Samsung LE32A55*P Service Manual page 163

Level Location No.
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 JA3102 3701-001367
....4 JA3103 3701-001367
....4 CN330 3711-005925
....4 T0077 BN41-00974A
....4 M0018 BN97-02049A
.....5 IC115 1107-001415
....4 M0018 BN97-02049B
.....5 IC520 0903-001552
....4 M0018 BN97-02049C
.....5 IC115 1107-001415
....4 R110 2007-000070
....4 R110 2007-000070
....4 R110 2007-000070
....4 R110 2007-000070
....4 R110 2007-000070
....4 R110 2007-007001
....4 C120 2203-000440
....4 C120 2203-000440
....4 C6151_OP 2402-001259
....4 C2160 2402-001273
....4 C1140 2409-001118
....4 C5521 2409-001118
....4 C5522 2409-001118
....4 CN330 3711-006374
....4 IC104 0801-002633
....4 IC104 0801-002633
....4 IC104 0801-002633
....4 IC104 0801-002633
....4 R110 2007-002425
....4 R110 2007-002425
....4 R110 2007-002425
....4 R110 2007-002425
....4 R110 2007-002425
....4 R110 2007-002425
....4 C120 2203-006158
....4 C1207 2402-001238
...3 T0603 BN63-04510A
...3 T0603 BN63-04512A
...3 SUB09_MTK BN73-00024B
...3 SUB10_FBE BN73-00176A
Code No.
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
CONNECTOR-HDMI;19P,2R,FEMALE,SMD,AU
CONNECTOR-HDMI;19P,2R,FEMALE,SMD,AU
HEADER-BOARD TO CABLE;BOX,51P,1R,0.5mm,S
PCB MAIN;Amber,FR-4,4,1.0,192*240,1
ASSY MICOM;T-PRLPEUMD,N46A,2007.11.26,11
IC-FLASH MEMORY;29W320D,4Mx8/2Mx16Bit,TS
ASSY MICOM;T-PRLPEUS,N46A,2007.11.26,090
IC-MICROCONTROLLER;WT61P8-RG480WT,LQFP,4
ASSY MICOM;T-PERLDEUC,N46A,2007.11.26,11
IC-FLASH MEMORY;29W320D,4Mx8/2Mx16Bit,TS
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;3.9KOHM,5%,1/16W,TP,1005
C-CER,CHIP;1nF,10%,50V,X7R,1608
C-CER,CHIP;1nF,10%,50V,X7R,1608
C-AL,SMD;220uF,20%,16V,WT,REEL,8X10
C-AL,SMD;220uF,20%,35V,WT,REEL,10X10mm
C-POLYMER ,CHIP;47uF,-+20,10V,WT,REEL,3.
C-POLYMER ,CHIP;47uF,-+20,10V,WT,REEL,3.
C-POLYMER ,CHIP;47uF,-+20,10V,WT,REEL,3.
HEADER-BOARD TO CABLE;BOX,41P,2R,1.25mm,
IC-CMOS LOGIC;7WBD3125,2bit BUS SWITCH,S
IC-CMOS LOGIC;7WBD3125,2bit BUS SWITCH,S
IC-CMOS LOGIC;7WBD3125,2bit BUS SWITCH,S
IC-CMOS LOGIC;7WBD3125,2bit BUS SWITCH,S
R-CHIP;1ohm,5%,1/10W,TP,1608
R-CHIP;1ohm,5%,1/10W,TP,1608
R-CHIP;1ohm,5%,1/10W,TP,1608
R-CHIP;1ohm,5%,1/10W,TP,1608
R-CHIP;1ohm,5%,1/10W,TP,1608
R-CHIP;1ohm,5%,1/10W,TP,1608
C-CER,CHIP;100nF,10%,16V,X7R,1005
C-AL,SMD;1uF,20%,50V,HR,TP,4.3x4.3x5.2mm
SHIELD-PCB MAIN;PEARL32, EO,TOP,SPTE,T0.
SHIELD-PCB MAIN;PEARL32,EO,BOT,SPTE T0.3
SILICON/RUBBER-GAP PAD;POSEIDON,SILICON,
SILICON/RUBBER-GAPPAD;EDISON 24,SILICON+
Description & Specification
5. Exploded View & Part List
Q'ty SA/SNA Remark
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.A
1 S.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.A
1 S.N.A
1 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.N.A
1 S.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.A
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