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Samsung SDC-30 Service Manual

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SERVICE
DIGITAL STILL CAMERA
© Samsung Electronics Co., Ltd. JUN. 1997
DIGITAL STILL CAMERA
SDC-30
SDC-33
MODE
TIMER
DELETE
POWER
Manual
CONTENTS
1. Precautions
2. Reference Information
3. Product Specifications
4. Disassembly and Reassembly
5. Alignment and Adjustment
6. Troubleshooting
7. Exploded View and Parts List
8. Electrical Parts List
9. Block Diagram
10. PCB Diagrams
11. Schematic Diagrams
AD68-20286A / AD68-20289A

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Summary of Contents for Samsung SDC-30

  • Page 1 4. Disassembly and Reassembly MODE TIMER DELETE 5. Alignment and Adjustment POWER 6. Troubleshooting 7. Exploded View and Parts List 8. Electrical Parts List 9. Block Diagram 10. PCB Diagrams 11. Schematic Diagrams © Samsung Electronics Co., Ltd. JUN. 1997 AD68-20286A / AD68-20289A...

  • Page 2: Precautions

    Alternatively, wear a discharging Wrist-strap device. (Be sure to remove it prior to applying power--this is an electric shock precaution.) Samsung Electronics...
  • Page 3 Always inspect for pinched, out- of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage. Make sure that leads and components do not touch thermally hot parts. Samsung Electronics...

  • Page 4: Reference Information

    2-1 Circuit description 2-1-1 DSC Digital camera(SDC-30/33), is an image-input device that connects to a PC. It’s small and light welght, supplies high quality images and has a large capacity (4MB/2MB). The digital camera consists of 3 sections: Camera, signal processing and storage.
  • Page 5 V Drive IC(MN3112SA), and supplied to CCD. After noise elimination (CDS) and amplification (AGC) at analog process IC(NN2038FAQ), CCD output signal is converted to a digital signal by A/D converter. The 8-bit digital data is changed to 16-bit by DRAM control IC(SMA9606), and stored in the DRAM. Samsung Electronics...
  • Page 6 Reference Information 2. Lens SDC-30/33 lens uses a fixed focus method, and can take a photograph clearly at over 1 meter distance (optimal quality is between 1.5 and 3 meters). 3. Color Filter – – Color filter, which remove, the color information on CCD, adapts RGB method –...
  • Page 7 AGC. Pin 35 output signal is input to Pin 26 through C218, and is amplified second time at the main amplifier. The offset adjust (pin 16 input) is activated by EVR output signal (Pin 4) and the output (Pin 21) is sent to A/D converter. Fig. 2-4 Samsung Electronics...
  • Page 8 (High Z – DRAM CASL VD/HD – when Address – Power Off) EXT VD IN Generator – EXT HD IN A–OUT(9:1) CLK IN(24.54MHz) H ADJ – V ADJ ADDR/DATA – BREQ – – CONTROL BACK – Fig. 2-5 Samsung Electronics...

  • Page 9: Digital Section

    3. 32-bit RISC microprocessor (HD6477043F28) This microprocessor is the core of the system and handles the camera control, image signal processing, image compression, flash memory control, communication with PC, and communication with LCD control MICOM. (Refer to 2-1-6 “System Control” for details.) Samsung Electronics...
  • Page 10 - Delay shot: When the delay shot is executed by the PC key (or main body), 4-bit MICOM signals the RISC and supplies the system 5V and head power 5V. Then, the RISC changes to standby mode. Samsung Electronics...
  • Page 11 RISC. Battery level checking is executed when the camera head and main board are on. When new battery is inserted, it outputs 6.2V; but the actual voltage drops below 6V after supplying power to the camera head and main board. Samsung Electronics...
  • Page 12 Reference Information 2-2 IC Blocks 2-2-1 IC301 (SMA9606) Samsung Electronics...
  • Page 13 Reference Information 2-2-2 IC302 (KM416C256BLT) 2-10 Samsung Electronics...
  • Page 14 Reference Information 2-2-3 IC304 (HD6477043) Samsung Electronics 2-11...
  • Page 15 Reference Information 2-2-4 IC307 (TC5832FT) 2-12 Samsung Electronics...
  • Page 16 Reference Information 2-2-5 IC601 (UPD75P3116GC) 2-2-6 IC501 (MAX232C) Samsung Electronics 2-13...
  • Page 17 Reference Information 2-2-7 IC203 (NN2038FAQ) 2-14 Samsung Electronics...
  • Page 18 Reference Information 2-2-8 IC204 (NN5248) Samsung Electronics 2-15...
  • Page 19 Reference Information MEMO 2-16 Samsung Electronics...

  • Page 20: Product Specifications

    3. Product Specifications Design and specifications are subject to change without notice. Descriptions Operation SDC-30 SDC-33 Image sensor 350,000 pixel CCD 350,000 pixel CCD (STD) :640 X 480 pixels (ECO)20 X 240 pixels (STD) :640 X 480 pixels (ECO) : 320 X 240 pixels...
  • Page 21 Product Specifications MEMO Samsung Electronics...

  • Page 22: Disassembly And Reassembly

    (Reassemble in reverse order.) 4-1-1 Case-Side Removal Disconnect 2 tabs while lifting up the case-side to the arrow direction. Bottom Side Remove 2 screws. Precision screw Driver Lift up the case-side using the precision screw driver. <BOTTOM SIDE> Fig. 1 Samsung Electronics...
  • Page 23 Open the Door-Battery (in the direction of arrow), and twist it to remove. Fig. 2 4-1-3 Case-Rear Removal Remove 3 tabs while CASE-REAR pushing "A" area down. Detach the case-rear in the direction of the arrow. Remove 1 screw. Fig. 3 Samsung Electronics...
  • Page 24 4-1-4 Main-PCB Removal Remove 2 screws. Disconnect the lead connector Disassemble MAIN PCB while CN502 from JACK-PCB. disconnecting CN301 from FUNCTION-PCB. Fig. 4 4-1-5 Jack-PCB Removal Disconnect the lead connector from CN501. Remove 1 screw. Disconnect 1 tabs. Fig. 5 Samsung Electronics...
  • Page 25 Disassembly and Reassembly 4-1-6 Case-Top Removal Disconnect one tab and detach Case-Top in the direction of arrow. Fig. 6 4-1-7 Case-Front Removal Detach Case-Front in the direction of arrow. Remove 1 screw. Fig. 7 Samsung Electronics...
  • Page 26 Disassembly and Reassembly 4-1-8 OVF Removal Remove 1 screw. Note : Take extreme care not to ieave fingerprints on the surface. Lift up OVF. Fig. 8 Samsung Electronics...
  • Page 27 Disassembly and Reassembly MEMO Samsung Electronics...

  • Page 28: Alignment And Adjustments

    * Supplied program diskette (3.5") 5-2-2 Functions * DRAM test * Flash memory test * ASIC test * LCD test * Vsub value adjustment * AWB(Auto White Balance) 3100°K ,5100°K adjustment * Display image on PC after shot Samsung Electronics...

  • Page 29: Program Installation

    Execute SVC.exe in Windows Fig.5-2 2. Initial screen of program Fig. 5-3 Initial screen at execution of SVC.exe 1) The window (Fig. 5-3) appears at execution of SVC.exe. 2) It should be tested or adjusted in the following sequence. Samsung Electronics...
  • Page 30 Two items appear as shown in Fig. 5-5. Select 'Option' to set the adjustment item Select 'Start' for execution Fig. 5-5 Select 'SDC-33/30' of menu bar Finish the execution Fig. 5-4 3. 'Option' window 1) When selecting 'Option', Fig. 5-6 is displayed. Fig.5-6 Option Window Samsung Electronics...
  • Page 31 2) Select 'Start' of SVC menu to display the window shown in Fig. 5-8. Test/Adjustment start button Port number of PC connected Pictures taken with DSC Exit * Display screen on testing * Display the results for test Progress bar to display the process state Fig. 5-8 Execution window of test/adjustment Samsung Electronics...
  • Page 32 4) Execute the program in accordance with the sequence of Fig. 5-6. Power supply DRAM test Memory format ASIC test VSUB value adjustment 3100°K level AWB 5100°K level AWB LCD test Mode test Timer test Shot & Display Power interrupt Fig. 5-9 Process and procedure of adjustment Samsung Electronics...
  • Page 33 : Adjust AWB 5100°K level. This process should be done with 5100°K level chart active throughout the screen, and color temperature con version filter should be attached to the camera. (Be certain to use it, 3100°K level AWB because picture quality is affected.) 5100°K level AWB Fig. 5-12 Samsung Electronics...
  • Page 34 : Display the thumbnail after the shot to determine normal or abnormal Shot and Display operation. : Shut off the camera’s power supply after completion of all tests. Power interrupt Proceed to the adjustment step. Fig. 5-13 Fig. 5-14 V-Sub voltage Samsung Electronics...
  • Page 35 -> 5100°K AWB adjust error (R value is out of bound) . RG xx * B value exceeds the range in <NG> 5100°K level test. -> 5100°K AWB adjust error (B value is out of bound) . BG yy Samsung Electronics...

  • Page 36: Using The Software

    Note: Select 'iPhoto Express Tour' in Help menu to see the detailed instructions for Edit S/W. All functions of Edit S/W are explained with figure. Fig.5-15 2. Twain driver installation 1) Execute setup.exe in TWAIN intallation diskette under Windows 95 environments. 2) Complete the installation according to the instructions on screen. Samsung Electronics...
  • Page 37 1) Execute TWAIN compatible edit program (Photo Impect, Video Studio, iPhoto Express, Photo Shop Pro. etc 2) Select Acquire->Select Soruce->Samsung Digital Camera TWAIN in file menu of edit program 3) Connect the digital camera with PC in use of RS-232C cable and power on.
  • Page 38 - Download : Transmit the selected screen to PC - Exit : Exit TWAIN driver - Select All : Select entire screen - PgUp/PgDn : Display the previous and next screen (by page 5) - RowUp/RowDn : Display the previous and next screen (by row) Samsung Electronics 5-11...
  • Page 39 Alignment and Adjustments MEMO 5-12 Samsung Electronics...

  • Page 40: Troubleshooting

    6. Troubleshooting Samsung Electronics...
  • Page 41 Troubleshooting Samsung Electronics...
  • Page 42 Troubleshooting Samsung Electronics...
  • Page 43 Troubleshooting Samsung Electronics...
  • Page 44 Troubleshooting Samsung Electronics...

  • Page 45: Option Window

    Select 'SDC33/30' of Winows menu bar in use of mouse. Two items appear as shown in Fig.6-2. Select 'Option' to set the test item Select 'Start' for execution Fig.6-2 Select 'SDC-30/33' of menu bar Finish Fig.6-1 6-2 Option window Option window is set as follows.

  • Page 46: Test Procedure

    Troubleshooting 6-3 Test procedure Power supply DRAM test Memory format ASIC test LCD test Mode test Timer test Shot & Display Power interrupt Fig.6-4 Test procedure Samsung Electronics...

  • Page 47: Test Items

    : Check the delay shot On/Off. Display the result by means of self On/Off without special operation. Timer test : Display the thumbnail after shot, to confirm normal or abnormal Shot & Display operation. : After completion of all tests and adjustments disconnect the power Power interrupt supply. Fig.6-7 Samsung Electronics...
  • Page 48 * There are Many bad blocks in <NG> flash memory. -> Flash Memory system block error. * XX data bus has a problem. -> Data line XX error detected. * Address bus has a problem. -> Address line error detected. Samsung Electronics...
  • Page 49 Troubleshooting MEMO 6-10 Samsung Electronics...

  • Page 50: Exploded View And Parts List

    Cabinet Assembly - - - - - - - - - - - - - - - - - - - - - - - Accessory - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Samsung Electronics...

  • Page 51: Cabinet Assembly

    Exploded View and Parts List 7-1 Cabinet Assembly Samsung Electronics...
  • Page 52 SPRING-BATTERY A AD61-62004A SPRING-BATTERY B AD90-10813H ASSY-FUNC BOARD; AD90-10813Q ASSY-JACK BOARD; AD90-10812V ASSY-MAIN BOARD;SDC30 OPTION AD90-10819W ASSY-MAIN BOARD;SDC33 OPTION AD61-11017A BRACKET-CCD;-,AL,-,T1.2,-,-,DSC 0605-001010 CCD;COLOR,DIP,16,400MIL,325K,7.4X7 AD63-60088A SPACER-CCD;-,SILICON,BLK,-,-,DSC AD29-90200J FILTER-OPTICALL;DP,SV-4C10MM,LP,-,T AD61-21047A HOLDER-LENS;-,PBT94,HB,-,-,BLK AD67-10169A LENS-FIXED FOCAL;-,0.16,GLASS,T5.18,15X15.6,6.0 AC60-10054A SCREW-TAPPING;BH,+,-,M2,X6,FZB AC60-10055A SCREW-TAPPING;BH,+,-,M2,X4,FZB AC60-10024A SCREW-MACHINE;BH,+,M2,X3,FZW,FE,-,-,- Samsung Electronics...
  • Page 53 Exploded View and Parts List 7-2 Accessory AD91-10001A ASSY-ACCESSORY; SDC-30,NTSC ŒAD39-42001C CABLE-RS232C; 9P, 1000MM, PLUG 3.5. 20M ´AD63-10212A STRAP-SHOULDER;-,-,-,-,BLK,-, ˇAD69-32001A BAG-SOFT CASE; SDC50, LEATHER,-,-,-,BLK,-,- ¨AD46-30001C DISC-FLOPPY; 3.5 INCH, 1.44MB ¨AD46-30001E DISC-FLOPPY WIN3.1;3.5INCH,1.44MB,SDC-33 ˆAD46-20007A DISC-IPHOTO EXPRESS ; 120MM Ø4301-001017 BATTREY-ALKALINE ; 1.5V, -, AA,14 X 49.5MM,PLATE...

  • Page 54: Electrical Parts List

    8. Electrical Parts List Loc. No New Part No Description and Specification Remark AD90-10819W ASSY-MAIN BOARD;SDC-33 AD90-10812V ASSY-MAIN BOARD;SDC-30 C201 2203-000477 C-CERAMIC,CHIP;1UF,+80-20%,16V,Y5V,TP,2012,- C202 2203-000477 C-CERAMIC,CHIP;1UF,+80-20%,16V,Y5V,TP,2012,- C203 2203-001556 C-CERAMIC,CHIP;100NF,+80-20%,25V,Y5V,TP,1608, C204 2203-000491 C-CERAMIC,CHIP;2.2NF,10%,50V,X7R,TP,1608,- C205 2404-000159 C-TA,CHIP;1UF,20%,35V,-,TP,3528,- C208 2203-000477 C-CERAMIC,CHIP;1UF,+80-20%,16V,Y5V,TP,2012,- C209 2203-001556 C-CERAMIC,CHIP;100NF,+80-20%,25V,Y5V,TP,1608,...
  • Page 55 1003-001099 IC-CLOCK DRIVER;MN3112SA,SOP,20P,255MIL,SINGLE IC203 1204-001257 IC-VIDEO PROCESS;NN2038FAQ,QFP,48P,472MIL,PLAST IC204 1205-001165 IC-GENERATOR;MN5246,QFP,64P,-,PLASTIC,7.0V, IC205 AC14-12006V IC-LINEAR;KAD0228,SOP,- IC206 AC14-12009X IC;MB88346B,VSOP,- IC207 0801-000301 IC-CMOS LOGIC;7W04,INVERTER,SOP,8P,150MIL,TR IC301 AD13-10030C IC-ASIC;-,SMA9606,QFP,80P,CNTR&INTERFA IC302 1105-001083 IC-DRAM;416C256,256KX16BIT,SOP,40P,400 IC304 AD09-10450N IC-MCU(OTP);HD6477043F28,144P,DIP,RISC MC, IC305 0801-000301 IC-CMOS LOGIC;7W04,INVERTER,SOP,8P,150MIL,TR IC307 1107-001054 IC-FLASH MEMORY;5832,4MX8BIT,SOP,44P,400MIL,10 Samsung Electronics...
  • Page 56 2007-001442 R-CHIP;10OHM,5%,1/16W,DA,TP,1608 R219 2007-001442 R-CHIP;10OHM,5%,1/16W,DA,TP,1608 R220 2007-000077 R-CHIP;470OHM,5%,1/16W,DA,TP,1608 R221 2007-001442 R-CHIP;10OHM,5%,1/16W,DA,TP,1608 R222 2007-000119 R-CHIP;560OHM,5%,1/16W,DA,TP,1608 R224 2007-000074 R-CHIP;100OHM,5%,1/16W,DA,TP,1608 R232 2007-000102 R-CHIP;100KOHM,5%,1/16W,DA,TP,1608 R233 2007-000102 R-CHIP;100KOHM,5%,1/16W,DA,TP,1608 R234 2007-000078 R-CHIP;1KOHM,5%,1/16W,DA,TP,1608 R235 2007-000125 R-CHIP;3.9KOHM,5%,1/16W,DA,TP,1608 R236 2007-000074 R-CHIP;100OHM,5%,1/16W,DA,TP,1608 R237 2007-000074 R-CHIP;100OHM,5%,1/16W,DA,TP,1608 R239 2007-000092 R-CHIP;15KOHM,5%,1/16W,DA,TP,1608 Samsung Electronics...
  • Page 57 R-NETWORK;RN 1/16 FV 8P 101-J T MNR14-J-101 CS96 R383 2007-000102 R-CHIP;100KOHM,5%,1/16W,DA,TP,1608 R392 2007-000102 R-CHIP;100KOHM,5%,1/16W,DA,TP,1608 S301 3408-000300 SWITCH-SLIDE;5V,200MA,-,- X201 2801-003378 CRYSTAL-SMD;24.54545MHZ,30PPM,28-ABL,11.1P X301 2801-003392 CRYSTAL-SMD;7.15909MHZ,30PPM,28-ABN,16.5PF DC/DC PARTS C101 2404-000139 C-TA,CHIP;10UF,20%,6.3V,-,TP,3216,- C102 2203-001556 C-CERAMIC,CHIP;100NF,+80-20%,25V,Y5V,TP,1608, C103 2203-001556 C-CERAMIC,CHIP;100NF,+80-20%,25V,Y5V,TP,1608, C104 2203-000477 C-CERAMIC,CHIP;1UF,+80-20%,16V,Y5V,TP,2012,- C105 2404-000120 C-TA,CHIP;10UF,20%,10V,-,TP,3528,- C121 2404-000120 C-TA,CHIP;10UF,20%,10V,-,TP,3528,- Samsung Electronics...
  • Page 58 3601-000365 FUSE-SMD;125V,1.5A,VERY FAST ACT,CERAMI Q101 0504-000113 TR-DIGITAL;DTC144EUA,NPN,200MW,47K-47K,SC Q121 0504-000113 TR-DIGITAL;DTC144EUA,NPN,200MW,47K-47K,SC Q122 0502-001054 TR-POWER;KSD1621,NPN,500MW,SOT-89,TP,14 Q141 0504-000113 TR-DIGITAL;DTC144EUA,NPN,200MW,47K-47K,SC Q142 0502-001054 TR-POWER;KSD1621,NPN,500MW,SOT-89,TP,14 Q198 0504-000113 TR-DIGITAL;DTC144EUA,NPN,200MW,47K-47K,SC Q199 0501-000172 TR-SMALL SIGNAL;2SB1121,PNP,500MW,PCP,TP,100-5 R101 2007-000070 R-CHIP;0OHM,5%,1/16W,DA,TP,1608 R102 2007-000539 R-CHIP;200OHM,5%,1/16W,DA,TP,1608 R103 2007-000107 R-CHIP;470KOHM,5%,1/16W,DA,TP,1608 R104 2007-000119 R-CHIP;560OHM,5%,1/16W,DA,TP,1608 Samsung Electronics...
  • Page 59 D502 0403-001126 DIODE-ZENER;UDZ18D,10%,200MW,UMD2,TP D503 0403-001126 DIODE-ZENER;UDZ18D,10%,200MW,UMD2,TP D504 0403-001126 DIODE-ZENER;UDZ18D,10%,200MW,UMD2,TP D507 0403-001126 DIODE-ZENER;UDZ18D,10%,200MW,UMD2,TP D508 0403-001126 DIODE-ZENER;UDZ18D,10%,200MW,UMD2,TP D509 0404-000150 DIODE-SCH0TTKY;EC10QS04,40V,1A,SMD,TP IC501 AC14-12013Y IC-LINEAR;MAX232CWE,SOP BULK,RS232-DRIVE J501 3722-000465 JACK-DC POWER;1P/1C,PI4.4,AG,BLK,- J502 AD37-20001A JACK-PHONE;HSJ1456-012220,AU L501 2703-000403 INDUCTOR-SMD;22UH,10%,3.2X2.5X2.2MM LED501 0601-000208 LED;CHIP,RED,1.5X2MM,660NM SW510 3408-000141 SWITCH-SLIDE;15V,100MA,-,- Samsung Electronics...
  • Page 60 C605 2203-000426 C-CERAMIC,CHIP;18PF,5%,50V,NPO,TP,1608,- C606 2203-000426 C-CERAMIC,CHIP;18PF,5%,50V,NPO,TP,1608,- C607 2203-000477 C-CERAMIC,CHIP;1UF,+80-20%,16V,Y5V,TP,2012,- CN601 3711-003540 CONNECTOR-HEADER;BOX,20P,2R,1MM,SMD-A,SN IC601 AD11-10020B MASK-ROM;UPD75P3116,64P,QFP,SV-D100,8BI L601 2703-000403 INDUCTOR-SMD;22UH,10%,3.2X2.5X2.2MM LCD01 AD07-10032L LCD-PANNEL;DP,LS-0690A,SDC-30,- R601 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R602 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R603 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R604 2007-000124 R-CHIP;2.2KOHM,5%,1/16W,DA,TP,1608 R605 2007-000076 R-CHIP;330OHM,5%,1/16W,DA,TP,1608 R606 2007-000130 R-CHIP;39KOHM,5%,1/16W,DA,TP,1608 R607 2007-000097 R-CHIP;47KOHM,5%,1/16W,DA,TP,1608...
  • Page 61 Electrical Parts List MEMO Samsung Electronics...

  • Page 62: Block Diagram

    9. Block Diagram Samsung Electronics...

  • Page 63: Pcb Diagrams

    Jack - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10-2 10-3 Function - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10-3 Samsung Electronics 10-1...
  • Page 64 IC100 IC303 IC120 IC305 IC307 Q201 IC206 Q303 IC302 Q198 IC301 Q121 IC205 Q141 IC202 Q199 IC203 Q142 (Component Side) (Conductor Side) 10-2 Jack LOCATION COORDINATES LOCATION COORDINATES CN501 J502 CN502 J501 IC501 (Component Side) (Conductor Side) 10-2 Samsung Electronics...
  • Page 65 PCB Diagrams 10-3 Function LOCATION COORDINATES LOCATION COORDINATES CN601 IC601 CN602 (Component Side) (Conductor Side) 10-3 Samsung Electronics...

  • Page 66: Schematic Diagrams

    Jack - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-5 11-4 Function - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-6 Samsung Electronics 11-1...
  • Page 67 Components identified with the mark ! have the special characteristics for safety. When replacing any of these components. Use only the same type. 3 Block Identification of Main PCB ( Component Side ) ( Conductor Side ) 11-2 Samsung Electronics...
  • Page 68 Schematic Diagrams 11-1. DC/DC Samsung Electronics 11-3...
  • Page 69 Schematic Diagrams DIGITAL SIGNAL ANALOG SIGNAL 11-2. Main JPEG SIGNAL CN206 DC/DC CN301 11-4 Samsung Electronics...
  • Page 70 Schematic Diagrams 11-3. Jack Samsung Electronics 11-5...
  • Page 71 Schematic Diagrams 11-4. Function 11-6 Samsung Electronics...

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Sdc-33

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