Microchip Technology TC4451 Manual
Microchip Technology TC4451 Manual

Microchip Technology TC4451 Manual

12a high-speed mosfet drivers

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12A High-Speed MOSFET Drivers
Features:
• High Peak Output Current: 13A (typical)
• Low Shoot-Through/Cross-Conduction Current in
Output Stage
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Continuous Output Current: 2.6A
(maximum)
• Matched Fast Rise and Fall Times:
- 21 ns with 10,000 pF Load
- 42 ns with 22,000 pF Load
• Matched Short Propagation Delays: 44 ns
(typical)
• Low Supply Current:
- With Logic '1' Input – 140 µA (typical)
- With Logic '0' Input – 40 µA (typical)
• Low Output Impedance: 0.9 (typical)
• Latch-Up Protected: Withstands 1.5A Output
Reverse Current
• Input Withstands Negative Inputs Up To 5V
• Pin-Compatible with the TC4420/TC4429,
TC4421/TC4422 and TC4421A/TC4422A
MOSFET Drivers
• Space-Saving, Thermally-Enhanced, 8-Pin DFN-
S Package
Applications:
• Line Drivers for Extra Heavily-Loaded Lines
• Pulse Generators
• Driving the Largest MOSFETs and IGBTs
• Local Power On/Off Switch
• Motor and Solenoid Driver
• LF Initiator
 2006-2014 Microchip Technology Inc.
TC4451/TC4452
General Description:
The TC4451/TC4452 are single-output MOSFET
drivers. These devices are high-current buffers/drivers
capable of driving large MOSFETs and insulated gate
bipolar transistors (IGBTs). The TC4451/TC4452 have
matched output rise and fall times, as well as matched
leading and falling-edge propagation delay times. The
TC4451/TC4452 devices also have very low cross-
conduction current, reducing the overall power
dissipation of the device.
These devices are essentially immune to any form of
upset, except direct overvoltage or over-dissipation.
They cannot be latched under any conditions within
their power and voltage ratings. These parts are not
subject to damage or improper operation when up to
5V of ground bounce is present on their ground
terminals. They can accept, without damage or logic
upset, more than 1.5A inductive current of either
polarity being forced back into their outputs. In addition,
all terminals are fully protected against electrostatic
discharge (ESD) up to 4.0 kV (HBM) and 400V (MM).
The TC4451/TC4452 inputs may be driven directly
from either TTL or CMOS (3V to 18V). Moreover,
300 mV of hysteresis is built into the input, providing
noise immunity and enabling the device to be driven
from slowly rising or falling waveforms.
With a wide operating temperature range and having
both surface-mount and pin-through-hole packages,
the TC4451/TC4452 family of 12A MOSFET drivers fits
into any application where high gate/line capacitance
drive is required.
DS20001987C-page 1

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Summary of Contents for Microchip Technology TC4451

  • Page 1 S Package With a wide operating temperature range and having both surface-mount and pin-through-hole packages, Applications: the TC4451/TC4452 family of 12A MOSFET drivers fits into any application where high gate/line capacitance • Line Drivers for Extra Heavily-Loaded Lines drive is required.
  • Page 2 TC4451 TC4452 Tab is Common to V Note 1: Duplicate pins must both be connected for proper operation. 2: Exposed thermal pad (EP) of the DFN-S package is electrically isolated; see Table 3-1.  2006-2014 Microchip Technology Inc. DS20001987C-page 2...
  • Page 3 TC4451/TC4452 Functional Block Diagram TC4451 Inverting 140 µA Output 300 mV Cross-Conduction Reduction and Pre-Drive Output Circuitry TC4452 Input Non-Inverting 4.7V Effective Input C = 25 pF  2006-2014 Microchip Technology Inc. DS20001987C-page 3...
  • Page 4: Electrical Characteristics

    Operating Input Voltage — 18.0 Ramp Rate — — V/ms Note 1: Switching times ensured by design. Tested during characterization, not production tested. Valid for AT and MF packages only. T = +25°C.  2006-2014 Microchip Technology Inc. DS20001987C-page 4...
  • Page 5: Dc Characteristics (Over Operating Temperature Range)

     Thermal Resistance, 8L-6x5 DFN-S — 35.7 — °C/W Typical four-layer board with vias to ground plane  Thermal Resistance, 8L-PDIP — 89.3 — °C/W  Thermal Resistance, 8L-SOIC — 149.5 — °C/W  2006-2014 Microchip Technology Inc. DS20001987C-page 5...
  • Page 6 Rise and Fall Times vs. Load. Temperature. 1E-07 47,000 pF 1E-08 22,000 pF 10,000 pF 1E-09 Supply Voltage (V) Supply Voltage (V) FIGURE 2-3: Fall Time vs. Supply FIGURE 2-6: Crossover Energy vs. Voltage. Supply Voltage.  2006-2014 Microchip Technology Inc. DS20001987C-page 6...
  • Page 7 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature ( Temperature ( FIGURE 2-9: Propagation Delay vs. FIGURE 2-12: Input Threshold vs. Temperature. Temperature.  2006-2014 Microchip Technology Inc. DS20001987C-page 7...
  • Page 8 50 kHz 10 kHz = +25 1,000 10,000 100,000 Capacitive Load (pF) Supply Voltage (V) FIGURE 2-15: Low State Output FIGURE 2-18: Supply Current vs. Resistance vs. Supply Voltage. Capacitive Load (V = 6V).  2006-2014 Microchip Technology Inc. DS20001987C-page 8...
  • Page 9 Frequency (V = 12V). = 6 V 15,000 pF 22,000 pF 10,000 pF 47,000 pF 1,000 pF 0.1 µF 470 pF 1000 10000 Frequency (kHz) FIGURE 2-21: Supply Current vs. Frequency (V = 6V).  2006-2014 Microchip Technology Inc. DS20001987C-page 9...
  • Page 10: Pin Descriptions

    The MOSFET driver output is a low-impedance, CMOS, push-pull style output capable of driving a capacitive load with 12A peak currents. The MOSFET driver output is capable of withstanding 1.5A peak reverse currents of either polarity.  2006-2014 Microchip Technology Inc. DS20001987C-page 10...
  • Page 11: Applications Information

    Input: 100 kHz, square wave  10 ns RISE FALL Input +18V Output Non-Inverting Driver TC4452 Note: Pinout shown is for the DFN-S, PDIP and SOIC packages. FIGURE 4-1: Switching Time Test Circuits.  2006-2014 Microchip Technology Inc. DS20001987C-page 11...
  • Page 12: Packaging Information

    In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2006-2014 Microchip Technology Inc. DS20001987C-page 12...
  • Page 13  'LPHQVLRQV ' DQG ( GR QRW LQFOXGH PROG IODVK RU SURWUXVLRQV 0ROG IODVK RU SURWUXVLRQV VKDOO QRW H[FHHG  SHU VLGH  'LPHQVLRQLQJ DQG WROHUDQFLQJ SHU $60( <0 %6& %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%  2006-2014 Microchip Technology Inc. DS20001987C-page 13...
  • Page 14  3DFNDJH LV VDZ VLQJXODWHG  'LPHQVLRQLQJ DQG WROHUDQFLQJ SHU $60( <0 %6& %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 5() 5HIHUHQFH 'LPHQVLRQ XVXDOO\ ZLWKRXW WROHUDQFH IRU LQIRUPDWLRQ SXUSRVHV RQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%  2006-2014 Microchip Technology Inc. DS20001987C-page 14...
  • Page 15 TC4451/TC4452 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ  2006-2014 Microchip Technology Inc. DS20001987C-page 15...
  • Page 16: Top View

    For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging NOTE 1 TOP VIEW 8X b1 8X b .010 SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2  2006-2014 Microchip Technology Inc. DS20001987C-page 16...
  • Page 17 Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2  2006-2014 Microchip Technology Inc. DS20001987C-page 17...
  • Page 18 TC4451/TC4452 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2006-2014 Microchip Technology Inc. DS20001987C-page 18...
  • Page 19 TC4451/TC4452 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2006-2014 Microchip Technology Inc. DS20001987C-page 19...
  • Page 20 TC4451/TC4452 /HDG 3ODVWLF 6PDOO 2XWOLQH 2$ ± 1DUURZ  PP %RG\ >62,&@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ  2006-2014 Microchip Technology Inc. DS20001987C-page 20...
  • Page 21 Updated package thermal resistances values in Temperature Characteristics table. Updated package specification drawings in Section 5.0, Packaging Information to show all available drawings. Revision A (February 2006) • Original release of this document.  2006-2014 Microchip Technology Inc. DS20001987C-page 21...
  • Page 22: Product Identification System

    Package Tape & Reel Inverting Range MOSFET Driver, TO-220 package TC4451VOA: 12A High-Speed Device: TC4451: 12A High-Speed MOSFET Driver, Inverting Inverting TC4452: 12A High-Speed MOSFET Driver, Non-Inverting MOSFET Driver, SOIC package Temperature Range: = -40°C to +125°C TC4451VMF: 12A High-Speed...
  • Page 23: Quality Management System Certified By Dnv

    WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
  • Page 24 Tel: 86-29-8833-7252 Tel: 631-435-6000 Fax: 86-29-8833-7256 San Jose, CA China - Xiamen Tel: 408-735-9110 Tel: 86-592-2388138 Canada - Toronto Fax: 86-592-2388130 Tel: 905-673-0699 China - Zhuhai Fax: 905-673-6509 Tel: 86-756-3210040 03/25/14 Fax: 86-756-3210049  2006-2014 Microchip Technology Inc. DS20001987C-page 24...

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