Table Of Contents - Samsung DVD-E360 Service Manual

Service manual dvd player dvd-e360
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Contents
Contents
1.
Precautions ...................................................................................................................................... 1 − 1
1.1.
Safety Precautions ................................................................................................................... 1 − 1
1.2.
Servicing Precautions ............................................................................................................... 1 − 3
1.2.1.
General Servicing Precautions ....................................................................................... 1 − 3
1.2.2.
Insulation Checking Procedure....................................................................................... 1 − 3
1.3.
ESD Precautions...................................................................................................................... 1 − 4
1.4.
Handling the optical pick-up ...................................................................................................... 1 − 5
2.
Product Specifications ........................................................................................................................ 2 − 1
2.1.
Product Specification................................................................................................................ 2 − 1
2.1.1.
DVD General Features ................................................................................................. 2 − 2
2.1.2.
Discs which cannot be played with this player................................................................... 2 − 2
2.1.3.
Disc Type and Characteristics ........................................................................................ 2 − 2
2.1.4.
Region Code............................................................................................................... 2 − 3
2.1.5.
USB.......................................................................................................................... 2 − 4
2.2.
Chassis Product Specification..................................................................................................... 2 − 6
2.3.
Option Product Specification...................................................................................................... 2 − 7
3.
Disassembly and Reassembly .............................................................................................................. 3 − 1
3.1.
Cabinet and PCB ..................................................................................................................... 3 − 1
3.1.1.
Top Cabinet Removal................................................................................................... 3 − 1
3.1.2.
Assy Front Cabinet Removal ......................................................................................... 3 − 2
3.1.3.
Assy Loader Removal .................................................................................................. 3 − 3
3.1.4.
Main PCB and S.M.P.S PCB and RCA Jack PCB Removal.................................................. 3 − 4
3.2.
PCB Location ......................................................................................................................... 3 − 5
4.
Troubleshooting ................................................................................................................................ 4 − 1
4.1.
Troubleshooting ...................................................................................................................... 4 − 1
4.2.
Software Update ...................................................................................................................... 4 − 25
4.2.1.
CD Upgrade ............................................................................................................... 4 − 25
4.2.2.
Main F_W Upgrade Method .......................................................................................... 4 − 29
5.
PCB Diagrams.................................................................................................................................. 5 − 1
5.1.
Wiring Diagram....................................................................................................................... 5 − 2
5.2.
Main PCB .............................................................................................................................. 5 − 3
5.3.
S.M.P.S PCB........................................................................................................................... 5 − 6
5.4.
RCA Jack PCB........................................................................................................................ 5 − 8
6.
Schematic Diagrams .......................................................................................................................... 6 − 1
6.1.
All Block Diagram................................................................................................................... 6 − 2
6.2.
Power .................................................................................................................................... 6 − 3
6.2.1.
About S.M.P.S (Ringing Choke Converter Method)............................................................ 6 − 3
6.2.2.
i
Copyright© 1995-2011 SAMSUNG. All rights reserved.

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