Pattern Recommendation; Solder And Resist Mask - Panasonic PAN9420 Design Manual



3.4 Pattern Recommendation

Pad Type 1 = 4 x 1.30mm x 1.30mm
Pad Type 2 = 38 x 0.80mm x 1.00mm
Pad Type 3 = 30 x 0.80mm x 0.80mm
Pad Type 4 = 4 x 2.40mm x 2.40mm
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38
39
40
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1
PCB footprint recommendation
Pattern land  same land dimension as module pad type
Resist mask  50µm bigger land size as pad type to each direction

3.5 Solder and Resist Mask

The following requirements must be met:

The Resist Mask should be circumferential 50 µm bigger than the pad size
Pattern).

The Solder Mask apertures should have the diameter as the pads
they are separated in two parts with the shown distance and a shifting.
Design Guide Rev. 1.0
Top View
35 34 33 32 31 30
F1 F2 F3 F4
E1 E2 E3 E4
D1 D2 D3 D4
C1 C2 C3 C4
B1 B2 B3 B4
A1 A2 A3 A4
2 3 4 5 6 7
It is recommended to extend
the ground plane for module
to get best RF characteristic
and heat rejection condition.
29 28 27 26 25 24
F5
E5
GND GND
THERMO THERMO
D5
C5
GND GND
THERMO THERMO
B5
A5
8 9 10 11 12 13
29,00 mm
PAN9420 Wi-Fi Module
3 PAN9420 Module
Mother PCB edge
Note:
If the module is used with
the internal ceramic chip
antenna, the blue marked
area should be used to
place a ground plane.
23
22
21
3,10 mm
20
Note:
19
If the module is used with
the internal ceramic chip
18 antenna the gray marked
area of module antenna
area ( 5,0 x 3,1 mm
17
the right side of mother
PCB edge are restricted.
Means no ground plane,
16
no signal pattern and in
general no metal should
be placed.
15
14
Pin 16 - RF
50 Ohm RF pad for the
connection to an external
antenna
Mother PCB edge
( 3.3 Land
( 3.3 Land
2
) and
Pattern);
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