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LANGER EMV-Technik E 1 User Manual

Immunity development system
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User manual
Immunity development system
E 1
Copyright
(C)
Dipl.- Ing. Gunter Langer
Nöthnitzer Hang 31
01728 Bannewitz
10.04.2014
How to make a DUT immune to interference
through measurement and modification at the development stage
2016.08.15. E1 user manual

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  • Page 1 User manual Immunity development system Copyright Dipl.- Ing. Gunter Langer Nöthnitzer Hang 31 01728 Bannewitz 10.04.2014 How to make a DUT immune to interference through measurement and modification at the development stage 2016.08.15. E1 user manual...

  • Page 2: Table Of Contents

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Table of contents: Page Description of the E1 immunity development system Description of the E1 components SGZ 21 pulse density counter / burst generator 2.1.1 SGZ 21 as a disturbance generator 2.1.2 SGZ 21 as a pulse density counter 2.1.3 Preparing the SGZ 21 as a disturbance generator 2.1.4...

  • Page 3: Description Of The E1 Immunity Development System

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de 1 Description of the E1 immunity development system The E1 immunity development system is an advanced tool for the electronics developer to examine the immunity of modules to pulsed interference (burst/ESD) in experiments. The system allows him to analyse the interference immunity in the confined space of a module.

  • Page 4: Description Of The E1 Components

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de 2 Description of the E1 components The E1 immunity development system comprises a SGZ 21 pulse density / burst generator, an S31 optical sensor, an MS 02 magnetic field probe with optical fibre output, magnetic and electric field sources and numerous accessories.

  • Page 5: Sgz 21 Pulse Density Counter / Burst Generator

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de SGZ 21 pulse density counter / burst generator The SGZ 21 (Figure 2) is a burst generator with potential-free pulse generation on the one hand, and on the other hand the SGZ°21 is also a pulse density counter to measure the disturbance pulses of the device under test.

  • Page 6: Sgz 21 As A Pulse Density Counter

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de The path that the disturbance current takes through the device under test can be defined by contacting the device under test accordingly. Disturbance current can thus be injected into defined sections of the module without significantly influencing the environment.

  • Page 7: Preparing The Sgz 21 As A Pulse Density Counter And For Signal Monitoring

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Figure 4: Alligator clips on the left and micro-kleps on the right. Figure 5: SGZ 21 with generator cables plus an alligator clip and a micro-klep. 2.1.4 Preparing the SGZ 21 as a pulse density counter and for signal monitoring The optical fibre has to be inserted into the input up to the limit stop and fastened with the knurled screw (Figure 6).

  • Page 8: Field Sources

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Field sources The field sources are supplied with disturbance current from the SGZ 21 and generate either pulsed magnetic or electric fields depending on the type of field source used. The field intensities of these pulsed fields are comparable to those generated by burst currents on the surface of modules during standard compliance tests.

  • Page 9: Field Sources For Electric Fields

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de BS 04DB is a field source to localise weak points in the layout. It generates a B-field line bundle in the millimetre range (approx. 3 mm). The field beam emerging from the probe's face can be used to scan the surface of circuit boards and resolve magnetically sensitive weak points in small spaces of 3 mm in the field of layout and packaging.
  • Page 10 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de ES 05D is a field source that can be used to determine the sensitivity of an IC pin/conductor or individual components. The E-field source has a narrow line-shaped coupling electrode in its probe head. This design makes it ideal for being placed on conductor runs and small components and their connections, wires and individual SMD components such as resistors and capacitors.

  • Page 11: Measurement Set-Up With Sgz 21 To Inject Burst Current With Field Sources

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de 2.2.3 Measurement set-up with SGZ 21 to inject burst current with field sources The field sources are connected directly to the "Burst output" (Figure 2) of the SGZ 21 via the generator and extension cables. Magnetic field sources are always connected via two poles (Figure 7). Depending on their type, field sources for electric fields are connected via one...

  • Page 12: Principal Mode Of Operation Of The Sensor

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de ICs which have been damaged during the measurement can be easily replaced. Figure 8: S31 sensor with an IC mounted (top) and without IC (bottom). Pulse stretching Which fast transient disturbances the S31 sensor of the E1 can detect depends on the IC mounted. The pulse widths of these disturbances may be in the nanosecond range.

  • Page 13: Magnetic Field Probes

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Magnetic field probes The magnetic field probe is used to measure burst-related magnetic fields in the device under test. The disturbance current i of the SGZ 21 generates a magnetic field B. The magnetic field which penetrates the probe head induces a voltage in the probe head's induction coil.

  • Page 14: The Pulse Density Method

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de 3 The pulse density method The pulse density method is a measuring method which can be used to determine the relative immunity of a device under test. The effect of EMC modifications can be evaluated based on the relative immunity. Furthermore, the pulse density method is the basis for measuring burst-related magnetic fields with MS 02 magnetic field probes and the optional S2 magnetic field measuring system (Chapter 10).
  • Page 15 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de There are two possibilities of creating an immunity level with the S31 sensor in the circuitry of a device under test. Figure 13: Artificial magnetic field immunity level established by mounting the S31 sensor with enamelled copper wire as a simulated conductor run.
  • Page 16 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Figure 15: Natural immunity level by placing the S31 sensor on a signal conductor run of the device under test. An original conductor run of the device under test is used for the same process in Figure 15. The pulse density method can be used with the set-up shown in Figure 13 if high-frequency signal sequences pass through this signal line.

  • Page 17: Prerequisites For Interference Suppression In A Device Under Test

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de 4 Prerequisites for interference suppression in a device under test The immunity values and fault patterns which occurred when the device under test was subjected to disturbances in a standard compliance test are a good basis for working with the E1. The E1 immunity development system can now be used to clarify where exactly the weak points associated with these faults are in the device under test.
  • Page 18 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de current generates magnetic fields on the printed circuit board. These fields produce voltage differences in the ground system of the device under test (printed circuit board) and/or induce voltages in signal line loops. Such voltages in signal line loops can be induced on the circuit board or in connecting systems between the circuit boards.

  • Page 19: Analysis Of The Interference Current Paths

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de The different tools included with the E1 allow four measurement strategies to clarify even the most complex of EMC immunity faults. 5.1 - Analysis of the interference current paths; injection directly into the printed circuit board with the SGZ 21 generator 5.2 - Localisation of weak points in the layout and components using field sources 5.3 - Monitoring of critical logic signals of the printed circuit board...
  • Page 20 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de This requires different variants of coupling disturbance current to the device under test, such as: Disturbance current can be fed through sections of the ground system if the two generator outputs are galvanically connected to the ground system of the device under test. Disturbance current can be fed to ground and returned via V Disturbance current can be fed into the primary side of a transformer or opto-coupler and returned via the secondary side.
  • Page 21 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Since the SGZ 21 has to be connected directly to the printed circuit boards, the housing must be removed as far as possible (Figure 21). Figure 21: Device without housing; the printed circuit boards are connected and functional. The areas between the printed circuit boards are hard to reach in the device under test.
  • Page 22 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Possiblities of injecting:  via the incoming supply to printed circuit board 1  via printed circuit board 1  via the plug-in connector between printed circuit boards 1 and 2  via printed circuit board 2 ...
  • Page 23 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Figure 25: Injection of disturbance current into the device under test via a two-pole galvanic connection to ground. Figure 26: Injection of disturbance current via a two- pole connection and the connector of two modules. Contact is made to ground of each of the modules.

  • Page 24: Basic Principle Of Electric Coupling - Single-Pole Injection Into The Dut

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de 5.1.2 Basic principle of electric coupling – single-pole injection into the device under test The disturbance current couples to the module via the cable and leaves the module by capacitive coupling via the electric field in devices which have only one cable connection or where all of the connected cables are joined in a cable bundle (e.g.
  • Page 25 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Example for case 1: Structural metal parts, shielding, metal housings, etc. are located directly alongside the electronic module in the device under test. Disturbance voltage differences may occur between the metal parts and the ground system if these parts are not solidly connected to the ground system of the electronics (Figure 30).

  • Page 26: Localisation Of Weak Points With Field Sources

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de The E-field source (ES 00 to ES 02) connected to the SGZ 21 is used to simulate the neighbouring metal system which generates the electric field (Figure 31). The size of the E-field source can be selected based on the size of the real metal part.

  • Page 27: Mechanism Of Action Behind Magnetic Field Coupling

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de 5.2.1 Mechanism of action behind magnetic field coupling Magnetic disturbance fields couple to line networks outside the IC. Together with the IC pins, the networks outside the IC form loops in which a voltage is induced. Interference with the IC is via the IC pins and conductors.

  • Page 28: Mechanism Of Action Behind Electric Field Coupling

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de 5.2.2 Mechanism of action behind electric field coupling Electric disturbance fields couple to line networks. The line networks form the coupling electrodes to which the current pulse is capacitively coupled via the electric field. In the simplest and most frequent case, these are conductor runs that have high-resistance current paths on the printed circuit board (Figure 34).

  • Page 29: Practical Procedure For Coupling With Magnetic Field Sources

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Figure 35: The electric field of the field source couples to the conductor loop and feeds a current pulse into this loop). In the process of interference suppression with field sources, the electric field is generated by the field source.
  • Page 30 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Figure 37: The BS 05DU magnetic field source is ideal for applying a magnetic field to small conductor loops. The magnetic field source with its field beam is guided directly across the module's surface for magnetic coupling (Figure 38).
  • Page 31 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de BS 04DB magnetic field source BS 04DB couples a magnetic field to the supply line. The probe is placed directly to the left of the supply line. The magnetic field encircles the supply line in the circuit board.
  • Page 32 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de BS 05DU magnetic field source BS 05DU couples a magnetic field around an SMD capacitor. A voltage is induced in the capacitor to test whether the induced voltage causes malfunctions. BS 05DU couples a magnetic field to a selected conductor run to test whether the induced voltages cause malfunctions.
  • Page 33 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de BS 02 magnetic field source BS 02 couples a magnetic field to large areas of a module to test whether the star-wired ground system has large-scale weak points. BS 02 couples a magnetic field to a U- shaped ground system to test whether the field affects lines located outside the ground system.

  • Page 34: Practical Procedure For Coupling With Electric Field Sources

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de BS 02 magnetic field source BS 02 couples a magnetic field between a connector's shielding connection and signal lines (pig tale) to find out whether the signal input is sensitive to disturbances. Please refer to Chapter 2.2 for tips on how to select the individual probes. The field intensity of a magnetic field source can be adjusted at the SGZ 21's "Intensity"...
  • Page 35 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Smaller electric field sources are used for smaller areas in the mm range. The ES 05D field source or ES 08D probe tip (Figure 40) is used for IC pins, for example. Figure 40: The ES 05D E-field source and ES 08D probe tip are ideal for applying an electric field to small lines, components or IC pins.
  • Page 36 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de ES 00 – 02 E-field sources ES 00 couples an electric field to signal lines of a printed circuit board to test the sensitivity of components or signal lines. The ES 05D E-field source or ES 08D probe tip can then be used to select individual lines or components.
  • Page 37 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de ES 02 E-field sources ES 02 couples an electric field to the housing of an IC. The tip of the E-field source is placed onto the IC housing to examine individual areas. This method can also be used for other components (SMD resistors) or conductor runs.
  • Page 38 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de ES 05D E-field sources ES 05D couples an electric field to an SMD resistor to test the sensitivity of the associated line network and IC inputs. Pull-up or pull-down resistors usually pose a high risk and should thus always be tested.

  • Page 39: Monitoring Of Logic Signals From The Device Under Test

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de The field intensity of an electric field source can be adjusted at the SGZ 21's "Intensity" controller (Figure 2). If the intensity is set very high, the electric field of the field source spreads over a larger area of the module than if the intensity is set to a lower value.

  • Page 40: Use Of The Pulse Density Method To Evaluate Immunity Levels

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de the sensor assignment (Figure 8). Power can be tapped from a back-up capacitor. The S31 sensor may have to be shielded if a sensitive signal has to be monitored. Figure 43: A socket where the S31 sensor can be connected is stuck on the printed circuit board. 5.3.1 Use of the pulse density method to evaluate immunity levels The S31 sensor input has a defined immunity level.

  • Page 41: Monitoring Of Logic Signals From The Device Under Test

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Figure 44: Dimensioning of filters with the pulse density method. Dimensioning of filters is a typical use of the pulse density method (Figure 44): The SGZ 21 is used to inject a disturbance current into the device under test. The S31 sensor establishes the device's immunity level with a line of the device under test and transmits a signal to the SGZ 21's "counter input"...

  • Page 42: Measurement Of Burst-Related Magnetic Fields

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Data traffic on bus systems and/or at interfaces often provides information on the operating state of the device under test. A precise analysis of the data with an oscilloscope or logic analyser is usually too time- consuming and costly.
  • Page 43 LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de Figure 45: Measurement set-up to measure magnetic fields with the MS 02 magnetic field probe. The disturbance current which is fed into the module distributes according to the module's metallic system. The ground system usually accounts for the largest share of the metallic system. This means that the disturbance current will flow via the ground system and the respective magnetic field depends on the form of the ground system.

  • Page 44: Safety Instructions

    Replace any damaged connecting cables before starting the product.  Never leave a Langer EMV-Technik GmbH product unattended whilst this is in operation.  The Langer EMV-Technik GmbH product may only be used for its intended purpose. Any other use is prohibited.

  • Page 45: Technical Specifications

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de The warranty will be forfeited if: - an unauthorized repair is performed on the product, - the product is modified, - the product is not used according to its intended purpose. 8 Technical specifications SGZ 21 pulse density / burst generator: - Dimensions WxDxH:...

  • Page 46: Scope Of Delivery

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de 9 Scope of delivery Item Designation Type Parameter Quantity Pulse density / burst generator SGZ 21 Power supply unit 12 Volt, 200 mA Generator cable Cable 250 mm 0.64 couplings Alligator clips Micro kleps ...

  • Page 47: Optional Components

    LANGER DE-01728 Bannewitz mail@langer-emv.de EMV-Technik www.langer-emv.de 10 Optional components 10.1 S2 magnetic field probe set The probes in the S2 set have a significantly higher resolution than the MS 02. The set also comprises three different exchangeable probe heads which can be used for different tasks (Figure 49) such as measuring pin-related magnetic fields and disturbance currents on ICs and on individual conductor runs (Figure 48).

  • Page 48: Digital Or Analog Optical Signal Transmission

    This document may not be copied, reproduced or electronically processed, either in its entirety or in part, without the prior written permission of Langer EMV-Technik GmbH. The management of Langer EMV-Technik GmbH assumes no liability for damage that may arise from using this printed information.

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