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Functional description
OVERVIEW
FEATURES
Interfaces
BLOCK DIAGRAM
POWER
RF
FCC APPROVED ANTENNAS
PERIPHERALS AND GPIO
RGB LED, SETUP AND RESET BUTTON
JTAG AND SWD
EXTERNAL COEXISTENCE INTERFACE
Memory Map
STM32F205RGY6 FLASH LAYOUT OVERVIEW
DCT LAYOUT
MEMORY MAP (COMMON)
MEMORY MAP (MODULAR FIRMWARE - DEFAULT)
MEMORY MAP (MONOLITHIC FIRMWARE - OPTIONAL)
Pin and button definition
PIN MARKINGS
PIN DESCRIPTION
PINOUT DIAGRAM
COMPLETE P1 MODULE PIN LISTING
Technical specification
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
WI-FI SPECIFICATIONS
I/O CHARACTERISTICS
Mechanical specifications
OVERALL DIMENSIONS
P1 MODULE DIMENSIONS
P1 MODULE RECOMMENDED PCB LAND PATTERN
P1 Reference Design Schematic
SCHEMATIC - USB
SCHEMATIC - POWER
SCHEMATIC - USER I/O
SCHEMATIC - P1 WI-FI MODULE
P1 Reference Design Layout
P1 REFERENCE DESIGN TOP LAYER (GTL)
P1 REFERENCE DESIGN BOTTOM LAYER (GBL)
Recommended solder reflow profile
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Summary of Contents for Particle P1

  • Page 1 Functional description OVERVIEW FEATURES Interfaces BLOCK DIAGRAM POWER FCC APPROVED ANTENNAS PERIPHERALS AND GPIO RGB LED, SETUP AND RESET BUTTON JTAG AND SWD EXTERNAL COEXISTENCE INTERFACE Memory Map STM32F205RGY6 FLASH LAYOUT OVERVIEW DCT LAYOUT MEMORY MAP (COMMON) MEMORY MAP (MODULAR FIRMWARE - DEFAULT) MEMORY MAP (MONOLITHIC FIRMWARE - OPTIONAL) Pin and button definition PIN MARKINGS PIN DESCRIPTION PINOUT DIAGRAM COMPLETE P1 MODULE PIN LISTING Technical specification ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS WI-FI SPECIFICATIONS I/O CHARACTERISTICS Mechanical specifications OVERALL DIMENSIONS P1 MODULE DIMENSIONS P1 MODULE RECOMMENDED PCB LAND PATTERN P1 Reference Design Schematic SCHEMATIC - USB SCHEMATIC - POWER SCHEMATIC - USER I/O SCHEMATIC - P1 WI-FI MODULE P1 Reference Design Layout P1 REFERENCE DESIGN TOP LAYER (GTL) P1 REFERENCE DESIGN BOTTOM LAYER (GBL) Recommended solder reflow profile...
  • Page 2: Table Of Contents

    Ordering information Qualification and approvals Product handling TAPE AND REEL INFO MOISTURE SENSITIVITY LEVELS ESD PRECAUTIONS Default settings Glossary FCC IC CE Warnings and End Product Labeling Requirements Revision history Known Errata Contact...
  • Page 3: Functional Description

    Functional description OVERVIEW The P1 is Particle's tiny Wi-Fi module that contains both the Broadcom Wi-Fi chip and a reprogrammable STM32F205RGY6 32-bit ARM Cortex-M3 microcontroller. The P1 comes preloaded with Particle firmware libraries, just like our dev kits, and it's designed to simplify your transition from prototype to production. The P1 is the PØ's big brother; it's a bit bigger and a tad more expensive, but it includes some extra flash and an antenna and u.FL connector on board. Particle provides free access to Particle Cloud for prototyping. Paid tiers of Particle Cloud start when you create a product with more than 25 devices. FEATURES Particle P1 Wi-Fi module Broadcom BCM43362 Wi-Fi chip 802.11b/g/n Wi-Fi STM32F205RGY6 120Mhz ARM Cortex M3 1MB flash, 128KB RAM 1MB external SPI flash (MX25L8006E) Integrated PCB antenna Integrated u.FL connector for external antenna Integrated RF switch 25 Mixed-signal GPIO and advanced peripherals Open source design Real-time operating system (FreeRTOS) Soft AP setup FCC, CE and IC certified...
  • Page 4: Interfaces

    Interfaces BLOCK DIAGRAM POWER Power to the P1 is supplied via 3 different inputs: VBAT_WL (pin 2 & 3), VDDIO_3V3_WL (pin 5), VDD_3V3 (pin 26 & 27). Optionally +3.3V may be supplied to VBAT_MICRO (pin 38) for data retention in low power sleep modes. Each of these inputs also requires a 0.1uF and 10uF ceramic decoupling capacitor, located as close as possible to the pin (see Fig 1). The voltage should be regulated between 3.0VDC and 3.6VDC. (Please refer to Absolute Maximum Ratings for more info). Typical average current consumption is 80mA with 5V @ input of the recommended SMPS power supply with Wi-Fi on. Deep sleep quiescent current is typically 80uA (Please refer to Recommended Operating Conditions for more info). When powering the P1 make sure the power supply can handle 600mA continuous. If a lesser power supply is provided, peak currents drawn from the P1 when transmitting and receiving will result in voltage sag at the input which may cause a system brown out or intermittent operation. Warning: When powering the P1 from long wires, care should be taken to protect against damaging voltage transients if using the same regulator as is used on the Photon. From the Richtek datasheet: When a ceramic capacitor is used at the input and the power is supplied by a wall adapter through long wires, a load step at the output can induce ringing at the input, VIN. At best, this ringing can couple to the output and be mistaken as loop instability. At worst, a sudden inrush of current through the long wires can potentially cause a voltage spike at VIN large enough to damage the part. To avoid these voltage spikes, keep input wiring as short as possible. If long wires are unavoidable, it is advisable to add a 5.1V zener diode or similar transient suppression device from VIN to GND. Another technique is adding more capacitance to the input using an electrolytic capacitor. Please refer to AN-88 by Linear for a good discussion on this topic.
  • Page 5: Fcc Approved Antennas

    Fig. 1 Recommended power connections with decoupling capacitors. The RF section of the P1 includes an on-board PCB trace antenna and a u.FL connector which allows the user to connect an external antenna. These two antenna outputs are selectable via a user API, made possible by an integrated RF switch. The default selected antenna will be the PCB antenna. The area surrounding the PCB antenna on the carrier PCB should be free of ground planes and signal traces for maximum Wi-Fi performance. FCC APPROVED ANTENNAS Antenna Type Manufacturer MFG. Part # Gain Dipole antenna LumenRadio 104-1001 2.15dBi PCB Antenna Included...
  • Page 6: Peripherals And Gpio

    PERIPHERALS AND GPIO The P1 module has ton of capability in a super small footprint, with analog, digital and communication interfaces. Note: P1 pin names will be preserved as they are named in the USI datasheet, however for the scope of this datasheet we will also refer to them as their Photon and code equivalents, i.e. D7 instead of MICRO_JTAG_TMS and A2 instead of MICRO_GPIO_13. This will help to simplify descriptions, while providing a quick reference for code that can be written for the P1 such as int value = analogRead(A2); Peripheral Input(I) / Type Output(O) Digital FT/3V3 Analog (ADC) Analog (DAC) Notes: FT = 5.0V tolerant pins. All pins except A3 and DAC are 5V tolerant (when not in analog mode). If used as a 5V input the pull-up/pull-down resistor must be disabled. 3V3 = 3.3V max pins. PWM is available on D0, D1, D2, D3, A4, A5, WKP, RX, TX, P1S0, P1S1, P1S6 with a caveat: PWM timer peripheral is duplicated on two pins (A5/D2) and (A4/D3) for 10 total independent PWM outputs. For example: PWM may be used on A5 while D2 is used as a GPIO, or D2 as a PWM while A5 is used as an analog input. However A5 and D2 cannot be used as independently controlled PWM outputs at the same time. P1S6 requires System Feature Wi-Fi Powersave Clock to be disabled. See System Features in Firmware Reference. Technically these pins are 5.0V tolerant, but since you wouldn't operate them with a 5.0V transceiver it's proper to classify them as 3.3V. RGB LED, SETUP AND RESET BUTTON When using the P1 module, it is very important to remember that your device must have an RGB LED to show the user the connectivity status. Also required is a SETUP and RESET button to enter various Device Modes. By default the RGB LED outputs are configured for a Common Anode type of LED. These components should be wired according to the P1 Reference Design - User I/O. RGB pins may be accessed in code as: RGBR, RGBG and RGBB.
  • Page 7: Jtag And Swd

    JTAG AND SWD Pin D3 through D7 are JTAG interface pins. These can be used to reprogram your P1 bootloader or user firmware image with standard JTAG tools such as the ST-Link v2, J-Link, R-Link, OLIMEX ARM- USB-TINI-H, and also the FTDI-based Particle JTAG Programmer. If you are short on available pins, you may also use SWD mode which requires less connections. Default Photon STM32F205RGY6 P1 Pin JTAG P1 Pin Name Internal JTAG_TMS SWD/SWDIO PA13 MICRO_JTAG_TMS ~40k pull-up JTAG_TCK CLK/SWCLK PA14 MICRO_JTAG_TCK ~40k pull-down JTAG_TDI PA15 MICRO_JTAG_TDI ~40k pull-up JTAG_TDO MICRO_JTAG_TDO Floating JTAG_TRST MICRO_JTAG_TRSTN ~40k pull-up Power Power Ground Ground Reset Reset Notes: Default state after reset for a short period of time before these pins are restored to GPIO (if JTAG debugging is not required, i.e.
  • Page 8: External Coexistence Interface

    EXTERNAL COEXISTENCE INTERFACE The P1 supports coexistence with Bluetooth and other external radios via three pins available on the P1 module. When two radios occupying the same frequency band are used in the same system, such as Wi-Fi and Bluetooth, a coexistence interface can be used to coordinate transmit activity, to ensure optimal performance by arbitrating conflicts between the two radios. P1 Pin P1 Pin Name I/O Description BTCX_RF_ACTIVE Coexistence signal: Bluetooth is active BTCX_STATUS Coexistence signal: Bluetooth priority status and TX/RX direction BTCX_TXCONF Output giving Bluetooth permission to TX ​ When these pins are programmed to be used as a Bluetooth coexistence interface, they're set as high impedance on power up and reset.
  • Page 9: Memory Map

    Memory Map STM32F205RGY6 FLASH LAYOUT OVERVIEW Bootloader (16 KB) DCT1 (16 KB), stores Wi-Fi credentials, keys, mfg info, system flags, etc.. DCT2 (16 KB), swap area for DCT1 EEPROM emulation bank 1 (16 KB) EEPROM emulation bank 2 (64 KB) System firmware (512 KB) [256 KB Wi-Fi/comms + 256 KB hal/platform/services] Factory backup, OTA backup and user application (384 KB) [3 x 128 KB] DCT LAYOUT The DCT area of flash memory has been mapped to a separate DFU media device so that we can incrementally update the application data. This allows one item (say, server public key) to be updated without erasing the other items. DCT layout in release/stable found here in firmware. Region Offset Size system flags version device private key 1216 device public key 1250 ip config 1634 feature flags 1754 country code 1758 claim code 1762 claimed 1825 ssid prefix 1826 device code 1852 version string 1858 dns resolve 1890...
  • Page 10: Memory Map (Common)

    3663 led theme 3759 reserved2 3823 Note: Writing 0xFF to offset 34 (DEFAULT) or 3106 (ALTERNATE) will cause the device to re-generate a new private key on the next boot. Alternate keys are currently unsupported on the P1 but are used on the Electron as UDP/ECC keys. You should not need to use this feature unless your keys are corrupted. // Regenerate Default Keys echo -e "\xFF" > fillbyte && dfu-util -d 2b04:d00a -a 1 -s 34 -D fillbyte // Regenerate Alternate Keys echo -e "\xFF" > fillbyte && dfu-util -d 2b04:d00a -a 1 -s 3106 -D fillbyte MEMORY MAP (COMMON) Region Start Address End Address Size Bootloader 0x8000000 0x8004000 16 KB DCT1 0x8004000 0x8008000 16 KB DCT2 0x8008000 0x800C000 16 KB EEPROM1 0x800C000 0x8010000 16 KB EEPROM2 0x8010000 0x8020000 64 KB...
  • Page 11: Pin And Button Definition

    Pin and button definition PIN MARKINGS PIN DESCRIPTION Description Active-low reset input. On-board circuitry contains a 1k ohm pull-up resistor between RST and 3V3, and 0.1uF capacitor between RST and GND. VBAT Supply to the internal RTC, backup registers and SRAM when 3V3 not present (1.65 to 3.6VDC). This pin represents the regulated +3.3V DC power to the P1 module. In reality, +3.3V must be supplied to 3 different inputs: VBAT_WL (pin 2 & 3), VDDIO_3V3_WL (pin 5), VDD_3V3 (pin 26 & 27). Optionally +3.3V may be supplied to VBAT_MICRO (pin 38) for data retention in low power sleep modes. Each of these inputs also requires a 0.1uF and 10uF ceramic decoupling capacitor, located as close as possible to the pin. Primarily used as UART TX, but can also be used as a digital GPIO or PWM Primarily used as UART RX, but can also be used as a digital GPIO or PWM Active-high wakeup pin, wakes the module from sleep/standby modes. When not used as a WAKEUP, this pin can also be used as a digital GPIO, ADC input or PWM . Can be referred to as when used as an ADC. 12-bit Digital-to-Analog (D/A) output (0-4095), referred to as or DAC1 in software. Can also be used as a digital GPIO or ADC. Can be referred to as when used as an ADC. A3 is a second DAC output used as DAC2 in software. 12-bit Analog-to-Digital (A/D) inputs (0-4095), and also digital GPIOs. and are code convenience mappings, which means pins are not actually labeled as such but you may use code like A0~A7 analogRead(A7) maps to the DAC pin and maps to the WKP pin. A4,A5,A7 may also be used as a PWM output. D0~D7 Digital only GPIO pins. D0~D3 may also be used as a PWM output.
  • Page 12: Pinout Diagram

    Can be used as a digital GPIO or PWM output. Must disable Wi-Fi Powersave Clock first, see System P1S6 Features in Firmware Reference. Notes: PWM is available on D0, D1, D2, D3, A4, A5, WKP, RX, TX, P1S0, P1S1, P1S6 with a caveat: PWM timer peripheral is duplicated on two pins (A5/D2) and (A4/D3) for 10 total independent PWM outputs. For example: PWM may be used on A5 while D2 is used as a GPIO, or D2 as a PWM while A5 is used as an analog input. However A5 and D2 cannot be used as independently controlled PWM outputs at the same time. P1S6 requires System Feature Wi-Fi Powersave Clock to be disabled. See System Features in Firmware Reference. PINOUT DIAGRAM...
  • Page 13: Complete P1 Module Pin Listing

    You can download a high resolution pinout diagram in a PDF version here. Notes: Connected to MCO1 by default, outputs 32kHz clock for WICED powersave mode. See System Features in the Firmware Reference to disable the Wi-Fi Powersave Clock and allow usage of this pin. MICRO_SPI1_SS is only for reference as a P1 module pin name. It is technically speaking the STM32 pin PA4 which is the SS pin in an hardware SPI driven sense, however in the Particle API SPI SS is only user controlled as a GPIO. The hardware SS pin is not implemented. The default SS pin for the Particle SPI API is A2 (STM32 pin PC2), but any GPIO can be used for this function with SPI.begin(pin). COMPLETE P1 MODULE PIN LISTING Type / STM32F205RGY6 Pin # P1 Pin Name Port Description Ground VBAT_WL +3.3V Ground VDDIO_3V3_WL +3.3V Ground WL_REG_ON BCM43362 Debugging Pin 8~12 Ground Ground WL_JTAG_TDI DEBUG BCM43362 Debugging Pin WL_JTAG_TCK DEBUG BCM43362 Debugging Pin WL_JTAG_TRSTN DEBUG BCM43362 Debugging Pin WL_JTAG_TMS DEBUG...
  • Page 14 Ground Supply to the internal RTC, backup registers and SRAM when 3V3 VBAT_MICRO not present (1.65 to 3.6VDC) Ground MICRO_GPIO_1 P1S0 MICRO_GPIO_2 P1S1 MICRO_GPIO_3 P1S2 MICRO_GPIO_5 MICRO_GPIO_6 P1S3 MICRO_GPIO_7 D2 (I2S SD) MICRO_GPIO_8 /SETUP (I2S MCK) MICRO_GPIO_9 PC13 P1S4 MICRO_GPIO_12 P1S5 MICRO_GPIO_13 A2 (DEFAULT SPI SS) MICRO_GPIO_14 MICRO_JTAG_TRSTN MICRO_JTAG_TDO D4 (I2S SCK) MICRO_JTAG_TDI PA15 D5 (I2S WS) MICRO_JTAG_TMS PA13 MICRO_JTAG_TCK PA14 BTCX_STATUS Coexistence signal: Bluetooth status and TX/RX direction BTCX_RF_ACTIVE Coexistence signal: Bluetooth is active BTCX_TXCONF Output giving Bluetooth permission to TX Ground...
  • Page 15: Technical Specification

    Technical specification ABSOLUTE MAXIMUM RATINGS Parameter Symbol Min Typ Max Unit Supply Input Voltage +3.6 3V3-MAX Storage Temperature °C ESD Susceptibility HBM (Human Body Mode) V RECOMMENDED OPERATING CONDITIONS Parameter Symbol Unit Supply Input Voltage +3.0 +3.3 +3.6 Supply Input Current (VBAT_WL) VBAT_WL Supply Input Current (VDDIO_3V3_WL) VDDIO_3V3_WL Supply Input Current (VDD_3V3) VDD_3V3 Supply Input Voltage +1.65 +3.6 VBAT_MICRO Supply Input Current (VBAT_MICRO) VBAT_MICRO Operating Current (Wi-Fi on) 3V3 avg Operating Current (Wi-Fi on) 3V3 pk Operating Current (Wi-Fi on, w/powersave) 3V3 avg Operating Current (Wi-Fi off) 3V3 avg...
  • Page 16: I/O Characteristics

    Modulation DSSS, CCK, OFDM, BPSK, QPSK, 16QAM, 64QAM P1 module Wi-Fi output power Typ. Tol. Unit RF Average Output Power, 802.11b CCK Mode Avail. upon request +/- 1.5 dBm +/- 1.5 dBm RF Average Output Power, 802.11g OFDM Mode 6M +/- 1.5 dBm +/- 1.5 dBm RF Average Output Power, 802.11n OFDM Mode MCS0 +/- 1.5 dBm MCS7 +/- 1.5 dBm I/O CHARACTERISTICS These specifications are based on the STM32F205RGY6 datasheet, with reference to Photon pin nomenclature. Parameter Symbol Conditions Unit 0.28*(V Standard I/O input low level voltage -0.3 2)+0.8 0.32*(V I/O FT input low level voltage -0.3 2)+0.75...
  • Page 17 With a minimum of 100mV. Leakage could be higher than max. if negative current is injected on adjacent pins. Pull-up and pull-down resistors are designed with a true resistance in series with switchable PMOS/NMOS. This PMOS/NMOS contribution to the series resistance is minimum (~10% order).
  • Page 18: Mechanical Specifications

    Mechanical specifications OVERALL DIMENSIONS P1 module dimensions are: 0.787"(28mm) (W) x 1.102"(20mm) (L) x 0.0787"(2.0mm) (H) +/-0.0039" (0.1mm) (includes metal shielding) Actual size (so tiny!) P1 MODULE DIMENSIONS These are the physical dimensions of the P1 module itself, including all pins:...
  • Page 19: P1 Module Recommended Pcb Land Pattern

    P1 MODULE RECOMMENDED PCB LAND PATTERN The P1 can be mounted directly on a carrier PCB with following PCB land pattern: A P1 part for EAGLE can be found in the Particle EAGLE library...
  • Page 20: P1 Reference Design Schematic

    P1 Reference Design Schematic SCHEMATIC - USB SCHEMATIC - POWER SCHEMATIC - USER I/O SCHEMATIC - P1 WI-FI MODULE...
  • Page 21: P1 Reference Design Layout

    P1 Reference Design Layout P1 REFERENCE DESIGN TOP LAYER (GTL) To be added. P1 REFERENCE DESIGN BOTTOM LAYER (GBL) To be added.
  • Page 22: Recommended Solder Reflow Profile

    Recommended solder reflow profile Phase Temperatures and Rates A-B. Ambient~150°C, Heating rate: < 3°C/s B-C. 150~200°C, soak time: 60~120 s C-D. 200~245°C, Heating rate: < 3°C/s D. Peak temp.: 235~245°C, Time above 220°C: 40~90 s D-E. 245~220°C, Cooling rate: < 1°C/s...
  • Page 23: Ordering Information

    Ordering information P1 modules are available from store.particle.io as cut tape in quantities of 10 each.
  • Page 24: Qualification And Approvals

    Qualification and approvals RoHS FCC ID: COFWMNBM11 IC: 10293A-WMNBM11...
  • Page 25: Product Handling

    Product handling TAPE AND REEL INFO MOISTURE SENSITIVITY LEVELS The Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions required. The P1 module is rated level 3. In general, this precaution applies for Photons without headers. When reflowing a P1 directly onto an application PCB, increased moisture levels prior to reflow can damage sensitive electronics on the P1. A bake process to reduce moisture may be required. For more information regarding moisture sensitivity levels, labeling, storage and drying see the MSL standard see IPC/JEDEC J-STD-020 (can be downloaded from www.jedec.org). ESD PRECAUTIONS The P1 module contains highly sensitive electronic circuitry and is an Electrostatic Sensitive Device (ESD). Handling a P1 module without proper ESD protection may destroy or damage it permanently. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates P1 modules. ESD precautions should be implemented on the application board where the P1 module is mounted. Failure to observe these precautions can result in severe damage to the P1 module!
  • Page 26: Default Settings

    Default settings The P1 module comes pre-programmed with a bootloader and a user application called Tinker. This application works with an iOS and Android app also named Tinker that allows you to very easily toggle digital pins, take analog and digital readings and drive variable PWM outputs. The bootloader allows you to easily update the user application via several different methods, USB, OTA, Serial Y-Modem, and also internally via the Factory Reset procedure. All of these methods have multiple tools associated with them as well. You may use the online Web IDE Particle Build to code, compile and flash a user application OTA (Over The Air). Particle Dev is a local tool that uses the Cloud to compile and flash OTA as well. There is also a package for Particle Dev that allows for Cloud compiling and local flashing Spark DFU-UTIL via DFU over USB. This requires to be installed on your system. 'dfu-util' can also be used dfu-util with Particle CLI for Cloud compiling and local flashing via the command line. Finally the lowest level of development is available via the GNU GCC tool chain for ARM, which offers local compile and flash via dfu-util. This gives the user complete control of all source code and flashing methods. This is an extensive list, however not exhaustive.
  • Page 27: Glossary

    Glossary Radio Frequency Surface Mount Technology (often associated with SMD which is a surface mount device). Access Point Universal Serial Bus Quiescent current Current consumed in the deepest sleep state Five-tolerant; Refers to a pin being tolerant to 5V. +3.3V; The regulated +3.3V supply rail. Also used to note a pin is only 3.3V tolerant. Real Time Clock Over The Air; describing how firmware is transferred to the device.
  • Page 28: Fcc Ic Ce Warnings And End Product Labeling Requirements

    FCC IC CE Warnings and End Product Labeling Requirements Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. This End equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following: Contains FCC ID: 2AEMI-PHOTON Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
  • Page 29 Canada Statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: 1. l’appareil ne doit pas produire de brouillage; 2. l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement. Caution Exposure: This device meets the exemption from the routine evaluation limits in section 2.5 of RSS102 and users can obtain Canadian information on RF exposure and compliance. Le dispositif répond à l'exemption des limites d'évaluation de routine dans la section 2.5 de RSS102 et les utilisateurs peuvent obtenir des renseignements canadiens sur l'exposition aux RF et le respect. The final end product must be labelled in a visible area with the following: The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows: Contains transmitter module IC: 20127-PHOTON This End equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. Cet équipement devrait être installé et actionné avec une distance minimum de 20 centimètres entre le radiateur et votre corps. The end user manual shall include all required regulatory information/warning as shown in this manual.
  • Page 30: Revision History

    Update assets 2015 v003 1-June-2015 Updated VBAT_MICRO info Added FCC IC CE Warnings and End Product Labeling Requirements, Updated 24-July- power output, added approved antennas, Corrected DAC2 as A3, Corrected A0 as v004 2015 pin 50, Corrected External Coexistence Interface pin numbers, Added RGB LED, SETUP and RESET button section. Added: full STM32 part number, Memory map, DAC limits, SWD pin locations, max source/sink current, known errata URL and tape-and-reel dimensions. Updated: 11-April- v005 BT COEX info, pinout diagrams (fixed RESET pin number error), operating 2016 conditions, pin descriptions (P1S0~P1S5 pins), land-pattern image signal keepout note. Updated P1 pin listing: TESTMODE pin 33 (PA8), connected to MCO1 by default, v006 14-July-2016 outputs 32kHz clock for WICED powersave mode - currently unsupported for user control. Updated P1 pin listing: TESTMODE pin 33 (PA8), can use now as P1S6 if enabled. v007 September- Updated Pinmap and added P1S6. Updated Pin Description and Peripherals and 2016 GPIO. Added note to clarify MICRO_SPI1SS label, renamed SPI1/SPI3_ to match Particle API instead of STM32 pin names to avoid confusion (now SPI and SPI1), updated 25-July- v008 the Pin Description section and added high resolution pinout PDF, updated PWM 2017 notes, JTAG_TDO pin number (54 -> 52), block diagram and DCT layout, added warning to power section 30-August-...
  • Page 31: Known Errata

    Known Errata We are tracking known errata with this datasheet here. These issues/errors in the datasheet will be resolved in subsequent revisions.
  • Page 32: Contact

    Contact https://www.particle.io Community Forums https://community.particle.io Email hello@particle.io...

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