)
For more information about the DDC implementation, see the u-blox 8 / u-blox M8 Receiver Description Including Protocol Specification [3]. For bandwidth information, see the LEA-M8S Data Sheet [1] and the NEO / LEA-M8T Data Sheet [2]. For timing parameters, consult the I2C-bus specification [6]. -
Page 9: Tx_Ready
1.5.6 TIMEPULSE A configurable time pulse signal is available on LEA-M8S and LEA-M8T. By default, the time pulse signal is configured to one pulse per second. For more information, see the u-blox 8 / u-blox M8 Receiver Description Including Protocol Specification [3]. -
Page 9: Tx_Ready
EXTINT0 and EXTINT1 are external interrupt pins with fixed input voltage thresholds with respect to VCC (see the LEA-M8S Data Sheet [1] and the NEO / LEA-M8T Data Sheet [2] for more information). They can be used for wake-up functions in Power Save Mode and for aiding. Leave open if unused. -
Page 10: Antenna Open Circuit Detection (Ant_Det_N)
LEA-M8S / LEA-M8T - Hardware integration manual Figure 3: EMI Precautions UBX-15030060 - R06 Hardware description Page 10 of 33 Production information... -
Page 10: Antenna Open Circuit Detection (Ant_Det_N)
TIMEPULSE A configurable time pulse signal is available on LEA-M8S and LEA-M8T. By default, the time pulse signal is configured to one pulse per second. For more information, see the u-blox 8 / u-blox M8 Receiver Description Including Protocol Specification [3]. -
Page 11: Design
LEA-M8S / LEA-M8T - Hardware integration manual Design 2.1 Pin description Function Pin Description Remarks Power Supply voltage Provide clean and stable supply. 7, 13, 14, Ground Assure a good GND connection to all GND pins of 15, 17 the module. -
Page 11: Design
LEA-M8S / LEA-M8T - Hardware Integration Manual 2 Design 2.1 Pin description Function Description Remarks Power Supply Voltage Provide clean and stable supply. 7, 13, 14, Ground Assure a good GND connection to all GND pins of the 15, 17... -
Page 12: Pin Name Changes
LEA-M8S / LEA-M8T - Hardware integration manual Function Pin Description Remarks DDC data (LEA-M8S) SDA /SPI CS_N DDC data if D_SEL =1 (or open) (LEA-M8T) SPI chip select if D_SEL = 0 SPI CS_N DDC clock (LEA-M8S) SCL / SPI CLK... -
Page 12: Pin Name Changes
LEA-M8S / LEA-M8T - Hardware Integration Manual Function Description Remarks RESERVED Reserved Leave open (LEA-M8S) D_SEL D_SEL = 0 -> SPI, D_SEL =1 (or open) -> DDC Interface Select (LEA-M8T) Reserved 9, 21, 22, Reserved Leave open Table 2: Pinout LEA-M8S / LEA-M8T 2.1.1 Pin name changes... -
Page 13: Minimal Design
LEA-M8S / LEA-M8T - Hardware integration manual 2.2 Minimal design This is a minimal setup for a GNSS receiver with a LEA-M8S and LEA-M8T module: Passive antenna used No backup battery UART for communication Figure 4: LEA-M8S / LEA-M8T passive antenna design ☞... -
Page 13: Minimal Design
LEA-M8S / LEA-M8T - Hardware Integration Manual 2.2 Minimal design This is a minimal setup for a GNSS receiver with a LEA-M8S and LEA-M8T module: Passive antenna used No backup battery UART for communication Figure 4: LEA-M8S / LEA-M8T passive antenna design For active antenna design, see section 2.4... -
Page 14: Footprint And Paste Mask
Figure 5: LEA-M8S and LEA-M8T footprint Figure 6: LEA-M8S and LEA-M8T paste mask 2.4 Antenna ☞ For exact pin orientation in any design, see the LEA-M8S Data sheet [1] and the NEO / LEA-M8T Data sheet [2]. ☞ For recommended parts, see Appendix B. -
Page 14: Footprint And Paste Mask
Figure 5: LEA-M8S and LEA-M8T footprint Figure 6: LEA-M8S and LEA-M8T paste mask 2.4 Antenna For exact pin orientation in any design, see the LEA-M8S Data Sheet [1] and the NEO / LEA-M8T Data Sheet [2]. 2.4.1 Antenna design with passive antenna A design using a passive antenna requires more attention to the layout of the RF section. - Page 15 GNSS system power consumption budget with additional 5 to 20 mA typically. If the customers do not want to make use of the internal antenna supervisor and the supply voltage of the LEA-M8S and LEA-M8T module matches the supply voltage of the antenna (for example, 3.0 UBX-15030060 - R06 Design...
- Page 15 LEA-M8S / LEA-M8T - Hardware Integration Manual Minimal setup with a good patch antenna Figure 7 shows a minimal setup for a design with a good GNSS patch antenna. Figure 7: Module design with passive antenna Setup for best performance with passive antenna Figure 8 shows a design using an external LNA to increase the sensitivity for best performance with passive antenna.
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Page 16: Active Antenna Design
LEA-M8S / LEA-M8T - Hardware integration manual V), they can use the filtered supply voltage VCC_RF output to supply the antenna (see Figure 9). This design is used for modules in combination with active antenna. In case of different supply voltage, use a filtered external supply, see Figure 10. -
Page 16: Active Antenna Design
LEA-M8S / LEA-M8T - Hardware Integration Manual 2.4.2 Active antenna design Active antennas have an integrated low-noise amplifier. Active antennas require a power supply that will contribute to the total GNSS system power consumption budget with additional 5 to 20 mA typically. - Page 17 Figure 11 shows an active antenna supplied from the LEA-M8S / LEA-M8T module. LEA-M8S module includes a built in antenna bias supply for nominal 3 V antennas enabled by linking the filtered VCC_RF supply output pin to the V_ANT antenna supply input pin with a 10 Ohm resistor in series.
- Page 17 "low" = Antenna not detected (no current drawn). Status reporting At startup, and on every change of the antenna supervisor configuration, the LEA-M8S module will output an NMEA ($GPTXT) or UBX (INF-NOTICE) message with the internal status of the antenna supervisor (disabled, short detection only, enabled).
- Page 18 LEA-M8S / LEA-M8T - Hardware integration manual Short-circuit is detected if the voltage at the antenna supply falls close to zero and is indicated as an alarm in message MON-HW. Figure 11: Module design with active antenna, internal supply from VCC_RF External supply Figure 12 shows an externally powered active antenna design.
- Page 18 Figure 11 shows an active antenna supplied from the LEA-M8S / LEA-M8T module. LEA-M8S module includes a built in antenna bias supply for nominal 3 V antennas enabled by linking the filtered VCC_RF supply output pin to the V_ANT antenna supply input pin with a 10 Ohm resistor in series. The module then controls the power supply to the antenna, applying power whenever the receiver is active and removing power during power-save idle times and if a short-circuit is detected.
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Page 19: Power, Short And Open Detection Antenna Supervisor
LEA-M8S / LEA-M8T - Hardware integration manual Figure 13: Schematic of open circuit detection Rbias Equation 1: Calculation of threshold current for open circuit detection ☞ If the antenna supply voltage is not derived from VCC_RF, do not exceed the maximum voltage rating of ANT_DET_N. -
Page 19: Power, Short And Open Detection Antenna Supervisor
LEA-M8S / LEA-M8T - Hardware Integration Manual 2.4.3 Power, short and open detection Antenna Supervisor Optionally the ANT_DET_N pin may be reassigned to antenna supervision, allowing an external circuit to indicate to the module that the antenna is open-circuit. This condition is then reported by the module in message MON-HW. -
Page 20: Migration To U-Blox M8 Modules
If using BeiDou, check the bandwidth of the external RF components and the antenna. For information about power consumption, see the LEA-M8S Data sheet [1] and the NEO / LEA-M8T Data sheet [2]. It is highly advisable that customers consider a design review with the u-blox support team to ensure the compatibility of key functionalities. -
Page 20: Migration To U-Blox M8 Modules
If using BeiDou, check the bandwidth of the external RF components and the antenna. For information about power consumption, see the LEA-M8S Data Sheet [1] and the NEO / LEA-M8T Data Sheet [2]. It is highly advisable that customers consider a design review with the u-blox support team to ensure the compatibility of key functionalities. -
Page 21: Hardware Migration Lea-6T -> Lea-M8T
LEA-M8S / LEA-M8T - Hardware integration manual EXTINT0 External interrupt pin EXTINT0 External interrupt pin No difference TIMEPULSE Timepulse (1PPS) TIMEPULSE Time pulse 1 No difference Table 5: Pin-out comparison LEA-6N vs. LEA-M8S 3.3 Hardware migration LEA-6T -> LEA-M8T LEA-6T... -
Page 21: Hardware Migration Lea-6T -> Lea-M8T
LEA-M8S / LEA-M8T - Hardware Integration Manual 3.3 Hardware migration LEA-6T -> LEA-M8T LEA-6T LEA-M8T Remarks for Migration Pin Name Typical Assignment Pin Name Typical Assignment DDC Data SDA / SPI CS_N DDC Data No difference DDC Clock SCL / SPI CLK... -
Page 22: Product Handling
4.1 Packaging, shipping, storage and moisture preconditioning For information pertaining to reels and tapes, moisture sensitivity levels (MSL), shipment and storage information, as well as drying for preconditioning see the LEA-M8S Data sheet [1] and NEO / LEA- M8T Data sheet [2]. -
Page 22: Product Handling
4.1 Packaging, shipping, storage and moisture preconditioning For information pertaining to reels and tapes, Moisture Sensitivity levels (MSL), shipment and storage information, as well as drying for preconditioning see the LEA-M8S Data Sheet [1] and NEO / LEA-M8T Data Sheet [2]. - Page 23 LEA-M8S / LEA-M8T - Hardware integration manual Cooling phase A controlled cooling avoids negative metallurgical effects of the solder (the solder becomes more brittle) and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with good shape and low contact angle.
- Page 23 LEA-M8S / LEA-M8T - Hardware Integration Manual Cooling phase A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle.
- Page 24 LEA-M8S / LEA-M8T - Hardware integration manual Repeated reflow soldering Only single reflow soldering processes are recommended for boards populated with u-blox M8 modules. To avoid upside down orientation during the second reflow cycle, the M8 modules should not be submitted to two reflow cycles on a board populated with components on both sides. In such a case, the module should always be placed on that side of the board which is submitted into the last reflow cycle.
- Page 24 LEA-M8S / LEA-M8T - Hardware Integration Manual Repeated reflow soldering Only single reflow soldering processes are recommended for boards populated with u-blox M8 modules. u-blox M8 modules should not be submitted to two reflow cycles on a board populated with components on both sides in order to avoid upside down orientation during the second reflow cycle.
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Page 25: Eos/Esd/Emi Precautions
⚠ To prevent overstress damage at the RF_IN of your receiver, never exceed the maximum input power (see the LEA-M8S Data sheet [1] and the NEO-M8T / LEA-M8T Data sheet [2]). Electrostatic discharge (ESD) Electrostatic discharge (ESD) is the sudden and momentary electric current that flows between two objects at different electrical potentials caused by direct contact or induced by an electrostatic field. -
Page 25: Eos/Esd/Emi Precautions
EOS/ESD/EMI handling and protection measures. To prevent overstress damage at the RF_IN of your receiver, never exceed the maximum input power (see the LEA-M8S Data Sheet [1] and the NEO-M8T / LEA-M8T Data Sheet [2]). UBX-15030060 - R04 Production Information... - Page 26 LEA-M8S / LEA-M8T - Hardware integration manual Unless there is a galvanic coupling between the local GND (the work table) and the PCB GND, the first point of contact when handling the PCB must always be between the local GND and PCB GND.
- Page 26 LEA-M8S / LEA-M8T - Hardware Integration Manual Electrostatic discharge (ESD) Electrostatic discharge (ESD) is the sudden and momentary electric current that flows between two objects at different electrical potentials caused by direct contact or induced by an electrostatic field. The term is usually used in the electronics and other industries to describe momentary unwanted currents that may cause damage to electronic equipment.
- Page 27 LEA-M8S / LEA-M8T - Hardware integration manual antenna. EOS causes damage to the chip structures. If the RF_IN is damaged by EOS, it is hard to determine whether the chip structures have been damaged by ESD or EOS. EOS protection measures ☞...
- Page 27 LEA-M8S / LEA-M8T - Hardware Integration Manual Small passive antennas (<2 dBic and Passive antennas (>2 dBic or performance Active antennas performance critical) sufficient) LNA with appropriate ESD rating Figure 15: ESD Precautions Protection measure A is preferred because it offers the best GNSS performance and best level of ESD protection.
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Page 28: Applications With Cellular Modules
GSM terminals transmit power levels up to 2 W (+33 dBm) peak, 3G and LTE up to 250 mW continuous. Consult the LEA-M8S Data sheet [1] and the NEO-M8T / LEA-M8T Data sheet [2] for the absolute maximum power input at the GNSS receiver. -
Page 28: Applications With Cellular Modules
GSM terminals transmit power levels up to 2 W (+33 dBm) peak, 3G and LTE up to 250 mW continuous. Consult the LEA-M8S Data Sheet [1] and the NEO-M8T / LEA-M8T Data Sheet [2] for the absolute maximum power input at the GNSS receiver. - Page 29 LEA-M8S / LEA-M8T - Hardware integration manual Maintaining a good grounding concept in the design Shielding Layout optimization Filtering Placement of the GNSS antenna Adding a CDMA, GSM, WCDMA band pass filter before handset antenna...
- Page 29 LEA-M8S / LEA-M8T - Hardware Integration Manual Figure 18: In-band interference sources Measures against in-band interference include: Maintaining a good grounding concept in the design Shielding Layout optimization Filtering Placement of the GNSS antenna ...
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Page 30: Appendix
LEA-M8S / LEA-M8T - Hardware integration manual Appendix A Glossary Abbreviation Definition ANSI American National Standards Institute BeiDou Chinese navigation satellite system CDMA Code Division Multiple Access Electromagnetic compatibility Electromagnetic interference Electrical Overstress Electrostatic Protective Area Electrostatic discharge Galileo European navigation system... -
Page 30: Appendix
LEA-M8S / LEA-M8T - Hardware Integration Manual Appendix A Glossary Abbreviation Definition ANSI American National Standards Institute BeiDou Chinese navigation satellite system CDMA Code Division Multiple Access Electromagnetic compatibility Electromagnetic interference Electrical Overstress Electrostatic Protective Area Electrostatic discharge Galileo European navigation system... - Page 31 LEA-M8S / LEA-M8T - Hardware Integration Manual Ferrite Murata BLM15HD102SN1 High IZI @ fGSM Bead Murata NFL18SP157X1A3 Monolithic Type For data signals, 34 pF load capacitance Feed thru NFA18SL307V1A45 Array Type For data signals, 4 circuits in 1 package Capacitor...
- Page 31 LEA-M8S / LEA-M8T - Hardware integration manual Manufacturer Part ID Remarks Parameters to consider TAI-SAW TA1573A GPS+GLONASS Low insertion loss TAI-SAW TA1343A GPS+GLONASS+BeiDou Low insertion loss TAI-SAW TA0638A GPS+GLONASS+BeiDou Low insertion loss NJG1143UA2 Low noise figure, up to 15 dBm RF input...
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Page 32: Related Documents
LEA-M8S / LEA-M8T - Hardware Integration Manual Related documents LEA-M8S (FW3) Data Sheet, Docu. No. UBX-16010205 NEO / LEA-M8T (FW3) DataSheet, Docu. No. UBX-15025193 u-blox 8 / u-blox M8 Receiver Description Including Protocol Specification (Public version), Docu. No. UBX-13003221 GPS Antenna Application Note, Docu. No. GPS-X-08014 GPS Compendium, Docu. -
Page 32: Related Documents
LEA-M8S / LEA-M8T - Hardware integration manual Related documents LEA-M8S (FW3) Data sheet, doc. no. UBX-16010205 NEO / LEA-M8T (FW3) Data sheet, doc. no. UBX-15025193 u-blox 8 / u-blox M8 Receiver Description Including Protocol Specification (Public version), doc. no. UBX-13003221 GPS Antenna application note, doc. -
Page 33: Contact
LEA-M8S / LEA-M8T - Hardware Integration Manual Contact For complete contact information, visit us at www.u-blox.com u-blox Offices North, Central and South America Headquarters Asia, Australia, Pacific Europe, Middle East, Africa u-blox America, Inc. u-blox Singapore Pte. Ltd. u-blox AG... -
Page 33: Contact
LEA-M8S / LEA-M8T - Hardware integration manual Contact For complete contact information, visit us at www.u-blox.com. u-blox Offices North, Central and South America Headquarters Asia, Australia, Pacific Europe, Middle East, Africa u-blox America, Inc. u-blox Singapore Pte. Ltd. u-blox AG...
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