Page 1 PLASMA DISPLAY TV Chassis : D53A Model: SPL4225X/XAA PLASMA DIAPLAY TV C O N T E N T S Precautions Reference Information Specifications Alignment and Adjustments Circuit Operation Description Troubleshooting Exploded View and Parts List Electric Parts List Handling Description...
Page 3: Safety Precautions
The current measured should not exceed 3.5 milliamp. Reverse the power- plug prongs in the AC outlet and repeat the test. Samsung Electronics...
Page 4 Always determine the cause of damage or overheat- ing, and correct any potential hazards. 14. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC and high Samsung Electronics...
Page 5: Servicing Precautions
Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed. 7. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead; always remove the instrument’s ground lead last. Samsung Electronics...
Page 6: Precautions For Electrostatically Sensitive Devices (Esds)
These servicing instructions are for use by qualified service personnel only. To reduce the risk of electric shock do not perform any servicing other than that contained in the operating instructions unless you are qualified to do so. Samsung Electronics...
Page 7: Reference Information
Millimeter Hour Millisecond Inches Per Second Millivolt Kilowatt-hour Nanofarad Ω Kilogram Kilohertz Picofarad kΩ Kilohm Pound Kilometer Revolutions Per Minute km/h Kilometer Per Hour Revolutions Per Second Kilovolt Second (Time) Kilovolt-ampere Volt Kilowatt Volt-ampere Liter Watt Megahertz Watt-hour Samsung Electronics...
Page 8 Fail Safe Voltage Controlled Oscillator Ground VCXO Voltage Controlled Crystal Oscillator Green-Y Very High Frequency High Video Intermediate Frequency High-Frequency Variable Resistor HI-FI High Fidelity Video Tape Recorder Inductance-Capacitance VTVM Vacuum Tube Voltmeter Integrated Circuit Transistor Intermediate Frequency Samsung Electronics...
Page 9: Specifications
852(H) X 480(V) Screen Size 106Cm / 42 Inches VIDEO / S-VIDEO COMPONENT 1 AUDIO Input COMPONENT 2 PC (RGB) AUDIO Output 7W + 7W (8Ω) VIDEO S-VIDEO COMPONETN 1 -480i / 480p VIDEO Input COMPONETN 2 -480p~1080i PC (RGB) Samsung Electronics...
Page 10 MENO Samsung Electronics...
Page 11: Alignment And Adjustments
Joystick UP/DOWN Cursor move to select items Joystick (LEFT/RIGHT) Enable to increase and decrease the data of the selected items # Notice 1. In case of no signal in ALL MODE. entry into the FACTORY MODE cannot be made. Samsung Electronics...
Page 12 DO NOT ENTER LPF GAIN 0 ~ 7 DO NOT ENTER BPF GAIN 0 ~ 15 DO NOT ENTER HPF GAIN 0 ~ 15 DO NOT ENTER PHACOM 0 ~ 2 DO NOT ENTER 0 , 1 DO NOT ENTER Samsung Electronics...
Page 13 Default of MODE Range VIDEO / S-VHS /DVD OUT DELAY 0 ~ 255 DO NOT ENTER TNRCLY 0 ~ 15 DO NOT ENTER TNRCNC 0 ~ 15 DO NOT ENTER STOP MODE 0 ~ 7 DO NOT ENTER Samsung Electronics...
Page 14 0 ~ 3 CTI Level 0 ~ 63 Contrast 0 ~ 3 LTI Level 0 ~ 3 Bright DC-Tran 0 ~ 3 0 ~ 15 Cr Offset1 0 ~ 3 D-Pic 0 ~ 15 CB Offset1 DO NOT Drive ENTER Samsung Electronics...
Page 15 0 ~ 7 0 (Fix) 4-1-3(G) OSD POSITION Item Range Default Description Horiz Horiz (Left,Right) -128 ~ +128 Move 8 by 8 (Total: 33 Step), Fixed Vert Vert (Up,Down) -24 ~ +24 Move 8 by 8 (Total: 7 Step), Fixed Samsung Electronics...
Page 16 0 Sec Pixel Shift SEC 0 Sec ~ 59 Sec Off ↔ On Fan Protect Off ↔ On Temp Protect Sharpness 0 ~ 15 English → Espania → English English Base Language English English France → Korea → English Samsung Electronics...
Page 17 : 274 ± : 3 H-LIGHT y : 275 ± : 3 ± : 3 Y : 30.8[f\] ± : 5 x : 313 ± : 5 L-LIGHT y : 275 ± : 0.1 Y : 0.59[f\] Samsung Electronics...
Page 18 : 280 ± : 3 H-LIGHT y : 278 ± : 3 ± : 2 Y : 16.4[f\] ± : 5 x : 298 ± : 5 L-LIGHT y : 244 ± : 0.1 Y : 1.19[f\] Samsung Electronics...
Page 19 Alignment and Adjustments Alignment and Adjustments 4-2 SPL4225 PC Input Mode Samsung Electronics...
Page 20 VR in 7 n Vs is 175±5V n Va is the voltage of the no.7 PIN of SX Connector. n Voltage adjustment is made for Va by using right VR in 6 n Va is 75±5V 4-10 Samsung Electronics...
Page 21 Alignment and Adjustments Alignment and Adjustments l Vw Adjustment Method n Vw is the voltage of the right terminal for R4414 n Voltage adjustment is made for Vw by using VR4400 n Standard voltage for Vw is 175V±5V Samsung Electronics 4-11...
Page 22 Between E and C Infinity Infinity l For PNP(KSA539-Y) C (COLLECTOR) B(BASE) E (EMITTER) Forward Direction Reverse Direction Between B and E Hundreds of ohms Infinity Between B and C Hundreds of ohms Infinity Between E and C Infinity Infinity 4-12 Samsung Electronics...
Page 23 DIODE. Forward Direction Hundreds of ohms Varying depending on IC but generally normal Reverse Direction Infinity in DIODE TEST MODE › Defects have SHORT(0 ohm) for both forward and reverse direction. Samsung Electronics 4-13...
Page 24 MEMO 4-14 Samsung Electronics...
Page 25: Troubleshooting
Replace SMPS Abnormal LED Light-on Replace Logic B d (Power, Sink) Normal X-B d Connect Power Abnormal X-B d Output Replace X-B d Normal Y-B d Connect Power Abnormal Replace Y-B d Y-B d Output Normal Replace Panel Samsung Electronics...
Page 26: Partly No Screen
Replace Upper Scan Buffer B d Upper part no screen Lower part no scree Replace Lower Scan Buffer B d Replace Corresponding 1//14 Screen part Address Buffer B d Abnormal Replace Panel 1/28 no screen 1/7 no screen Replace Panel Samsung Electronics...
Page 27 - After separating Y Main and Y buffer board, - Check the Diode between OUTL and OUTH, and make sure that the forward voltage drop is between 0.4 and 0.5V. - Check that the resistance between the two terminals is more than several kW. Samsung Electronics...
Page 28 6-3-2 Y Main - After connecting Y main and Y buffer board, check that one of the output waveforms from OUT 1, 2, 3 or 4 is the same as that of the appendix 1 when power is supplied. Samsung Electronics...
Page 29 Troubleshooting 6-3-3 X Board - Check that one of the output waveforms from X-OUT 1 or 2 is the same as that of the appendix 2 when power is supplied. X- OUT1 X- OUT1 Samsung Electronics...
Page 30 (4) In case of VA, check that D303 is short (5) In case of VS, check that pin 2 and 3 of Q303 are short (6) In case of Q6S, check that pin 2 and 3 are short (7) Check that BRD101S is short Samsung Electronics...
Page 31 - Check the output signal GCLK (pin 115). The GCLK is differently seen according to the PC input signal format(VGA, SVGA, XGA). GCLK = 15MHz ~ 50MHz This value is apparently half of the clock frequency of the relevant PC input signal format. - Check digital data output. Samsung Electronics...
Page 32 Parity : None Stop Bit : 1 Flow Control : None - Whenever the Reset switch is pressed, the following is displayed on the PC hyper terminal screen. CBooter V1.5 & 2000.01.26 CBooter V1.5 & 2000.01.26 CBooter V1.5 & 2000.01.26 Samsung Electronics...
Page 33 Exploded View & Parts List 7. Exploded View & Parts List 7-1 SPL4225X/XAA Samsung Electronics...
Page 34 ,S42SD,D51A,D53A,42INCH,1F2A, -,SUS304,-,-,OD6,N7,OD6,-,-,-,- SPRING-CS AA61-60003J ASSY PDP P-PBA-MAIN BN96-00074A SDI CODE LJ92-000573A BRACKET-FILTER SIDE L, ASSY AA61-01061A AL 6063 EXT,42P2,T1.2 ASSY PCB MISC-SCALER BN94-00293A SPL4225X/XAA,D53A WINDOW-RMC AA64-01549B PDP,ACRYL VIOLET,20.1 WP,PH,+,M8,L16,ZPC(BLK),SWRCH SCREW-ASS’Y MACH 6006-001112 ASSY SUB PCB, REMOCON AA95-01837F SPD-42P2S,D51A,AA95-01560A SCREW-TAPTITE 6003-000333 RH,+,2S,M3,L10,ZPC(YEL),SWRCHI SCREW-ASS’Y MACH...
Page 35: Electrical Parts List
Electrical Parts List 8. Electrical Parts List 8-1 PARTS LIST FOR SERVICE Samsung Electronics...
Page 36 Description ; Specification Remark ASSY MISC-PDP PBA ..5 C692 2203-005809 C-CERAMIC,CHIP;1000nF,10%,16V,X7R,TP,201 ..5 C694 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..5 C695 2203-000239 C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,2012 BN91-00382A ASSY MISC-PDP PBA;SPL4225X/XAA S.N.A ..5 C696 2203-005809 C-CERAMIC,CHIP;1000nF,10%,16V,X7R,TP,201 ..5 C698 2203-000239 C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,2012 AA39-00301A LEAD CONNECTOR ASSY;PS-42P2S,UL1007#26,U ..5 C699 2203-000239 C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,2012 AA39-00114F CBF HARNESS;,12P,35155-1200,S,100MM,1007...
Page 37 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012 ..4 R14 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM ..4 C212 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012 ...3 0202-000187 SOLDER-WIRE FLUX;-,RS60S,D1.2,63Sn/37Pb S.N.A ..4 C213 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012 BN94-00293A ASSY PCB MISC-SCALER;SPL4225X/XAA,D53A ..4 C214 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012 ...3 B601 4301-000108 BATTERY-LI;3V,220mAH,BUTTON,20x3.2mm,NO ..4 C216 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 ...3 CN301 3711-002645 CONNECTOR-HEADER;BOX,6P,1R,2.5mm,STRAIGH ..4 C219 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012...
Page 38 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.4 ..4 C467 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C347 2203-000784 C-CERAMIC,CHIP;0.33nF,5%,50V,NP0,TP,2012 ..4 C501 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 C348 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.4 ..4 C504 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 C349 2203-000784 C-CERAMIC,CHIP;0.33nF,5%,50V,NP0,TP,2012 ..4 C505 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 C350 2203-000784 C-CERAMIC,CHIP;0.33nF,5%,50V,NP0,TP,2012 ..4 C506 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 Samsung Electronics...
Page 39 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 CD21 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C587 2203-000661 C-CERAMIC,CHIP;0.27nF,5%,50V,NP0,TP,2012 ..4 CD22 2203-001034 C-CERAMIC,CHIP;5.6nF,10%,50V,X7R,TP,1608 ..4 C588 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 CD23 2402-000170 C-AL,SMD;1uF,20%,50V,GP,TP,4.3x4.3x5.4, ..4 C590 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CD24 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 C591 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CD41 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, Samsung Electronics...
Page 40 ..4 EF102 2901-001114 FILTER-EMI SMD;25VDC,2.0ADC,-,100nF,3.2x ..4 L513 3301-000319 CORE-FERRITE BEAD;AB,26ohm,2x1.25x0.9mm, ..4 EF201 2901-001114 FILTER-EMI SMD;25VDC,2.0ADC,-,100nF,3.2x ..4 LD09 2703-000271 INDUCTOR-SMD;4.7uH,10%,2x1.25x1.25mm ..4 EF204 2901-001114 FILTER-EMI SMD;25VDC,2.0ADC,-,100nF,3.2x ..4 LD10 3301-001186 CORE-FERRITE BEAD;AB,600ohm,3.2x1.6x1.3m ..4 EF205 2901-001114 FILTER-EMI SMD;25VDC,2.0ADC,-,100nF,3.2x ..4 OTP01 1107-001087 IC-FLASH MEMORY;29LV160,1Mx16BIT,SOP,48P Samsung Electronics...
Page 41 2007-000309 R-CHIP;10ohm,5%,1/16W,DA,TP,1608 ..4 R451 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..4 R308 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 ..4 R452 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..4 R309 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 R453 2007-000118 R-CHIP;390ohm,5%,1/16W,DA,TP,1608 ..4 R310 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..4 R460 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R311 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..4 R461 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 Samsung Electronics...
Page 42 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 ..4 RD16 2007-000119 R-CHIP;560ohm,5%,1/16W,DA,TP,1608 ..4 R581 2007-001167 R-CHIP;75ohm,5%,1/16W,DA,TP,1608 ..4 RD17 2007-000086 R-CHIP;5.6Kohm,5%,1/16W,DA,TP,1608 ..4 R582 2007-001167 R-CHIP;75ohm,5%,1/16W,DA,TP,1608 ..4 RD18 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R583 2007-001167 R-CHIP;75ohm,5%,1/16W,DA,TP,1608 ..4 RD19 2007-000119 R-CHIP;560ohm,5%,1/16W,DA,TP,1608 ..4 R584 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RD20 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 Samsung Electronics...
Page 43 ..4 RD83 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608 ..4 RD84 2007-000119 R-CHIP;560ohm,5%,1/16W,DA,TP,1608 ASSY COVER FRONT ..4 RD85 2007-000086 R-CHIP;5.6Kohm,5%,1/16W,DA,TP,1608 ..4 RD86 2007-000539 R-CHIP;200ohm,5%,1/16W,DA,TP,1608 BN90-00284A ASSY COVER FRONT;SPL4225X/XAA ..4 RD87 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 ..4 RD88 2007-000118 R-CHIP;390ohm,5%,1/16W,DA,TP,1608 ..2 BFB+CF 6003-001020 SCREW-TAPTITE;RH,+,B,M4,L10,ZPC(YEL),SWR S.N.A ..4 RD89 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608 ..2 BFS+CF 6003-001020 SCREW-TAPTITE;RH,+,B,M4,L10,ZPC(YEL),SWR...
Page 44 ...3 AA61-60003J SPRING-CS;-,SUS304,-,-,OD6,N7,OD6,-,-,-, S.N.A BN72-00315A SPONGE-EMI,BOT(R);PDP,SHELD FROM ASSY ACCESSORY BN92-00388A ASSY ACCESSORY;SPL4225X/XAA,SPL4225,ENG ASSY COVER REAR AA39-00033A CABLE-RCA;,2500MM BN90-00285A ASSY COVER REAR;SPL4225X/XAA S.N.A AA39-00300A CABLE RCA;PS42P2S,NON-UL,1P/1P,YEL,RCA,R AA39-00034B CABLE RCA;PS42P2S,NON-UL,2P/2P,RED/WHT,R AA91-01611D ASSY-CABINET,BACK;MIJU,HIPS V0 BLK,SPL42 BN68-00262A MANUAL USERS;SPL4225,ENG,USA,S/W100G,D52 ...3 COB+CB 6003-001020 SCREW-TAPTITE;RH,+,B,M4,L10,ZPC(YEL),SWR S.N.A 3301-001110 CORE-FERRITE;ZZ,35x19.5x9.0mm,-,-...
Page 45: Wirng Diagram
Wiring Diagram 11. Wirng Diagram Samsung Electronics 11-1...
Page 46 Wiring Diagram MENO 11-2 Samsung Electronics...
Page 47 Schematic Diagrams 12. Schematic Diagrams 12-1 SCALER1 SIGNAL INPUT, LVDS OUTPUT TP09 DTV/PC H-SYNC TP10 TP10 DTV/PC V-SYNC TP09 TP11 TP11 DTV/PC B-OUT Samsung Electronics 12-1...
Page 48 Schematic Diagrams 12-2 3D- COMB FILTER 12-2 Samsung Electronics...
Page 49 12-3 SCALER2 VIDEO DECODER MAIN, PROGRESSIVE CON. TP07 HOUT(IVHS) TP01 Main-Y IN 050-B-J 050-B-J TP03 TP04 TP08 VOUT(IVVS) TP02 Main-C IN TP02 TP01 TP05 TP03 VS-OUT TP06 TP04 HS-OUT TP05 TP06 TP04 TP03 TP05 LLC1 TP07 TP08 TP06 TP06 CLK2 Samsung Electronics 12-3...
Page 50 Schematic Diagrams 12-4 SCALER3 VIDEO DECODER PIP, FIRST IN/OUTPUT 12-4 Samsung Electronics...
Page 51 Schematic Diagrams 12-5 SCALER4 VIDEO DA CON. LVDS_RE Samsung Electronics 12-5...
Page 52 Schematic Diagrams 12-6 SCALER5 VIDEO PROCESSOR, SAND CASTLE PULSE GEN. TP12 HS-OUT TP12 TP13 VS-OUT TP13 TP14 SCP H-BLK TP15 SCP V-BLK TP16 TP15 TP16 SCP CLAMPER TP14 TP17 TP17 SCP 12-6 Samsung Electronics...
Page 53 Schematic Diagrams 12-7 SCALER7 ADC(PC) TP18 MHSYNC TP19 TP20 TP19 MHS TP2 PCLK TP18 Samsung Electronics 12-7...
Page 54 Schematic Diagrams 12-8 SCALER8 PW364 TP20 PCLK TP21 MCKEXT TP20 TP22 DCKEXT TP21 TP22 LVDS_RE 12-8 Samsung Electronics...
Page 55 Schematic Diagrams 12-9 SCALER9 POWER, DEGUGER, MEMORY, REMOCON, RS232, RTC 4.7K-J Samsung Electronics 12-9...
Page 56 Schematic Diagrams 12-10 SOUND 12-10 Samsung Electronics...
Page 57 Schematic Diagrams 12-11 LINE-FILTER, POWER SW, SPEAKER TERMINAL LINE-FILTER POWER SW SPEAKER TERMINAL Samsung Electronics 12-11...
Page 58 Schematic Diagrams 12-12 CONTROL, REMOCON CONTROL REMOCON 12-12 Samsung Electronics...
Page 59: Circuit Description
Vset +220V 0.05A +185V 0.05A +18.3V 0.3A Vfan +12V 0.8A 0.3A V5(A) 1.0A Analog IC Drive Voltage of Video Board V5(D) +5.3V 3.5A IC Drive Voltage of Logic Board Stand-by for Remote Control +12V 1.2A Vsamp +12V 1.5A Samsung Electronics...
Page 60 The board is designed using PFC circuit so that PF (Power Factor) can be over 0.95, because low PF can be a problem in high voltage power. (5) Protection The OCP (Over Current Protection), the OVP (Over voltage Protection), and the Short Circuit Protection functions are added against system malfunction. Samsung Electronics...
Page 61 Circuit Operation Description 5-1-2(D) PDP-PS-42 BLOCK DIAGRAM Samsung Electronics...
Page 62 In addition, surge current protection, insulation management, and static electricity protection circuit should be added, because it uses commercial power source as an input. PDP SMPS should be designed using auxiliary power and relay to provide remote control capability. Samsung Electronics...
Page 63 87.8W by Equation (1). Table 4 shows internal power loss as a function of output power for various power conversion efficiencies. η = η = η = Internal Power Loss ( W) η = η = Direct Current Output Power (W) Table 4. Power Conversion Efficiency vs. Internal Power Loss Samsung Electronics...
Page 64 ¤ Class C : Lighting devices ¤ Class D : Devices with special current waveforms Application Schedule : Except the devices less than rating input of 75W (1996~1999) Except the devices less than rating input of 50W (2000 and after) Samsung Electronics...
Page 65 Power stage for PDP can be designed using the lightweight SMPS feature. It is important to design SMPS considering system load, stability, and related international standards. Samsung Electronics...
Page 66 (i.e., the same state of wall and space electric discharges). The ramp reset discharge section, therefore, is important to secure the drive margin, and methods most widely used to date include wall voltage controlling by ramp pulse. Samsung Electronics...
Page 67 And, weak discharge is generated because of a small impressed voltage. Samsung Electronics...
Page 68 Circuit Operation Description 5-2-2 SPECIFICATION OF DRIVE PULSES 5-2-2(A) DRIVE PULSES 5-10 Samsung Electronics...
Page 69 5~6 times dis- charges, subject to variations depending on the structure and environment of electrodes. The purpose of impressing the initial sustaining pulses long is to obtain stable initial discharges and generate wall electric charges as much as possible. Samsung Electronics 5-11...
Page 70 Va pulse and scan pulse impressed on Y electrodes. It is in the form of COF, and a COF is equipped with 4 data drive IC’s (STMicroelectronics STV7610A with 96 outputs). For a single scan, 7 COF’s are required. 5-12 Samsung Electronics...
Page 71 Circuit Operation Description 5-2-3(B) DRIVING BOARD'S BLOCK DIAGRAM (1) Y POWER 220V 170V (2) X POWER 220V 170V Samsung Electronics 5-13...
Page 72 - For logic signaling buffer: 5V; and - For gate driver IC: 15V. 2) Generated by the internal DC/DC part - For generating Vw pulse: 180V. 2. Logic signal 1) Supplied from the logic board - Gate signals for FETs. 5-14 Samsung Electronics...
Page 73 G2, FET2 gets short-circuited, thereby causing GND to be outputted to output terminals. (2) With signal impressed on G1, FET1 gets short- circuited, and with no signal impressed on G2, FET2 gets open-circuited, thereby causing 180V to be outputted to output terminals. Samsung Electronics 5-15...
Page 74 Circuit Operation Description 5-2-3 (D) DRIVER CIRCUIT DIAGRAM 5-16 Samsung Electronics...
Page 75 Circuit Operation Description 5-2-3(E) DRIVER BOARD CONNECTOR LAYOUT Samsung Electronics 5-17...
Page 76 Circuit Operation Description 5-18 Samsung Electronics...
Page 77 Circuit Operation Description Samsung Electronics 5-19...
Page 78 Circuit Operation Description 5-20 Samsung Electronics...
Page 79 Circuit Operation Description Samsung Electronics 5-21...
Page 80 Circuit Operation Description 5-22 Samsung Electronics...
Page 81 Circuit Operation Description Samsung Electronics 5-23...
Page 82 Circuit Operation Description 5-24 Samsung Electronics...
Page 83 Circuit Operation Description Samsung Electronics 5-25...
Page 84 Circuit Operation Description 5-26 Samsung Electronics...
Page 85 Circuit Operation Description Samsung Electronics 5-27...
Page 86 Circuit Operation Description 5-28 Samsung Electronics...
Page 87 Circuit Operation Description Samsung Electronics 5-29...
Page 88 Circuit Operation Description 5-30 Samsung Electronics...
Page 89: Logic Part
Circuit Operation Description 5-3 Logic part 5-3-1 Logic Board Block diagram Samsung Electronics 5-31...
Page 90 E Buffer board Sends data signal and control signal to left-bottom COF. Buffer board F Buffer board Sends data signal and control signal to right-bottom COF. 5-3-1 (B) NAMES AND DESCRIPTION OF THE MAIN COMPONENTS OF THE LOGIC BOARD 5-32 Samsung Electronics...
Page 91 A connector to output address data and control signal to the E, F buffer board. A fuse connected to the power source (5V) input to the logic board. Power Fuse A connector to supply power (5V) with the logic board. Power Connector Samsung Electronics 5-33...
Page 92 & Set probe 1 of oscilloscope to trigger signal and connect it to the TP31 of the logic board. * Set the oscilloscope to 2ms/div. After adjusting probe 2 to 5V/div, check the output signal. ( After troubleshooting is complete, turn off the power supply and disconnect connector. 5-34 Samsung Electronics...
Page 93 IC2003 IC2013 GND2 CN02 IC2017 SW2001 TP13 GND5 LE01 LE02 Figure 1. Layout of the logic main board (2) Appearance and indication of connector Basically, it is depicted on the PCB exactly same as the real one. Samsung Electronics 5-35...
Page 94 3) Reset jumper setting (CN02) The CN02 connector of the logic main board should be set to Reset signal as the following figure shows. It is default setting and should not be changed. CN02 Figure 3. RESET JUMPER SETTING 5-36 Samsung Electronics...
Page 95 5) Jumper setting to select NTSC or PAL when internal pattern is selected (CN06) Switching between NTSC and PAL as following figure shows only works in internal pattern setting. Default setting is PAL mode. CN06 Select PAL Select NTSC Figure 4. Jumper setting to select internal or external pattern Samsung Electronics 5-37...
Page 96 IC2012 IC2003 IC2013 GND2 CN02 IC2017 SW2001 TP13 GND5 LE01 LE02 LE01 LE02 Figure 6. Connecting between the logic main board and the JIG board for examination GND5 TP13 Figure 7. Connecting probe 1 of the oscilloscope 5-38 Samsung Electronics...
Page 97 (or SMPS) to finish examination. & After all examinations are complete, perform as follows. - Reset the clock jumper to external clock. - Reset the internal/external pattern jumper to external pattern. - Reset the NTSC/PAL mode jumper to PAL mode. Samsung Electronics 5-39...
Page 98 Circuit Operation Description Board Waveform Test 1. Check the waveform after pointing Probe2 at IC2005 pins 1, 72. 2. Check the waveform after pointing Probe2 at IC2006 pins 1, 72. 5-40 Samsung Electronics...
Page 99 Circuit Operation Description 3. Check the waveform after pointing Probe2 at IC2007 pins 1, 81. 4. Check the waveform after pointing Probe2 at IC2008 pins 1, 81. Samsung Electronics 5-41...
Page 100 5. Point Probe2 at LY1 pin30 (F2016 pin8 (LE-Y) on the logic main board) on the jig board. (F2016: Array resistor) 6. Point Probe2 at LY1 pin28 (F2016 pin7 (STB-Y) on the logic main board) on the jig board. 5-42 Samsung Electronics...
Page 101 Circuit Operation Description 7. Point Probe2 at LY1 pin25 (F2016 pin6 (TCS-Y) on the logic main board) on the jig board. 8. Point Probe2 at LY1 pin24 (F2016 pin5 (CLK-Y) on the logic main board) on the jig board. Samsung Electronics 5-43...
Page 102 Circuit Operation Description 9. Point Probe2 at LY1 pin21 (F2012 pin8 (SIB) on the logic main board) on the jig board. 10. Point Probe2 at LY1 pin20 (F2012 pin7 (SIA) on the logic main board) on the jig board. 5-44 Samsung Electronics...
Page 103 Circuit Operation Description 10. Point Probe2 at LY1 pin20 (F2012 pin7 (SIA) on the logic main board) on the jig board. 10. Point Probe2 at LY1 pin20 (F2012 pin7 (SIA) on the logic main board) on the jig board. Samsung Electronics 5-45...
Page 104 Circuit Operation Description 13. Point Probe2 at LY1 pin10 (F2010 pin7 (YFR) on the logic main board) on the jig board. 14. Point Probe2 at LY1 pin9 (F2010 pin8 (YP) on the logic main board) on the jig board. 5-46 Samsung Electronics...
Page 105 Circuit Operation Description 15. Point Probe2 at LY1 pin8 (F2010 pin6 (YRR) on the logic main board) on the jig board. 16. Point Probe2 at LY1 pin5 (F2010 pin5 (YG) on the logic main board) on the jig board. Samsung Electronics 5-47...
Page 106 Circuit Operation Description 17. Point Probe2 at LY1 pin4 (F2011 pin8 (YF) on the logic main board) on the jig board. 18. Point Probe2 at LY1 pin2 (F2011 pin7 (YR) on the logic main board) on the jig board. 5-48 Samsung Electronics...
Page 107 Circuit Operation Description 19. Point Probe2 at LY1 pin1 (F2011 pin7 (YS) on the logic main board) on the jig board. 20. Point Probe2 at LX1 pin2 (F2015 pin6 (XRR) on the logic main board) on the jig board. Samsung Electronics 5-49...
Page 108 Circuit Operation Description 21. Point Probe2 at LX1 pin4 (F2015 pin7 (XR) on the logic main board) on the jig board. 22. Point Probe2 at LX1 pin6 (F2015 pin8 (XS) on the logic main board) on the jig board. 5-50 Samsung Electronics...
Page 109 Circuit Operation Description 23. Point Probe2 at LX1 pin8 (F2014 pin5 (XF) on the logic main board) on the jig board. 24. Point Probe2 at LX1 pin10 (F2014 pin6 (XG) on the logic main board) on the jig board. Samsung Electronics 5-51...
Page 110 Pins 6 ~ 11, 14 ~ 19, 22 ~ 27, 30 ~ 32, 49 ~ 51, 54 ~ 59, 62 ~ 67, 70 ~ 75 26. Jig board U2 (LE02) Pins 6 ~ 11, 14 ~ 19, 22 ~ 27, 30 ~ 32, 49 ~ 51, 54 ~ 59, 62 ~ 67, 70 ~ 75 5-52 Samsung Electronics...
Page 111 Circuit Operation Description 27. Jig board U1 (LE01) Pins 39, 40, 41, 42 28. Jig board U2 (LE02) Pins 39, 40, 41, 42 Samsung Electronics 5-53...
Page 112 Circuit Operation Description 29. Jig board U1 (LE01) pin35 30. Jig board U1 (LE01) pin46 5-54 Samsung Electronics...
Page 113 Circuit Operation Description 31. Jig board U2 (LE02) pin35 32. Jig board U2 (LE02) pin46 Samsung Electronics 5-55...
Page 114: Block Diagram
Circuit Operation Description 5-4 Block Diagram 5-4-1 42” Monitor Scaler Block Diagram 5-56 Samsung Electronics...
Page 115 - It is the waveform when it is not connected to the panel. * You should check that a single scan waveform is outputted!!! Y output waveform (200us/div, 100V/div) * You should check that energy recovery software is in operation!!! Samsung Electronics 5-57...
Page 116 Circuit Operation Description r X output waveform - It is the waveform when it is not connected to the panel. X output waveform (200us/div, 100V/div) * You should check that energy recovery software is in operation!!! 5-58 Samsung Electronics...
Page 117 Circuit Operation Description 5-6 Main I/O signal pules and voltages 5-6-1 Signal Pulses of Image Board(Input Signal Conditions : 7 Color bar) Samsung Electronics 5-59...
Page 118 Circuit Operation Description 5-60 Samsung Electronics...
Page 119 Circuit Operation Description Samsung Electronics 5-61...
Page 120 Circuit Operation Description MEMO 5-62 Samsung Electronics...
Page 121 Anode where discharge of DC panel has little contribution to light output power. Back ground luminance : Referring to the panel luminance in off mode or black screen, in other words, luminance in the vicinity of the screen. Samsung Electronics 10-1...
Page 122 (x, y). Here x=X/(X+Y+Z), y=Y/(X+Y+Z). Method for colors, known as (u, v), where image colors are expressed in more even color dimension. Colors of matter are expressed as color coordinates pair (u, v). Here, u=4X/(X+15Y+3Z), y=6Y/(X+15Y+3Z). 10-2 Samsung Electronics...
Page 123 CL - ratio of white luminance to black luminance in white line against black screen of black line against white screen. n CR - the ratio of white luminance to black luminance. Samsung Electronics 10-3...
Page 124 Discharge electrode : Another term for sustained electrode. Discharge efficiency : Another term for gloss efficiency Discharge gap : The gap among sustained electrodes in discharge space of three-electrode plasma panel. Discharge slit : (Refer to discharge gap) 10-4 Samsung Electronics...
Page 125 Refer to luminous efficacy. Energy recovery circuit : Circuit degauss caught after reusing the power that drove AC plasma panel. Erase : Process where cells are erased from AC plasma panel. Erase pulse : Cell erasing waveform Samsung Electronics 10-5...
Page 126 The range of luminance acquired when displayed from black to white. High strain point glass : Glass of which strain point (temperature with viscosity of 1014.5 poise) is relatively high Image retention : Continuous existence of image after the stimulation is removed. 10-6 Samsung Electronics...
Page 127 Plasma display panel made up of matrix with rows and columns. Matrix type : Refer to matrix PDP Maximum firing voltage : Voltage value required for triggering discharge in all cells. Maximum sustain voltage : Maximum drive voltage required not to turn off the cells. Samsung Electronics 10-7...
Page 128 Opposed discharge PDP : (Refer to opposed discharge.) Peak luminance : Maximum luminance generated in one pixel in panel. Peak luminance enhancement : Circuit and drive technology that accommodates increasing peak luminance. 10-8 Samsung Electronics...
Page 129 Rear substrate : Efficiency measurement that is directly expressed with the number of output particles against the number of input particles. In case of plasma panel, the number of photons in visible area, generated from photons in ultraviolet area Samsung Electronics 10-9...
Page 130 Plasma display in the form where stimulating discharge occurs for discharge process precedes below panel. Self-scan type PDP : Plasma display in the form where stimulating discharge occurs for discharge process precedes below panel. Self-shift type PDP : Process of combining substrates. High temperature process that melts solder glass combining substrates. 10-10 Samsung Electronics...
Page 131 Data electrodes in opposite substrates provide unique writing and erasing signals to each cell Time modulation driving method (Other terms: time division multiplex method) : Modulation method in proportion to certain time applied to stimulation with regular output. Output strength is changed according to input time. Samsung Electronics 10-11...
Page 132 Curve expressed with wall transfer that is caused by any changes in electric charges including wall charges and wall charge pulse related parameters. White back : White coating for minimize absorbing valid gloss, located black contrast improvement layer and fluores- cent material. Write electrode : (Refer to data electrode.) 10-12 Samsung Electronics...
Page 133 Glossary Write electrode : (Refer to data electrode)[symbol : Pw] Write electrode : (Refer to data electrode)[symbol : Vw] Samsung Electronics 10-13...
Page 134 MEMO 10-14 Samsung Electronics...
Page 135: Front Panel
9-1-1(A) PDP(Plasma Disply Panel) Front Panel Speakers POWER SOURCE , MENU, Remote Control Signal Receiver VOLUME (-,+), SELECT Press to turn Aim the remote control towards this spot on the PDP on the Monitor. (t,s), MUTE and off. Samsung Electronics...
Page 136: Rear Panel
DVD players or DTV receivers. Connect the included power cord. ¨ Video Input jack Connect a video signal from external sources like VCRs or DVD players. ˆ S-Video Input jack Connect a S-Video signal from an S-VHS VCRs or DVD players. Samsung Electronics...
Page 137: Remote Control
Use to highlight on-screen menu items and change menu values. Ò Still button Press to pause the current screen. Ú PIP button Activates picture in picture. Æ Source selection buttons Press to directly select Video, S-Video, Component1, Component2 or PC(RGB). Samsung Electronics...
Page 138: Vcr Control Buttons
Auto Adjust Scaling Zoom/Pan ¸ S.Mode button Adjust the PDP sound by selecting one of the preset factory settings (or select your personal, customized sound settings.) ˛ Sleep button Press to select a preset time interval for automatic shutoff. Samsung Electronics...
Page 139: Wall Mount
Near high voltage cables. l Around heating apparatus. 3. Install the PDP considering the construction of the wall. 4. Use only recommended parts and components for installation. 9-2-2 Parts(wall attachment panel is sold separately.) 34.61 inches Fixing bolt Insulation rubber Samsung Electronics...
Page 140 When the angle has When the panel hasn’t been set to 5 degrees. been set to15 degrees. been tilted. Angle control holes 5 degrees of tilt 10 degrees of tilt 15 degrees of tilt No tilt 20 degrees of tilt Samsung Electronics...
Page 141 (Do not lift the display with any pressure. The insulation rubber at the top may be taken off.)v Samsung Electronics...
Page 142 Lift the display and separate the insulation rubber point from the groove on top of the wall attachment panel. Samsung Electronics...

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