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SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable.
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USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. II.
Telit WE866E4-P module. 1.2 Audience This document is intended for Telit customers, who are integrators, about to implement their applications using our WE866E4-P modules. 1.3 Contact Information, Support For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at: •...
WE866E4-P Module Hardware User Guide 1.4 Text Convention The following table shows the symbol conventions used in this manual for notification and important instructions. Table 1 Symbol Conventions Icon Type Description Provides helpful suggestions needed in understanding Note a feature or references to material not available in the manual.
WE866E4-P Module Hardware User Guide 1.5.2 Related Documents requiring a Non Disclosure Agreement – Authorized Software User Guides – Product firmware 1VV0301487 Rev. 1.2 2018-07-27...
The aim of this document is to describe some hardware solutions useful for developing a product with Telit WE866E4-P module. All the basic functions of a mobile phone is considered and certified for an appropriate hardware solution, common errors and wrong solution that can be avoided are documented.
Chapter 3 Pin Allocation • Pins Out, page 13 • A Pad Layout, page 16 3.1 Pins Out Table 2, page 13 describes the WE866E4-P module pin signal description. Table 2 WE866E4-P Module Pin Signal Description Pins Name Input/Output Function Type Comments USB HS 2.0 COMMUNICATION PORT...
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WE866E4-P Module Hardware User Guide Table 2 WE866E4-P Module Pin Signal Description (Continued) Pins Name Input/Output Function Type Comments F8 I2C_SDA Input/Output Data CMOS VIO IO_6 G8 I2C_SCL Input/Output Clock CMOS VIO GPIO_7 Analog Interface A8 ADC_IN1 Input 12 BITS 1Mhz...
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WE866E4-P Module Hardware User Guide Table 2 WE866E4-P Module Pin Signal Description (Continued) Pins Name Input/Output Function Type Comments Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Reversed RESERVED RESERVED RESERVED RESERVED 1VV0301487 Rev. 1.2...
WE866E4-P Module Hardware User Guide 3.2 A Pad Layout The following representation shows the top view of the Pad layout: VDD_BLE ANT_1 VDD_WLAN GPIO_1 GPIO_2 UART0_CTS UART1_RX ANT_2 WAKEUP BT_PRIORITY UART0_TXD UART0_RTS UART_TX USB_VDD GPIO_3 UART0_RX I2S_SYNC I2S_SCK USB_DP WiFi_EN...
• Power Consumption, page 17 • General Design Rules, page 18 4.1 Power Supply Requirements Table 3, page 17 provide the Power supply requirements of WE866E4-P module. Table 3 Power Supply Requirements Power Supply Minimum Typical Maximum Absolute Maximum to avoid permanent damage at any power supply -0.3V...
WE866E4-P Module Hardware User Guide Table 4 Power Consumption Power Consumption Typical DTIM=1 TBD mA DTIM=3 TBD μA DTIM=10 TBD μA 4.3 General Design Rules It is recommended to provide a 10μF capacitors right next to the VDD_WLAN and BT pins, and 2.2μF at each of the other power supply pins like VIO.
WE866E4-P Module Hardware User Guide 5.2 Power Up/Down Sequence The BT_EN is the main power enable pin including the WIFI_EN. All supplies should be stable for a minimum of 10 μs before BT_EN is de-asserted (i.e, greater than VIL for VIO).
Two HS UART interfaces are present, one with dedicated pin out and second sharing the pins with the SDIO interface pins. Table 7, page 21 describes the High Speed UART Configuration for WE866E4-P. Table 7 High Speed UART Configuration Property...
WE866E4-P Module Hardware User Guide 5.5.3 SDIO One SDIO Slave interface. – Compliant to SDIO v2.0 specification – Interface clock frequency up to 48 MHz – Data transfer modes: 4-bit SDIO, 1-bit SDIO, SPI 5.5.4 SPI The two general-purpose SPI interfaces are one configured as dedicated master and the other configured as master/slave pin-mux with SDIO interface pins.
WE866E4-P Module Hardware User Guide 6.2 TX Output Power 6.2.1 Wi-Fi 6.2.1.1 For 2.4GHz Table 11, page 24 lists the Wi-Fi RF Frequency Transmission for 2.4GHz. Table 11 Wi-Fi RF Frequency Transmission for 2.4GHZ 2.4 GHz: Transmit power with IEEE 802.11 EVM and spectral mask...
WE866E4-P Module Hardware User Guide 6.2.1.2 For 5GHz Table 12, page 25 lists the Wi-Fi RF Frequency Transmission for 5GHz. Table 12 Wi-Fi RF Frequency Transmission for 5GHZ 2.4 GHz: Transmit power with IEEE 802.11 EVM and spectral mask Standard...
WE866E4-P Module Hardware User Guide 6.2.2 Bluetooth Table 13, page 26 lists the Bluetooth Transmission. Table 13 Bluetooth Transmission TX Characteristic Rate Type Units LE 1M Max RF Output Power LE 2M Note: 1).Measurement data is at chip output, 25°C, 1.8V IO. 2).When Tx power higher than 4dBm, an external BPF is required for out of band emis- sion.
Since the antenna impedance is required to be tuned to 50Ω. It is recommended to foresee a PI matching network between the WE866E4-P module and the antenna during first prototyping. If not, a series 0Ω-resistor can be used, leaving the two shunt components unpopulated.
WE866E4-P Module Hardware User Guide 6.4.1 PCB Design Guidelines The WE866E4-P module provides a 50Ω antenna pad, which is routed to the antenna connector (or the integrated antenna) by means of a transmission line. It is important that the impedance of this line is controlled to 50Ω. The line should be as short as possible with a constant cross section and without abrupt curves.
WE866E4-P Module Hardware User Guide 6.4.2 PCB Guidelines in case of FCC Certification 6.5 BlueTooth Antenna Requirements 6.5.1 PCB Design Guidelines 6.5.2 PCB Guidelines in case of FCC Certification 1VV0301487 Rev. 1.2 2018-07-27...
WE866E4-P Module Hardware User Guide Chapter 7 Audio Section • Electrical Characteristics, page 31 • Codec Examples, page 31 7.1 Electrical Characteristics The audio interface is only digital, through the I2S.The voltage of this interface pins have same electrical characteristics as for digital pins and are related to the power bank VIO.
WE866E4-P Module Hardware User Guide Chapter 8 Mechanical Design • Drawing, page 33 8.1 Drawing Figure 3, page 33 shows the Mechanical Design of the module. Figure 3 Mechanical Design 1VV0301487 Rev. 1.2 2018-07-27...
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WE866E4-P Module Hardware User Guide Figure 4, page 34 shows the Top View of WE866E4-P module. Figure 4 Top View of WE866E4-P Module 1VV0301487 Rev. 1.2 2018-07-27...
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WE866E4-P Module Hardware User Guide Figure 6, page 36 shows the Pad A details. Figure 6 Pad A Details Figure 7, page 36 shows the Pad details. Figure 7 Pad Details 1VV0301487 Rev. 1.2 2018-07-27...
WE866E4-P Module Hardware User Guide Figure 8, page 37 shows the top view of Solder resist pattern. Figure 8 Solder Resist Pattern-Top View 9.2 PCB Pad Design Non-Solder Mask Defined (NSMD) type is recommended for the solder pads on the PCB.
WE866E4-P Module Hardware User Guide Figure 9 Solder Pads on PCB 9.3 PCB Pad Dimension It is not recommended to place or micro-via not covered by solder resist in an area of 0.3 mm around the pads unless it carries the same signal of the pad itself. Holes in the pad are allowed only for blind holes and not for through holes.
WE866E4-P Module Hardware User Guide 9.3.1 Recommendations for PCB Pad Surface Table 17, page 39 provides the recommendation for PCB Pad Surface. Table 17 Recommendation for PCB Pad Surface Finish Layer Thickness Properties (um) Good solderability Electro-less 3 - 7/ 0.03 - 0.15...
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WE866E4-P Module Hardware User Guide Figure 11 Solder Re-flow Profile Table 18, page 40 provides the Solder re-flow profile features and its Pb-Free Assembly. Table 18 Solder Re-flow Parameters Profile Features Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max...
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WE866E4-P Module Hardware User Guide NOTE: All temperatures refer to topside of the package, measured on the package body surface. CAUTION! WE866E4 module withstands one re-flow process only. 1VV0301487 Rev. 1.2 2018-07-27...
Moisture Sensitivity, page 46 10.1 Tray The WE866E4-P modules are packaged in trays of 50 pieces each where small quantities are required (i.e. for test and evaluation purposes). Trays are not designed to be used in SMT processes for pick and place handling.
10.3 Moisture Sensitivity According to IPC/JEDEC J-STD-020 standards the moisture sensitivity level of the WE866E4-P module Product is “3”. To use such a component the customer has to take care of the following conditions: a. The shelf life of the Product inside the dry bag is 12 months - from the seal date of the bag, when stored in a non-condensing atmospheric environment of <...
WE866E4-P Module Hardware User Guide Chapter 12 Safety Recommendation • Read Carefully, page 49 12.1 Read Carefully Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: •...
WE866E4-P Module Hardware User Guide Chapter 13 Acronyms Telit Technical Support Centre TTSC Universal Serial Bus High Speed Data Terminal Equipment Universal Mobile Telecommunication System UMTS Wide band Code Division Multiple Access WCDMA High Speed Downlink Packet Access HSDPA High Speed Uplink Packet Access...
WE866E4-P Module Hardware User Guide Document History Revision Date Changes January 2018 Initial Release. Added Figure 4Top View of WE866E4-P March 2018 Module, page 34 May 2018 Watermarked “PRELIMINARY”. Updates to Figure 3, page Figure 4, July 2018 page 34 1VV0301487 Rev.
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