Prompt; Rework Temperature Curve To Set Examples - ACHI IR6500 User Manual

1 Installed the equipment in stable work platform to use where the air mobility should be small
as possible .Avoid it closing to air conditioners, fans and the other outlet.
2 IR6500 Rework Station sensor Direct contact with motherboard So Temperature
®
ACHI
display is Actual temperature
3 In order to avoid damage to the motherboard capacitor SO use insulation tape please
Maintenance completed ,then Removal of insulation tape
4 After removal of BGA chip
See BGA chip tin completely liquefied, Then To move the BGA chip So as to avoid Bonding
Pad Damage
5 BGA chips should be subject to settlement, floating state Prohibited in all solder ball did not
fully liquefied, by force if removal of chips, so as to avoid pad off, chip or motherboard
scrap!
6 To improve success rate of Rework , PCB and chips need drying and processing in principle
PCB board or chip moist heat process will occur in the burst phenomenon, the Rework
process may hear the blasting sound of a minor According to actual situation Please
self-control.
7 PCB board heating time is too long or repeated several times the surface heating will lead to
discoloration.
8
Users from modifying temperature parameters Please use scrap PCB tested Heating whole
time about 10 seconds before the end of solder balls should be fully liquefied f the
liquefaction advanced or delayed,
So as to avoid heat damage to chips or low-temperature sealing-off
9 The factory equipped with two sets of programmable temperature control table used
parameters:
371 371 371 371        / H D G 5 H Z R U N / H D G 5 H Z R U N / H D G 5 H Z R U N / H D G 5 H Z R U N
371 371 371 371        / H D G / H D G / H D G / H D G     ) U H H 5 H Z R U N ) U H H 5 H Z R U N ) U H H 5 H Z R U N ) U H H 5 H Z R U N

Rework temperature curve to set examples

r1 1
r2 1
r3 1
r4 END
r1 1
r2 1
r3 1
r4 END

Prompt

PCB Bonding Pad Need to clean up
Should be regulating up/down the temperature setting.
/ H D G / H D G / H D G / H D G 6 Q   3E   6 Q   3E   6 Q   3E   6 Q   3E  
371 371 371 371       
L1 85
L2 150
L3 190
Hb 230
/ H D G / H D G / H D G / H D G     ) U H H ) U H H ) U H H ) U H H
6 Q    $ J  & X    6 Q    $ J  & X   
6 Q    $ J  & X    6 Q    $ J  & X   
371 371 371 371       
L1 85
L2 140
L3 220
Hb 230
18
So as to avoid short-circuit
Avoid cold solder joint
d1 70
d2 35
d3 50
d1 80
d2 60
d3 65