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Samsung SF4300C Service Manual

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SF4300C
SERVICE
Manual
INKJET PRINTER COMPOUND
CONTENTS
6. Repair
7. Exploded View
8. Packing
9. Circuit Diagram & Parts List
11. PCB Layout
12. Wiring Diagram

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Summary of Contents for Samsung SF4300C

  • Page 1: Table Of Contents

    SF4300C SERVICE Manual INKJET PRINTER COMPOUND CONTENTS 1. Precaution 2. Referential Information 3. Specifications 4. Disassembly & Assembly 5. Circuit 6. Repair 7. Exploded View 8. Packing 9. Circuit Diagram & Parts List 10. Block Diagram 11. PCB Layout 12. Wiring Diagram...
  • Page 2 ELECTRONICS...

  • Page 3: Precaution

    (metal plate or input terminal) that can easi- after you use it, separate the ground of the ly contact AC plug blades. measuring instruments lastly. 4. How to check insulation: Pull the AC plug out of the outlet and measure insulation resistance of each blade. Samsung Electronics...

  • Page 4: Static Electricity Precautions

    5) Use static electricity protective solder. Solder not parts on PCB. marked Ôstatic electricity protectiveÕ may accu- 11) Overheat during soldering may damage the mulate static electricity that damages ESD parts. parts completely. Heat affects all the parts. Samsung Electronics...

  • Page 5: Referential Information

    UART Universal Asynchronous Receiver/Transmitter Expended Capasilities port : 8bits Data Carriage Return LINE FEED COLOR IMAGE PROCESSOR Charge Coupled Device ANALOG TO DIGITAL DIGITAL TO ANALOG Line Interface Unit Transformer Input from Transformer Receive Output Transformer Line Input Samsung Electronics...
  • Page 6 DIR A1 A2 A3 A4 A5 A6 A7 A8 GND DW SUFFIX SOIC CASE 751D-03 TO-220 R1=10KΩ R2=0.6KΩ 1. Gate 2. Drain 3. Source SOT-89 SOT-23 1. Base 2. Emitter 3. Collector 1. Base 2. Collector 3. Emitter Samsung Electronics...
  • Page 7 BLOCK DIAGRAM OUT 1 8 DIP IN1(- ) OUT 2 IN1(+ ) IN2 (- ) 8 SOP IN2 (+) IN(-) IN(+) Samsung Electronics...
  • Page 8 Audio Input Speaker 1.0uF 5.0uF 125k Chip Bias Disable Circuit MC34119 DTB SUFFIX PLASTIC PACKAGE *=Optional Differential Gian=2 x This device contains 45 active transistors. CASE 948J (TSSOP) BLOCK DIAGRAM 14DIP OUT2 OUT1 IN1(-) 14SOP IN1(+) IN2(-) IN2(+) Samsung Electronics...
  • Page 9 DQ13 DQ12 DQ13 DQ12 DQ11 DQ10 DQ11 DQ10 UCAS UCAS UCAS UCAS *A11(N.C) *A10(N.C) *A11(N.C) *A10(N.C) BYTE DQ15/A-1 DQ14 TO-92 DQ13 DQ12 RESET DQ11 RY/BY DQ10 BYTE DQ15/A-1 1.Emitter 2.Base 3.Collector DQ14 DQ13 DQ12 RESET DQ11 DQ10 RY/BY Samsung Electronics...
  • Page 10 PULSE TIME OUT A PULSE TIME N.C. N.C. N.C. OUT B SENSE PULSE TIME OUT A ALARM OUTPUT N.C. PRE-ALARM OUT REFERENCE REFERENCE COMPARATOR INPUT REFERENCE COMPARATOR INPUT COMPARATOR INPUT PHASE PHASE PHASE Note:HEATSINK SURFACE CONNECTED TO PIN B Samsung Electronics...
  • Page 11 XTALI PORI DGND KS16116/7 GNDD EN85 GNDA RXAMPI GP11 GP13 GNDA GNDD SWGAINI ECLKIN1 SYNCIN1 READ-ø2 WRITE-R/W GNDA 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 Samsung Electronics...
  • Page 12 11. After finishing the job, check if there are cold sol- d. Remove it with the tip of the iron while heating. dered parts. e. Remove the remaining solder on PCB completely with solder removing wire. It should be done to install a new part. Samsung Electronics...
  • Page 13 Use an iron with small flat tip. b. Apply heat to both ends of the part at the same time. c. Remove the part with the tip of the iron while melting. d. Remove the remaining solder completely with solder removing wire. Samsung Electronics...
  • Page 14 IC. b. Use ÔthinÕ tip to contact legs of IC. c. Put the tip right in front of the legs of IC. d. Twist the iron carefully when solder melts. e. Raise and remove IC. 2-10 Samsung Electronics...

  • Page 15: Specifications

    Window 3.1/3.11 and Windows 95 drivers Interface IEEE 1284 Compatible Parallel Interface (ECP) 1-B. Ink Cartridge Supply Mono Ink Color Ink Print Head 208 nozzles 192 nozzles Ink Type Pigment Ink Color Black Color Ink Yield About 600 sheets About 200 sheets Samsung Electronics...
  • Page 16 1 PPM Mono about 2 PPM Resolution Color 300 X 300 DPI (for SmartJet-C only) Mono 300 X 300 DPI Gray Scale 256 Level Printing Width 8 lnch Feeding Manual Interface IEEE 1284 Compatible Parallel Interface (ECP) Samsung Electronics...
  • Page 17 Extension Phone I/F 1-Jack, Extension Phone Transfer PC Interface IEEE 1284 Parallel Interface (ECP) Fax Send Resolution - Standard : 200 x 100 dpi - Fine : 200 x 200 dpi - Superfine : 300 x 300 dpi Samsung Electronics...
  • Page 18 No paper sensor, Paper jam sensor Error Indicator Yes (On LED) Yes (On PC Screen) Voice Request Others Rx Terminal ID Polling DRPD U.S.A : Yes, Other countries : No Mercury * The marked “No” can be provided by telephone’s feature. Samsung Electronics...
  • Page 19 422(mm) 5 237(mm) 5 180(mm) Weight 3.7kg 5. Accessories Handset Curl Cord Tel Line Power Cord Software 1 CD-ROM (Manual, Printer Driver, PC-Fax) Manual Mono Ink Cartridge Color Ink * Xerox’s OCR S/W and scanner editor are recommended for its own use. Samsung Electronics...

  • Page 20: Disassembly & Assembly

    Separate front cover from rear cover in the Push Guide Extension in the direction of the direction of the arrow symbol. arrow symbol. Remove 2 screws between front cover and bot- tom cover. Samsung Electronics...
  • Page 21 Remove various wires fixed on the side of automatic sheet feeder. Unscrew 2 screws on automatic sheet feeder. Push slightly and disconnect the hook (ÒAÓ) fixed to the main frame. Separate automatic sheet feeder by pulling it in the direction of the arrow symbol. Samsung Electronics...
  • Page 22 4-5 Separating Power Circuit Board Fig.4-5. Separating Power Circuit Board Unscrew 2 screws that fix the right and left ground wire. Press the hook (ÒAÓ) on the middle of the housing and separate power circuit board. Samsung Electronics...
  • Page 23 Unscrew 1 screw fixed to the back of the engine and separate home assembly from the engine. Pull out the wiper and the cap in the direction of the arrow symbol to separate them. Fig.4-7. Separating Home Assembly Samsung Electronics...
  • Page 24 Frame Base Assembly Refer to 4-8 to separate carrier Assembly first. Separate 4 roller friction Assembly on the back of the engine and then actuator feed. Separate frame base Assembly by lifting the Fig. 4-9. Separating Frame Base Assembly back. Samsung Electronics...
  • Page 25 Fig.4-10. Separating Feed Roller Assembly the main frame. 4-11 Separating Bracket Line Feed Assembly Bracket Line Feed Refer to 4-10 to separate feed roller Assembly. Unscrew 2 screws and separate bracket line feed Assembly. Fig.4-11. Separating Bracket Line Feed Assembly Samsung Electronics...
  • Page 26 Pull out the clutch and then unscrew 1 left screw to separate the clutch part. Separate the guide finger from shaft pickup. Push shaft pickup to the right to separate. Bend plate-knockup slightly and then separate it from the frame ASF. Samsung Electronics...
  • Page 27 Fig.4-13. Separating LIU board Refer to 4-12 to separate automatic sheet feeder from the engine. Separate the connector. Unscrew 2 screws fixed to LIU board. Separate LIU board from the engine in the direction of the arrow symbol. Samsung Electronics...
  • Page 28 Push up scan Assembly in the direction of the arrow symbol to separate it from the carriage. 4-15. Separating White Reference Sheet White Reference Sheet Frame Base Fig.4-15. Separating White Reference Sheet Remove contaminated white reference sheet completely from the frame base. Ask for new white reference sheet. Samsung Electronics...

  • Page 29: Circuit

    CRIB1 /P-PE /P-BUSY /RST-OUT /P-ACK /HEAD-EN PARALLEL /P-SLCT HEAD-DATA INTERFACE /P-INIT (IEEE1284) PRINT HEAD’ /HGA1~/HGA13 /P-SLCTIN DRIVER & HOE1~HOE16 PRINT /P-AUTOFD OK2PRINT CONTROL /P-STB CIRCUIT /FAULT-TEST 245DIR BIASOFF Fig.5-1-1. Entire Structure of Main Circuit for Each Key Signal Samsung Electronics...
  • Page 30 - /MCS : MODEM(U21) CHIP SELECT (LOW ACTIVE) When each CHIP SELECT is low, data can be read or written. ¥ D0 - D15 - 16bit data bus ¥ A0 - A17 - ADDRESS BUS (A18 - A21 are reserved.) Samsung Electronics...

  • Page 31: Block Diagram

    Decoder Fig.5-1-2. UART BLOCK DIAGRAM TXD : START STOP RXD : START STOP START, STOP : 1BIT EACH BAUD RATE : 9600bps CPU I/F : SUPPORTS BOTH INTERRUPT & POLLING DRIVEN PARITY : NO Fig.5-1-3 UART DATA FORMAT Samsung Electronics...
  • Page 32 CHIP SELECT and READ STROBE (/RD) at the external device and bring data from it. It generates address of destination memory, CHIP SELECT and WRITE STROBE (/WR) in order to move this data into destination memory, and then stores the data. MCLK /XDREQ /XDACK D[15:0] Fig.5-1-4 EXTERNAL DMA TIMING DIAGRAM Samsung Electronics...
  • Page 33 PPD(7 : 0) DATA BUSY nSTROBE nACK Fig.5-1-5 Compatibility Hardware handshaking Timing Samsung Electronics...
  • Page 34 BUSY BYTE0 BYTE1 PPD(7 : 0) nAUTOFD DATA BYTE COMMAND BYTE Fig.5-1-6 ECP Hardware Handshaking Timing (forward) nACK nAUTOFD BYTE0 BYTE1 PPD(7 : 0) BUSY DATA BYTE COMMAND BYTE nINIT Fig.5-1-7 ECP Hardware Handshaking Timing (reverse) Samsung Electronics...
  • Page 35 /PHGA[13:1], /PHOE[16:1] signals and /HEAD-EN to drive these nozzles. Fig.5-1-8 is timing diagram of each signal. Fire Enable Timer /PHGA Signal (PD) Pre-Heat Pulse Width Fire Pulse Width PHOE Signal Front End Delay Pr-Heat Delay Width Back End Delay Fig.5-1-8 Timing Diagram to Drive Head Samsung Electronics...
  • Page 36 Though full step, half step and soft- ware control are possible for both, bi-polar CR motor is controlled half step and LF motor is controlled half step and quarter step here. Samsung Electronics...
  • Page 37 CIP CLOCK EXT. CHIP IS ACTIVE FIREPS / GOP 10 /RST-OUT EXT. CHIP IS RESET PRINTHEAD BIAS OFF /HSC / GOP 11 BIASOFF PRINTHEAD BIAS ON PRINT MODE IS LQ /HSM / GOP 12 CR-REF PRINT MODE IS DRAFT Samsung Electronics...
  • Page 38 TEST PIN FOR EMULATOR (DATA MODE) TDI / GIOP 2 TEST PIN FOR EMULATOR (DATA FROM EMULATOR) /TRST / GIOP 3 /TRST TEST PIN FOR EMULATOR (RESET TO TAP CON.) TDO / GIOP 4 TEST PIN FOR EMULATOR (DATA TO EMULATOR) 5-10 Samsung Electronics...
  • Page 39 (KS53C6200) wake up and initialize external peripherals to operate the system. Fig.5-1-10 is Power Reset Timing Diagram. supply Voltage /F-POR /POR Reset filter 65 MCLK Internal Reset PnRST 256 MCLK (internal) Reset ROM Access Fig.5-1-10 POWER RESET TIMING DIAGRAM Samsung Electronics 5-11...

  • Page 40: System Memory

    5-1-3 SYSTEM MEMORY System memory consists of 512KB flash memory and 2MB DRAM. Flash memory and DRAM are selected by each CHIP SELECT (/ROMCS, /RASO, /RAS1, /LCAS, /UCAS), and data is accessed half word (16bits) by half word. 5-12 Samsung Electronics...
  • Page 41 Converter Controller Processor Module Analog Digitized Processed Data Data Data Data Timing CIP-I Control Data Formatted Data for DMA System Data BUS Formatted Data for DMA Control CIP-I Control Data Data Memory Controller fig.5-1-11 CIP1A Block Diagram Samsung Electronics 5-13...
  • Page 42 BUSY LED OFF GOP 4 SCAN-LED FAX LED ON FAX LED OFF GOP 5 CML-CTL FAX OR TEL LINE CONNECTED EXT. PHONE CONNECTED GOP 6 LAMP-5V CCD MODULE RETURN (+5V) GOP 7 LAMP-12V CCD LAMP ON (+11.75V) 5-14 Samsung Electronics...
  • Page 43 0.75V at Emitter terminal of Tr which is turned on by Level SH signal. These image signals will double by an non-inverting amplifier and finally 1.5V level-shifted image signals will be put in CIP1A. Samsung Electronics 5-15...
  • Page 44 (mono or color). If there is data, printing image is put out at ÒHÓ. If not, it is put out at ÒLÓ. In case of Babbage head, pulse width is always 1.3use regardless of the type of the head, with the maxi- mum driving current 400mA and output voltage +11.75V. 5-16 Samsung Electronics...
  • Page 45 Heating and ambient Temperature Sensor. It checks and controls head driver and ink cartridge. /FAULT-TEST /HGA1 /HGA13 BA13 HOE1 KS32C6200 (U15) HEAD-DATA Cartridge HOE16 BP16 (Mono) CONTROLLER /FAULT-TEST (Color) OK2PRINT /FAULT BIASOFF HEAD-DATA /HEAD-EN PRE-HEAT BH1,BH2 CIP 1A(U17) IMAGE THM-DATA PROCESSOR THM-CLK Fig.5-1-12 Block Diagram of Printer Samsung Electronics 5-17...
  • Page 46 (below 35¡É).(Refer to Timing Chart.) It sends PRE-HEAT signal through I/O port of CIP1A(Color Image Processor:U17) and supplies +11.75V. Mono Head 70°C 35°C Pre-Heat if below 35¡c Fig.5-1-13. Temperature around Mono Head 5-18 Samsung Electronics...
  • Page 47 If data is mono, it is 07H. If color, 08H. (Pwr) (Load) (Clock1) (Clock2) Min 500ns Clock Delay HEAD-DATA bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 Head I.D read : HEAD-DATA Mono : 07H Color : 08H Fig.5-1-15. HEAD DETECTION TIMING DIAGRAM Samsung Electronics 5-19...
  • Page 48 (+11.75V). It is depicted in the following diagram. Fire Enable Timer (PD) Signal Pre-Heat Pulse Width Fire Pulse Width Signal Front End Delay Back End Delay Pre-Heat Delay Width Fig.5-1-16. HEAD DRIVING TIMING DIAGRAM 5-20 Samsung Electronics...
  • Page 49 BA10 BA11 BA12 BA13 BP1- BP16 (Tp) Fig.5-1-17. TIMING DIAGRAM FOR EACH NOZZLE Samsung Electronics 5-21...
  • Page 50 5-1-5-5. INK CARTRIDGE ¥ PIN ARRAY OF MONO INK CARTRIDGE There are 208 heater chips in mono ink cartridge. Address (BA1_ ~ BA13_) Column Data(BPx) 5-22 Samsung Electronics...
  • Page 51 ¥ PIN ARRAY OF COLOR INK CARTRIDGE There are 192 heater chips in mono ink cartridge. One cartridge has 64 Cyan, 64 Magenta, 64 Yellow heaters and (64 x 3 colors) 192 nozzles. Address (BA1_ ~ BA13_) Column Data(BPx) Samsung Electronics 5-23...

  • Page 52: Motor Driver

    CRVREF of driver (U25, U26) with +5V divided will go up (+4.5V). It becomes the standard of the driver, resulting in high current. If CR_REF output is ÒhighÓ, TR(Q12) will be turned on and the volt- age put in to CRVREF will go down (+3.0V), resulting in low current in the motor. 5-24 Samsung Electronics...
  • Page 53 - Motor Type: stepper motor, bi-polar - Driving Voltage : +30V - Winding Resistance : 12½ ± 10% - Driving IC : PBL3717A X 2 LFIA1 LFIA0 CURRENT(mA) OPERATION REMARK When feeding document/paper When ejecting document/paper No current Samsung Electronics 5-25...
  • Page 54 In the receiving mode, analog signals coming in through LIU board are amplified at OP AMP(U6-2, R293, C141), and then transmitted to input terminal of modem (RXIN:U21-45) through smoothing filter (U6-6, 7:R273, R274, C126). FAX TRANSMISSION MODEM KS16116 (U21) FAX RECEPTION Fig.5-1-18. FAX TRANSCEIVER 5-26 Samsung Electronics...
  • Page 55 Data is being received from host.(Printing) other operation Data is being uploaded to host. (Scanning) Fax transmitting/reception. (Faxing) Transmitting/receiving error Paper jam, no paper No document, next document, document jam Cartridge is being exchanged. No cartridge Ink low Ready Cartridge FF/Stop Start/Copy Busy Scan/Fax Samsung Electronics 5-27...
  • Page 56 Q2, which interrupts DC current on telephone line and puts out pulse signal on telephone line. ¥ U3-35 CS terminals : It makes Make Resistance by shorting telephone line with Vss during Make period of DP dial. 5-28 Samsung Electronics...

  • Page 57: Serial Interface

    + polarity against pin Pin.2. So DC loop forms always in the same direction regardless of the polar- ity of the telephone line. 7) T2,T3 : TRANSFORMER - It delivers signals from the telephone line to modem or signals from modem to the telephone line. - Insulation between prinary and secondany circuit part. Samsung Electronics 5-29...

  • Page 58: Gnd2

    : AC220 - 240V FREE VOLTAGE 2) INPUT VOLTAGE TURNING RANGE : AC 85 - 270V 3) RATED FREQUENCY : 50 - 60 Hz 4) FREQUENCY RANGE : 47 - 63 Hz 5) INPUT CURRENT : 0.5Arms 5-30 Samsung Electronics...
  • Page 59 11.75V of 2nd voltage is detected by voltage detector and feeds back through photo coupler to 1st PWM Control Circuit signals compared by error amplifier. PWM Control Circuit controls the gate of power transistor according to the feedback voltage so as to supply load with stable output voltage. Samsung Electronics 5-31...
  • Page 60 Signals compared by error amplifier are fed back to primary PWM control circuit through photo coupler. PWM control circuit controls the voltage of power transistor gate driver according to the voltage to supply load with stable output voltage. 5-32 Samsung Electronics...
  • Page 61 Photo interrupter is used as a home detecting sensor, attached to the back of the carriage. When the carriage moves left and right, output is ÒhighÓ if the frame rib covers the center of the sensor and ÒlowÓ if it is out of home. Sensor PCB Photo Interrupter Frame HOME_SEN Samsung Electronics 5-33...
  • Page 62 This IC converts the temperature around IC package into digital and sends the temperature data to serial to make it sense the temperature around the head. It senses temperature so that the temperature of the head can be the optimum when you print something. The above IC sends data serially using signal lines(THM_DATA, THM_CLK). 5-34 Samsung Electronics...
  • Page 63 Check the scanner of the main board. Replace the main board. when you scan or Check scanner cable. Replace FPC-SCAN. copy Check the scanner. Replace the scanner. White lines when Check if there is foreign substances on Wipe LABEL(P)-REFERENCE. you scan/copy. LABEL(P)-REFERENCE. Samsung Electronics...

  • Page 64: Paper Feed

    - Open the envelope guide when you guide of automatic sheet feeder. feed envelopes. Tilted Printing - Check if paper guide of the automatic - Adjust paper guide to the size of sheet feeder is adjusted to the size of paper. paper. Samsung Electronics...

  • Page 65: Printing Quality

    5) Check if head cable is inserted well into the main circuit board and then check if nozzles have prob- lems. 6) Check if head cable is broken or torn and then check if nozzles have problems. 7) Replace the main circuit board with a new one and check if nozzles have problems. Samsung Electronics...
  • Page 66 In order to enhance the speed of parallel port and to solve some parallel port connection problems it is strongly recommended that the service man who has encounterde these problems must set the parallel port connection(P1284) mode to a ECP mode in a PC BIOS. Samsung Electronics...
  • Page 67 3. Replace the main PBA. ver.: Check U15-8,9,10,128,154,156, U17-23 control signals and head data. Check the amount of ink. Replace ink cartridge. After replacing it, press Ôink replace- Ink low mentÕ key for over 3sec to inform the system of new ink. Samsung Electronics...
  • Page 68 6. If the output of U3-40(LIU PBA) is U21-45(main PBA). not confirmed, replace LIU PBA. If the output of U3-40(LIU PBA) is con- firmed but the input of U21-45(main PBA) is not confirmed, check the circuit around U6(main PBA). Samsung Electronics...

  • Page 69: Other Problems

    - Check Ôvirtual memoryÕ of control - Press the 386 expansion icon of control error and the com- panel in the basic program group. panel to change Ôvirtual memoryÕ from puter gets down temporary to permanent. after a diskette is installed. Samsung Electronics...
  • Page 70 SPRING-CS(CAP) : SUS 304 WPB(0.55DIA) JB97-00242D MEA-PULLEY IDELE : MJ-705G/MJ-705A JB66-40203A GEAR-IDLE : POM BLK JB72-40283A PMO-HOLDER PULLEY : ABS HB BLK JB70-40100A ICT-SHAFT PULLEY : SUM 24L(NI) DIA3.0 6107-001004 SPRING-CS(PULLEY) : SUS 304 WPB (0.8DIA) JB72-41121A STOPPER-PULLEY:ABS HB BLK Samsung Electronics...
  • Page 71 SPRING-KNOCK UP : SUS 304 WPB(135g) 1607 JB70-10918A IPR-PLATE TENSION : 1608 JB72-41026A PMO-GUIDE PAPER SIDE : ABS HB 75064 1609 JB70-10906A IPR-GUIDE LATCH : SUS 0.3T 1610 JB72-40218A PMO-GUIDE EXTENSION A : HIPS HB 1611 JB72-40923A PMO-FINGER ASF : ACETAL(NA) Samsung Electronics...
  • Page 72 SCREW-TAPPING : PWH, +, 2, M3, L8 6003-000193 SCREW-TAPTITE : PWH, +, B, M2.5, L6 6003-000190 SCREW-TAPTITE : PWH, +, S, M3, L6 6002-000143 SCREW-TAPPING : PH, +, 2, M2.5, L6 6003-001062 SCREW-TAPTITE : PH +, S, M3, L12, WHT Samsung Electronics...
  • Page 73 Availability Minimum Location Code Part Name & Specifications of Materials Q’ty 0205-001002 GREASE : NYOGEL 744 0205-001007 GREASE : NYOGEL 759G 961 171005AB GREASE : CRS841 Samsung Electronics...
  • Page 74 7-1. Exploded View Samsung Electronics...
  • Page 75 8. Packing How to pack SMARTJET Samsung Electronics...
  • Page 76 U23,U24 1105-001030 IC-MEM,DRAM,16M, 1M*16BIT,SOJ,42P KM416C1200BLJ-6 1107-001055 IC-FLASH MEMORY,4M,16BIT,TSOP,48P AM29F400AB-120EC AMD,FUJIT 1201-000167 IC-LIN,OP-AMP,SOP,8P,KA358 KA358D-T/F 1201-001052 IC-LIN,OP-AMP.SOP.8P.150MIL MC14577CFR2 1202-000164 IC-VOLTAGE COMP,393,SOP,8P,150MIL KA393D SEC,MOT 1203-000623 IC-LIN,DETECTOR,3,SINGLE KIA7045F 2001-000202 R-CARBON,0.5ohm,5%,1/2W CR1/2W,0.5.J ABCO R318,R322,R324,R329 2007-000023 R-CHIP,120ohm,5%,1/10W RC2012J121CS SEM,ROHMK 2007-000026 R-CHIP,20Oohm,5%,1/10W RC2012J201CS SEM,ROHMK R43,R44,R70,R193,R195 Samsung Electronics...
  • Page 77 KAMAY R249 2007-000565 R-CHIP, 200ohm,5%,1/8W,3216 RC3216J201CS SEM,ROHMK R205,R247 2007-000586 R-CHIP, 220Kohm,5%,1/10W RC2012J224CS SEM,ROHMK R264 2007-000671 R-CHIP, 22Kohm,5%,1/10W RC2012J223CS SEM,ROHMK R205,R247 2007-000703 R-CHIP, 2Kohm,5%,1/10W RC2012J202CS SEM,ROHMK R262,R340 2007-000705 R-CHIP, 3.6Kohm,5%,1/10W RC2012J334CS SEM,ROHMK R208 2007-000705 R-CHIP, 3.6Kohm,5%,1/8W,3216 RC3216J362CS SEM,ROHMK R187 Samsung Electronics...
  • Page 78 SEM,MURATA C190,C195 2203-000192 C-CHIP, 150pF,5%,50V,NPO,2012 CL21F104ZBNC SEM,MURATA C199,C202,C339 2203-000192 C-CHIP, 150pF,5%,50V,NPO,2012 CL21F104ZBNC SEM,MURATA C300,C352,C353 2203-000239 C-CHIP, 150pF,5%,50V,NPO,2012 CL21C101JBNC SEM,MURATA C26,C203,C307-C311 2203-000260 C-CHIP, 150pF,5%,50V,NPO,2012 CL21B103KBNC SEM,MURATA C40,C53 2203-000295 C-CHIP, 150pF,5%,50V,NPO,2012 GRM40COG100J50PT SEM,MURATA C108 2203-000361 C-CHIP, 150pF,5%,50V,NPO,2012 CL21C151JBNC SEM,MURATA C107 Samsung Electronics...
  • Page 79 CONN-HEADER,4P,1R,2.5mm,STRAIGHT 5045-04A,ST MOLEX CON1 3711-000280 CONN-HEADER,6P,1R,2.5mm,STRAIGHT 5045-06A,ST MOLEX CON7 3711-003409 CONN-HEADER,3P,1R,2mm,STRAIGHT 35303-0350 MOLEX 4701-001020 FREQ-ATTENUATOR,5-80MHz,15dB,0.03W FS741AZB U297 8710700006XA IC-TTL,7406,BUFFER,SOP SN7406D TI,PHI 8810200339XA IC-LIN,LM339,COMP.SOP,14P KA339D SEC,PHI JB13-10503A IC-ASIC,MICRO PROCESSOR,160R,SMD KS32C6200 JB13-10504A IC-ASIC,IMAGE PROCESSOR,80P,SMD CIP1A JB41-10507A PCB-MAIN,FR-4,4L,215x87x1.6T MAIN PCB KIJU Samsung Electronics...
  • Page 80 R284 2007-000844 R-CHIP,3Kohm,5%,1/10W RC2012J302CS SEM,ROHMK R272 2007-000872 R-CHIP,4.7Kohm,5%,1/10W RC2012J1472CS SEM,ROHMK R292,R295 2007-000920 R-CHIP,47.5Kohm,1%,1/10W RC2012J4752CS SEM,ROHMK R271 2007-001078 R-CHIP,600ohm,5%,1/10W RC2012J601CS SEM,ROHMK R287,R288 2007-001220 R-CHIP,86.6Kohm,1%,1/10W RC2012F8662CS SEM,ROHMK R274,R277 C121,C123,C125, 2203-000192 C-CHIP,100nF,5%,50V,NPO,2012 CL21F104ZBNC SEM,MURATA C127-C129 C135,C138,C140 2203-000192 C-CHIP,100nF,5%,50V,NPO,2012 CL21F104ZBNC SEM,MURA C143-C145,C147 Samsung Electronics...
  • Page 81 SEM,MURATA C150 2007-000290 C-AL.SMD,106M,10U/16V,GP,4x7mm,5mm ECEV1CA100SR MATSU,SAMY C149 2007-000300 C-AL.SMD,106M,1V,10U/35V ECEV1VA100SR MATSU,SAMY C124 2007-000300 C-AL.SMD,226M,1V,22U/16V ECEV1CA220SR MATSU,SAMY C118 2007-000325 C-TANTAL,1uF,20%,16V,3216 TAJA105M016R SEM,AVX C120 2007-000395 CRYSTAL,24.00014M,HC-49/S,18PF HC-49/S,24.00014M ITC,SUNNY 2007-000401 CONN-WALL HEADER,12P,2mm,STRAIGHT 35303-1250 MOLEX CON3 2007-000477 CONN-WALL HEADER,2P,2mm,STRAIGHT 35303-0250 MOLEX CON6 Samsung Electronics...
  • Page 82 REF-CHIP, 15Kohm, 5%, 1/10W, 150V RC2012J153CS ROHMK R30, R40 2007-000449 REF-CHIP, 180ohm, 5%, 1/10W, 150V RC2012J181CS SEM, 2007-000468 REF-CHIP, 1K, 5%, 1/10W, 150V RC2012J102BS ROHMK 2007-000498 REF-CHIP, 2.2M, 5%, 1/10W, 150V RC2012J225BS SEM, R22,24 2007-000572 REF-CHIP, 220ohm, 5%, 1/10W, 2012 RC2012J221CS ROHMK Samsung Electronics...
  • Page 83 KJEW, LGC JP2-JP5, JP10-JP11, JP13-JP16, ARS4 JB41-10508A MJ-715S, FR-4, 1L, T1.6mm, 110X90, LIU PCB LIU PCB JF13-10073A I-LIU Chip, STI9510, DIP, 40P STI9510 JF27-60051A COIL-FILTER, IND-RF, 60UH SBT-0260T TOKIN FLT1-2 JG26-50001A 600:600 Transformer, 100-1016 100-1016 SUNGMOON T2, T3 Samsung Electronics...
  • Page 84 C-CHIP,100nF,5%,50V,NPO,2012 CL21F104ZBNC SEM,MURATA C1,C4,C6,C8 2203-000295 C-CHIP,10pF,5%,50V,NPO,2012 GRM40COG100J50PT AVX,MURATA 2402-000110 C-AL,SMD,10uF,20%,16V ECEV1CA100SR MATSU,SAMY C2,C3,C7 3708-001224 CONN-HEADER,14P,1mm,DIP 08-6232-014-007-800 ELCO CON1 1201-001052 IC-LIN,OP-AMP,SOP,8P,150MIL MC14577CFR2 0605-001014 CCD-MONO,TCD1001P TCD1001P TOSHI U2(MONO ONLY) 0605-001015 CCD-COLOR,UPD3700CS UPD3700CS U2(COLOR ONLY) JB41-10509A SMARTJET CCD PCB,2-LAYER OCD PCB Samsung Electronics...
  • Page 85 LAMP B’D P/L SEC CODE DESCRIPTION PART NAME VENDOR Q’TY Location 4713-001047 LAMP-MONO,6V,BQ051-26704A-ST BQ051-26704A-ST STANLEY LAMP1,2 4713-001048 LAMP-COLOR,6V,BQ405-12020A-ST BQ405-12020A-ST STANLEY LAMP1,2 1404-001081 THERMISTOR,100Kohm NTH5G2M42B104J04TE MURATA JB41-1051A SMARTJET LAMP PCB,1-LAYER LAMP PCB 9-10 Samsung Electronics...
  • Page 86 SEC CODE DESCRIPTION PART NAME VENDOR Q’TY Location 0604-001045 PHOTO-INTERRUPTER,TR,0.8%-,100mW,DIP GP1S94 SHARP 1209-001016 IC-THERMOMETER,DS1621,SOP,8P DS1621S DALLA 2007-000941 R-CHIP,47Kohm,5%,1/10W RC2012J473CS SEM,ROHMK R1,R2,R3 2007-000542 R-CHIP,200ohm,5%,1/8W RC3216J201CS SEM,ROHMK 2203-000192 C-CHIP,100nF,5%,50V,NPO,2012 CL21F104ZBNC SEM,MURATA 3708-001198 CONN-FPC,6P,1mm,SMD 04-6232-106-103-800 ELCO Jb41-10504A SENSOR PCB ZERO Samsung Electronics 9-11...
  • Page 87 1013 DIODE-BRIDGE D2SB(A)60 600V SHINDENGEN 2001 CAP-X KNB1530-154 AC275V 154M MINI TYPE ISKRA C1, 4 2001-A PCX2 335M 154 AC275V 154M MINI TYPE PHILKOR 2002 CAP-Y HCYE2G222MAA AC400V 222M VDE (2600V) SAMSUNG C2, 3 2002-A SCE2G222M08BS7 SAMHWA 9-12 Samsung Electronics...
  • Page 88 2014 CAP-MYLAR TY2A223J 100V 223J SAMHWA 2014-A TS1H223J 50V 223J SAMHWA 2015 CAP-MYLAR TY2A683J 100V 683J SAMHWA 2015-A CQ92MST2A683J DONGSUNG 2016 CAP-M.F TM2J683K 630V 683K SAMHWA 2016-A MMW630V683K DONGSUNG 3001 R-VARIABLE EVNDJAA03B52 1/2W 500½ TOP ADJ MATSUSHITA Samsung Electronics 9-13...
  • Page 89 1/8W 4.7K-J PHILKOR 3012-A ABCO 3013 R-METAL 1/8W 68-J PHILKOR 3013-A ABCO 3014 R-METAL 1/8W 10K-J PHILKOR 3014-A ABCO 3015 R-METAL 1/8W 2.4K-J PHILKOR 3015-A ABCO 4001 THERMISTOR DSC 10D-9 10ohm 9pi SHINHO 4001-A NTC 10D-9 SAMKYUNG 9-14 Samsung Electronics...
  • Page 90 4011-A CHOKE-COIL DONGHEUNG 4012 IFPS-V2 IPT-2 DONGHEUNG 4012-A TRANSFORMER SUNGWON 4012-B ASEA 4013 FC51F TRLAD FOR F1 CLIP FUSE 4014 50T 020H 250V 2.0A TRIAD FUSE-GLASS 4015 IFPS SECC T=1.0 SUN WOO 4015-1 SHIELD PLATE YOO CHANG Samsung Electronics 9-15...
  • Page 91 ITEM PART No. DESCRIPTION VENDOR Q’TY LOCATION 4016 IFPS-V2 FR-1 1.6T CHUNG JU 4016-A GANA 4017 LABEL IFPS-V2 SAMSUNG PRINTEC 4018 SCREW-FG MSBH 4*6 SCREW+WASHER DAEKYUNG 4019 SCREW MSBH 3*6 TAPTITE GLD DAEKYUNG 4020 SCREW MSBH 3*10 DAEKYUNG J1~J4, J6~J9...
  • Page 92 10. Block Diagram Samsung Electronics 10-1...
  • Page 93 11. Wiring Diagram Samsung Electronics 11-1...

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