Table Of Contents; Ic6001 - Sony ICD-ST25 Service Manual

ICD-ST25

TABLE OF CONTENTS

1. GENERAL
·········································································· 3
2. DISASSEMBLY
2-1. Case Block Assy ··························································· 4
2-2. F-SW Board ·································································· 5
2-3. MAIN Board ································································· 5
2-4. S-SW Board, Microphone Block Assy ························· 6
2-5. Microphone Unit ··························································· 7
2-6. The Cautions At The Time Of A Microphone
Block Assy ··································································· 8
3. TEST MODE
······································································ 9
4. DIAGRAMS
4-1. Block Diagrams
- MAIN Section -1 - ·················································· 13
- MAIN Section -2 - ·················································· 14
- PANEL/POWER Section - ······································ 15
4-2. Printed Wiring Board - MAIN Board (Side A) - ······· 16
4-3. Printed Wiring Board - MAIN Board (Side B) - ······· 17
4-4. Printed Wiring Board - F-SW Board - ······················· 18
4-5. Printed Wiring Board - S-SW Board - ······················· 19
4-6. Schematic Diagram - MAIN Board (1/5) - ··············· 20
4-7. Schematic Diagram - MAIN Board (2/5) - ··············· 21
4-8. Schematic Diagram - MAIN Board (3/5) - ··············· 22
4-9. Schematic Diagram - MAIN Board (4/5) - ··············· 23
4-10. Schematic Diagram - MAIN Board (5/5) - ··············· 24
4-11. IC Pin Function Descriptions ······································ 29
5. EXPLODED VIEWS
5-1. Upper Lid Block ························································· 34
5-2. Case Block ·································································· 35
6. ELECTRICAL PARTS LIST
2
······································· 36
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Replacement of IC6001 used in this set requires a special tool.
• The voltage and waveform of CSP (chip size package) cannot be
measured, because its lead layout is different from that of conven-
tional IC.
• Lead layouts
Lead layout of
conventional IC
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
surface
CSP (chip size package)