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Philips Semiconductors
Video modulator circuit
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
L
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
1
UNIT
max.
min.
mm
4.2
0.51
inches
0.17
0.020
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT97-1
March 1986
D
Z
b
1
e
b
8
5
pin 1 index
1
4
A
2
b
b
b
1
2
max.
1.73
0.53
1.07
3.2
1.14
0.38
0.89
0.068
0.021
0.042
0.13
0.045
0.015
0.035
REFERENCES
IEC
JEDEC
050G01
MO-001AN
A
2
A
A
1
w
M
b
2
E
0
5
scale
(1)
(1)
c
D
E
0.36
9.8
6.48
0.23
9.2
6.20
0.014
0.39
0.26
0.009
0.36
0.24
EIAJ
7
M
E
c
(e )
1
M
H
10 mm
e
e
L
M
1
E
3.60
8.25
2.54
7.62
3.05
7.80
0.14
0.32
0.10
0.30
0.12
0.31
EUROPEAN
PROJECTION
Product specification
TDA6800
TDA6800T
SOT97-1
(1)
Z
M
w
H
max.
10.0
0.254
1.15
8.3
0.39
0.01
0.045
0.33
ISSUE DATE
92-11-17
95-02-04
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