Table of Contents
Summary of Contents for ZTEWelink Z-Wave ZM5202
- Page 1 Hardware Development Guide of Module Product Hardware Development Guide of Module Product Product Model No:ZM5202 Document Version: 2.0 Release Date: 2013-05-31 All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
- Page 2 By accepting this certain document of Shenzhen ZTEWelink Technology CO., LTD. (hereinafter referred to as “ZTEWelink”) you agree to the following terms. If you do not agree to the following terms, please notice that you are not allowed to use this document.
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Page 3: Revision History
Modify the Figure 7-2 of Main and AGPS Antenna Welding Pad Interface 15. Modify the Figure 7-1 of Main Antenna RF Connector Interface 16. Modify Figure 2-1 of Product Illustration 2013-05-31 17. Release as Version 2.0 All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 4: Table Of Contents
3.4.2 Requirement of Power Supply ..................16 (U)SIM Card Interface ....................17 3.5.1 Description of PINs ......................17 3.5.2 Electric Feature ......................17 3.5.3 Application of (U)SIM Card Interface ................18 All Rights reserved, No Spreading abroad without Permission of ZTEWelink... - Page 5 3.12.1 Description of PINs ......................29 3.12.2 Interface Application ...................... 30 Electric Feature ..................... 31 Power Feature........................ 31 4.1.1 Power Supply ......................... 31 4.1.2 Working Current ......................31 Power-on/Power-off Flow ....................32 All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
- Page 6 Suggestions for Heat-dissipation Design ............... 48 Recommended Product Upgrading Plan ............... 49 Manufacturing Guide ..................50 Design of Steel Mesh ..................... 50 Furnace Temperature Curve ..................50 FCC Regulations ................... 51 All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
- Page 7 Figure 7-4 T esting Cable .................... 45 Figure 8-1 Recommended Pattern of Steel Mesh on Wielding panel ......50 Figure 8-2 Furnace Temperature Curve Reference Diagram ........53 Figure 8-3 T esting Result.................... 53 All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
- Page 8 Table 6-5 Temperature Testing Result Under Windless Environment ......40 Table 6-6 H igh/Low-temperature Running & Storage Testing Result ......40 Table 8-1 Curve Temperature Curve Parameter Setting ..........52 VIII All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
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Page 9: About This Document
Supported & Reference Document List Besides the hardware development document, ZTEWelink also provides the board operation guide, software development guide and upgrading plan guide of ZM5202. Table 1-1 is the list of supported documents. -
Page 10: Abbreviations
Wideband Code Division Multi Access UMTS Universal Mobile Telecommunication System Bit Error Rate Downlink DPCH Dedicated Physical Channel DPCH_Ec Average energy per PN chip for DPCH. DPCH Subscriber Identification Module All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 11: Product Overview
2.5+/-0.2mm. The location of PIN 1 is identified by the ground wielding panel with an inclination at the bottom, and its angle orientates to the top All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 12: Figure 2-2 Module Dimensions
Hardware Development Guide of Module Product welding panel of the corresponding module. Figure 2-2 is a figure about the dimensions of ZM5202 module. Figure 2-2 Module Dimensions (a)Dimensions on Top plane (b) Thickness (c) Bottom All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 13: Technical Parameters
The major features of ZM5202 can be described from the aspects of mechanic feature, base band, radio frequency, technical standard and e nvironment feature. Table 2-1 is a l ist of the major technical parameters and f eatures supported by ZM5202. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 14: Table 2-1 Major Technical Parameters
GSM/GPRS 1800MHz/1900MHz: Power Class 1 (+30dBm transmitter ±2dBm) power EDGE 850MHz/900MHz: Power Class E2 (+27dBm ±3dBm) EDGE 1800MHz/1900MHz: Power Class E2 (+26dBm -4/+3dBm) WCDMA2100 : ≤-106.7dBm Receiving WCDMA1900/850 : ≤-104.7dBm sensitivity WCDMA900 : ≤-103.7dBm All Rights reserved, No Spreading abroad without Permission of ZTEWelink... - Page 15 Support the GPS wielding panel interface, support the diversity diversity antenna interface; but they are not supported simultaneously. (GPS) ZTEWelink does not provide the antenna, and the antenna is antenna provided by the third party. interface GSM CS: UL 9.6kbps/DL 9.6kbps...
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Page 16: Function Overview
The radio frequency function of ZM5202 can be viewed from the aspect of over-the-air wireless bearer network, frequency band, whether the receive diversity feature is supported, and the GPS function. Support WCDMA 850(900)/1900/2100MHz; Support GSM/EDGE/GPRS 850/900/1800/1900 MHz; All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 17: Table 2-2 Working Frequency Band
869 MHz — 894 MHz GSM900 890 MHz — 915MHz 935 MHz — 960MHz GSM1800 1710 MHz — 1785MHz 1805 MHz — 1880MHz GSM1900 1850 MHz — 1910MHz 1930 MHz — 1990MHz All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 18: Interfaces
PIN internal pull-up PIN internal pull-down A, AI, AO, AIO Analog circuit 3.1.2 PIN Configuration Diagram The PIN sequence of interfaces on ZM5202 is defined as shown in Figure 3-1. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 19: Pin Description
Hardware Development Guide of Module Product Figure 3-1 PIN Configuration Diagram 3.1.3 PIN Description Table 3-2 PIN Interface Definition All Rights reserved, No Spreading abroad without Permission of ZTEWelink... - Page 20 MODULE power-on If it is not used, NC status indicator LED_GREEN Signal indicator If it is not used, NC interface LED_RED Signal indicator If it is not used, NC interface All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
- Page 21 SPI data IO signal If it is not used, NC USB_VBUS USB _VBUS power attention power-on sequence of VPH_PWR, mandatory. ground Mandatory USB_DP USB data cable Mandatory USB_DM USB data cable Mandatory All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
- Page 22 If it is not used, NC Ground If it is not used, NC JTAG_TRST_N If it is not used, NC JTAG_RTCK If it is not used, NC JTAG_TCK If it is not used, NC All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
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Page 23: Working Condition
VPH_PWR works within the voltage range, it can reach good whole-set performance. If it is lower than the minimum value, the whole-set performance will be affected, or the module cannot work normally. If it is higher than the maximum value, the module might be damaged. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 24: Feature Of Interface Power Level
2G mode can reach as high as 2A. So the power supply capacity for peak current needs to be ab ove 2.5A, and the average peak current needs to be above 0.9A. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 25: U)Sim Card Interface
It is recommended to make the grounding protection for UIM_CLK and UIM_DATA signal wiring. Cascade one 0.1uF and 33pF capacitor between VREG_RSIM and GND, and cascade a 33pF capacitor All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 26: Application Of (U)Sim Card Interface
SDCC_DATA3 SD card data cable PIN SD control clock output SDCC_CLK SD card clock cable PIN can reach up to 20MHz SDCC_CMD SD card control PIN VREG_MMC SD card power All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 27: Electric Feature
Figure 3-3 is the reference design diagram for the SD interface. The detection of SD card adopts the polling mode of DATA3 signal cable to judge whether T card is inserted or not. Figure 3-3 SD Typical Application Circuit All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 28: Usb2.0 Interface
1.5pF. 3.7.3 Application of USB Interface The USB bus is mainly used in data transmission, software upgrading and modular program detection. Figure 3-4 shows a reference circuit design. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 29: Serial Interface
Main input, slave output 3.8.1.2 Electric Feature The SPI bus of ZM5202 is configured as the master equipment, and there are three modes for SPI: Running mode: Basic running mode. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 30: I2C Bus
Each equipment is identified by the unique address (such as the micro controller, storage, LCD driver, audio DAC or keyboard interface). Due to the different functions of the equipment, it can be used as both the sender and the receiver. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 31: Figure 3-6 I2C Reference Circuit Diagram
100kbps; high-speed mode with a speed as high as 400kbps. Figure 3-6 is the I2C reference circuit design diagram. Figure 3-6 I2C Reference Circuit Diagram All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 32: Uart Interface
If the module is used together with the application processor, and the PWL matches with 1.8V, the connection mode is as shown in Figure 3-7. The All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 33: Figure 3-7 Module Serial Port & Ap Application Processor
UART_TXD TTL- RS232_TXD 1.8V RS232 UART_CTS RS232_CTS -TTL ZM5202 level UART_RXD level RS232_RXD module translator translator UART_RFR RS232_RTS UART_DTR RS232_DTR SP3238 NLSX5014MUTAG RS232_RI UART_RI MAX3238 Note:UART_RFR is equal to UART_RTS. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 34: Jtag (Joint Test Action Group) Interface
Within the module, POWER_ON PIN is pulled via a 200 K resistance to 1.8V power. To power on, if it does not need to be powered down, process POWER_ON according to the figure below. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 35: Interface Application
Table 3-9. In this figure, the two input signals on t he left are the input control signals for reset and power-on respectively. Figure 3-10 Recommended Circuit for Power-on/Power-off & Reset All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 36: Interactive Application Interface
PWL indicates the wakeup status. AP_WAKEUP_MODULE: After the module has entered the sleep status, the AP server can wake up the module by the low PWL control; if it’s always on the low All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 37: Led Indicator Interface
Description of PINs Table 3-11 Definition of LED PIN Signal Signal Name I/O Type Function Module signal indicator LED_GREEN interface Module signal indicator LED_RED interface Module signal indicator LED_BLUE interface All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 38: Interface Application
BLUE indicator Have been registered to 3G always on network Have been registered to 3G BLUE indicator network, and there is data service flashing as well. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 39: Electric Feature
Note: The above average current is acquired under the maximum transmission power. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 40: Power-On/Power-Off Flow
PWL. After VPH_PWR is established normally, the interval between it to the POWER_ON signal cannot be too short. Refer to T2 parameter. ZTEWelink recommends that VPH_PWR adopt the power-off plan that does not disconnect the power supply. -
Page 41: Figure 4-1 Power-On Sequence Chart Of Zm5202 Module
PWL From the releasing the Power-on second button for power off operation to the power off of VPH_PWR and USB_VBUS All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 42: Resetting Flow
The PON_RST_N reset signal of ZM5202 module is the increasing resetting, so it is reset after decreasing this PIN by 100ms. Figure 4-3 is the module resetting flow. Figure 4-3 Module Resetting Flow PON_RST_N 100ms All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 43: Technical Index Of Radio Frequency
The sourced index is also called the OTA index, including TRP (all-round radiation power), TIS (all-round receiving sensitivity), radiation orientation diagram, which is an important index measuring the radiation performance of the whole set (including the antenna, module, circuit main board). All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 44: Sourceless Index
Here, taking the 3G Internet notepad as an example, the sourced index of the antenna is recommended as below. TRP: <W850/W900/W1900/W2100>18dBm; GSM850>27dBm, GSM900>27dBm; DCS1800>24dBm, PCS1900>24dBm>; TIS: <W850/W900<-100dBm; W1900/W2100<-103dBm; GSM850<-100dBm, GSM900<-100dBm; DCS1800/PCS1900<-102dBm. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 45: Related Test & Testing Standard
Basic environment experiment of electronic products-Part2:Experiment method Try Fd: Broad frequency band random vibration (General requirement) TIA/EIA 603 3.3.5 TIA Standard-part3-5:Shock Stability Note: 1. IECL International Electro technical Commission; 2. GB/T: Recommended national standard All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 46: Description Of Testing Environment
RF test Comprehensive testing device RF cable Tower antenna Microwave darkroom High/Low-temperature High/Low-temperature running & storage test experimental box Temperature shock Temperature shock test experimental box Vibration test Vibration console All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 47: Reliability Testing Environment
Humidity: 95% Duration: 48 hours High temperature IEC 68-2-1 Ab Temperature: 85 ° C storage: Duration: 24 hours Low temperature IEC 68-2-2 Bb Temperature: -40 ° C storage: Duration: 24 hours All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 48: Reliability Testing Result
RF test & function high-temperature test working Pass Low-temperature Refer to Table 6-4 RF test & function storage test Pass High-temperature Refer to Table 6-4 RF test & function storage test All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 49: Design Guide
USB of high-speed signal cable is required to have 90ohm differential resistance. For the common signal interface, it is required to design according to ZTEWelink requirements, which needs to comply with the power level of interface signal, so as to prevent the impedance from damaging the module. -
Page 50: Rf Circuit Design
Figure 7-2 Interface of Main Antenna and AGPS Antenna Welding Pad Figure 7-3 shows the interface between the antenna and the GPS antenna. Currently, ZTEWelink adopts the W.FL-R-SMT-1 RF connector testing console from HRS company, as shown in Figure 7-1 Main Antenna RF Connector Interface... - Page 51 Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
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Page 52: Figure 7-2 Interface Of Main Antenna And Agps Antenna Welding Pad
Figure 7-4. When this connection mode is adopted, the antenna RF connector can be directly inserted to the RF testing console of the module, so it saves the connection between the RF port and the antenna interface. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 53: Precautions During The Initial Design Of Antenna
Place the antenna in a location that the hand cannot reach, to prevent from the attenuation generated by the body. Also take into consideration the reduction of radiation and the feasibility of All Rights reserved, No Spreading abroad without Permission of ZTEWelink... - Page 54 RF cable. At the same time, the RF cable should better be far away from FSB, chip and storage, power interface, data cable interface, and other modules or devices that might generate EMI. The connection antenna and the RF connection cable of All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
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Page 55: Suggestions For Emc & Esd Design
ZM5202 is embedded on the side of system board, so the user needs to make the ESD protection during design. For the key input/output signal interface, such as the All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 56: Suggestions For Pcb Wielding Panel Design
. Do not put the module close to the large heat-dissipation devices, such as CPU or bridge. The high temperature will affect the RF performance. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 57: Recommended Product Upgrading Plan
Recommended Product Upgrading Plan It’s recommended to use the one-click software upgrade tool to upgrade through the USB port provided by ZTEWelink in the Windows system. If the customer wants to upgrade the module in other operation systems, ZTEWelink provides the corresponding reliable tools too. -
Page 58: Manufacturing Guide
(such as the crystal) might crack under the high temperature and won’t not vibrate any more, so the product function is affected. Refer to Table 8-1 for the setting of furnace temperature curve, refer to Figure 8-2 for the furnace temperature All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 59: Fcc Regulations
Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 60: Table 8-1 Curve Temperature Curve Parameter Setting
150℃ <3℃/second Temperature 150℃~200℃ 40~110 keeping seconds Wielding Greater than 217℃ 40~70 seconds Above 230℃ 15~45 seconds Peak temperature MAX: 245℃ MIN: 230℃ All Rights reserved, No Spreading abroad without Permission of ZTEWelink... -
Page 61: Figure 8-2 Furnace Temperature Curve Reference Diagram
Hardware Development Guide of Module Product Figure 8-1 Furnace Temperature Curve Reference Diagram Figure 8-2 Testing Result All Rights reserved, No Spreading abroad without Permission of ZTEWelink...
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