1 Overview .......................................................................................................................... 5
2 Features ........................................................................................................................... 7
2.1 Main Features .................................................................................................................................. 7
2.2 Technical Specifications ................................................................................................................... 8
2.2.1 Hardware ................................................................................................................................. 8
3.1 Packet Data Service ........................................................................................................................ 11
4 System Architecture ..................................................................................................... 12
4.1 System Architecture ....................................................................................................................... 12
4.2 Functional Modules ........................................................................................................................ 13
5 Technical Reference ..................................................................................................... 14
5.7 General Specifications ................................................................................................................... 15
5.9 SIM Specifications .......................................................................................................................... 16
6 Packing List ................................................................................................................... 17
Issue 03 (2014-3-21)
Commercial in Confidence
HiLink E303 HSPA USB Stick V100R001
Product Description
Contents
Page 4 of 20